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Industry Application

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How to Select Potting Compound for Solenoid Valves: ELAPLUS EP 2025FR: UL 94 V-0 Flame-Retardant Solution with High Bonding Reliability

2026-05-18

In the field of modern precision electronics manufacturing, the stability of solenoid valves, motors, and automotive electronic components directly determines the service life of end products. However, equipment often operates under harsh conditions including high temperatures, vibration, moisture, and chemical corrosion. How to achieve high‑level insulation protection, prevent encapsulation cracking, and ensure strong adhesion to multi‑substrate assemblies? As a professional manufacturer focused on functional materials, ELAPLUS (Shanghai) Co., Ltd. has launched the high‑performance epoxy potting system — EP 2025FR to address industry pain points. This article analyzes the application advantages of this product in solenoid valves and complex electronic components, and explains how it solves industry challenges through technological innovation. Industry Pain Points: Why Do Solenoid & Motor Potting Failures Occur? Engineers often face three core challenges in potting solenoid valves and motors: 1. Adhesion Failure Solenoid valves contain diverse substrates: magnet wires, iron cores, plastic bobbins, and metal housings. Conventional potting compounds fail to deliver strong, consistent bonding to all these materials. Once interfacial delamination occurs, moisture penetrates and causes insulation failure. 2. Thermal Stress Cracking Electronic devices undergo thermal cycling during operation. If the coefficient of thermal expansion (CTE) of the potting gel is too high, large internal stress from shrinkage mismatch can crack the gel or damage delicate internal components. 3. Flame Retardancy & Environmental Compliance With stricter global regulations (UL, RoHS), high‑performance potting compounds must meet UL 94 V‑0 flame‑retardant standards while being solvent‑free. Solution: Technical Features of ELAPLUS EP 2025FR EP 2025FR is a two‑component, solvent‑free, room‑temperature curable epoxy potting compound. Its specially optimized formula provides superior protection and process compatibility. 1.Excellent Multi‑Substrate Adhesion EP 2025FR delivers enhanced adhesion to magnet wires, iron, most plastics, and metals. This universal bonding creates a fully sealed structure inside potted solenoid valves, greatly improving water resistance, moisture resistance,…

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How to Choose Electronic Potting Compounds? ELAPLUS – A 10,000-Ton-Class Electronic Adhesive Manufacturer Providing One-Stop Solutions

2026-05-13

Against the backdrop of rapid development in new energy vehicles, photovoltaic energy storage, and 5G communications, electronic potting compounds, as critical materials that protect electronic components from moisture, vibration, and chemical corrosion, are embracing unprecedented industrial opportunities. Industry data shows that the global electronic potting and encapsulation market size is expected to reach USD 2.82 billion in 2026 and exceed USD 6.4 billion by 2035, with a compound annual growth rate (CAGR) of up to 9.6%. In this track, ELAPLUS® (Elaplus Functional Materials (Shanghai) Co., Ltd.), adhering to the brand philosophy of “Bonding Everything, Adhering to the Future”, has long been engaged in the electronic adhesive field and provides global customers with full-scenario solutions ranging from motor potting compounds, sensor potting compounds, and power supply potting compounds to thermal interface materials. Three Major Trends in the Electronic Potting Compound Industry Forcing Supply Chain Upgrades Currently, the electronic potting compound industry is undergoing three transformations: First, the accelerated penetration of 800V high-voltage platforms in new energy vehicles has raised higher requirements for the insulation strength and thermal conductivity of potting materials. It is estimated that from 2024 to 2026, the CAGR of vehicle-grade thermal conductive potting compound demand will reach 28.5%. Second, domestic substitution is accelerating in an all-round way. Under the considerations of tariff restructuring and supply chain security, the localization rate of electronic adhesives has rapidly climbed from 31% in 2024 to 44% in 2026. Chinese enterprises, leveraging their technological accumulation and production capacity advantages, are competing strongly with foreign-funded enterprises in the mid-to-high-end market. Third, the trend of multi-functional integration is obvious. Potting compounds with a single protective function can no longer meet demands, and composite materials with thermal conductivity, flame retardancy, low stress, fast curing, and other characteristics are becoming mainstream. It is at the intersection of these…

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ELAPLUS SIPC 2150: Industrial Wire Harness Silicone Reinforcement & Potting Fixing Solution

2026-05-12

In industrial wire harness processing, bonding and fixing of silicone wires have long been a technical challenge. Due to silicone’s low surface energy, ordinary adhesives fail to bond firmly. Meanwhile, wire harnesses endure tension, bending, high temperature and high humidity under harsh working conditions, placing high demands on adhesive reliability. To solve industry pain points such as insufficient bonding strength, yellowing at high temperature and failed tension tests, ELAPLUS SIPC 2150 is developed as a neutral alcohol-free bonding & sealing silicone adhesive. Two Core Criteria for Industrial Harness Fixing In wire harness potting and reinforcement processes, high-performance adhesives must meet two critical criteria. 1.Over 30N Tensile Resistance Formulated with a special titanate catalytic system, SIPC 2150 forms strong chemical bonding with silicone materials after curing. It easily passes tensile testing above 30N and prevents component detachment under frequent bending and pulling. 2. Dual 85 Aging Resistance After 500 hours aging under 85℃ & 85% RH environment, ordinary adhesives become brittle and yellow severely. SIPC 2150 remains highly transparent with no yellowing, ensuring long-term stable operation and safety. ELAPLUS SIPC 2150: Full-spectrum Performance All-rounder Beyond optimized formulation for silicone substrates, SIPC 2150 also delivers the following premium performance highlights: 1.Wide Compatibility Excellent adhesion to silicone, PC, PA engineering plastics, aluminum, stainless steel, EVA foam and wood. 2.Extreme Temperature Resistance Operating range: -60℃ ~ 260℃, stable performance for outdoor cold-region equipment and high-temperature cabin applications. 3.Insulation & Corrosion Protection Superior electrical insulation and anti-corona performance; resistant to engine oil, acid and alkali. Service life up to 20–30 years for permanent bonding and fixation. 4.Eco-friendly & Global Compliance Low odor, low volatility and no fogging. Compliant with UL HB flame retardant rating (File No. E547224), meeting international export standards. Application Scenarios ■Industrial automation: Sensor interface reinforcement & signal wire fixing ■New energy vehicles:…

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Geomagnetic Sensor Potting Adhesive | PUR 1661 Polyurethane Potting Compound – Waterproof Solution for Parking Spaces & Traffic Lights

2026-05-09

In the wave of smart city construction, geomagnetic sensors act as the perception nerve of intelligent transportation systems and play an increasingly critical role. Whether for intelligent billing of roadside parking spaces or intelligent timing control of traffic lights, geomagnetic sensors continuously collect data to support the intelligent operation of cities. However, these precision outdoor devices face severe challenges: How to equip these “behind-the-scenes heroes” with a sturdy protective shield? ELAPLUS PUR 1661 two-component polyurethane potting compound is specially developed to solve all these pain points. 1. Industry Pain Points & Challenges for Geomagnetic Sensors 1.1 Typical Application Scenarios Application Scenario Functional Requirement Typical Product Roadside Parking Space Parking occupancy detection & contactless payment Parking Detector Traffic Light Control Vehicle arrival detection & intelligent timing Vehicle Detector Smart Parking Lot Parking guidance & reverse car searching Space Detector Highway Traffic flow statistics & event detection Traffic Detector 1.2 Core Requirements for Potting Materials Core Requirement Specific Demand Performance Standard Fast Curing Limited on-site construction time Open time adjustable: 2~25 min High Strength Resist vehicle rolling pressure Hardness: Shore A67 Water & Moisture Resistance Block water penetration Extremely low water absorption Weather Resistance Long-term outdoor service Excellent weatherability Low-temperature Performance Stable operation in cold regions Superior low-temperature toughness Electrical Insulation Protect internal circuits Outstanding insulation performance Easy Application Convenient outdoor operation Pouch packaging & low viscosity 2. Solution: PUR 1661 Polyurethane Potting Compound 2.1 Product Introduction PUR 1661 is a two-component polyurethane potting material developed by ELAPLUS, customized for geomagnetic sensors and other outdoor electronic devices. 2.2 Six Core Advantages Advantage Description Fast Curing Open time optional from 2 to 25 min, adaptable to different construction schedules High Hardness Shore A67 hardness, no deformation under frequent vehicle rolling Pouch Packaging Easy for outdoor use, no complicated equipment required Low Viscosity Good fluidity and…

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Elaplus SIPC UV 3301: High-efficiency Silicone Conformal Coating Solution for PCB

2026-05-09

In the electronic manufacturing industry, the reliability of printed circuit boards (PCB) is the lifeline of electronic products. As electronic devices trend toward miniaturization and high integration, components on PCBs become increasingly densely arranged, making traditional single-cure conformal coatings face severe limitations. Conformal Coating for Gas Flow Meter One of the biggest challenges for engineers is shadow area curing dead zones. When UV light is blocked by tall components, the coating in shaded areas cannot cure completely, resulting in failed protection, short circuits, and even equipment corrosion. Today, we introduce Elaplus SIPC UV 3301, a UV/moisture dual-cure silicone conformal coating, and how it perfectly solves this industry pain point. I. Core Principle: Dual Curing Mechanism The key advantage of SIPC UV 3301 lies in its dual-protection curing design: Under UV irradiation at 300 mW/cm², the surface coating cures fully within 10 seconds to a tack-free state, greatly improving production line efficiency and throughput. 2.Moisture Secondary Curing (Full Shadow Cure) For shadow areas unreachable by UV light — such as component bottoms and pin gaps — the material absorbs atmospheric moisture to complete secondary curing. This mechanism ensures a tough elastic film forms in every gap of the PCB, completely eliminating risks caused by uncured residue. II. Extreme Temperature Resistance: -55℃ to 200℃ For automotive electronics, aerospace, and industrial automation equipment, drastic ambient temperature fluctuations are common operating conditions. SIPC UV 3301 delivers outstanding thermal stability: III. Excellent Electrical & Mechanical Properties SIPC UV 3301 excels in protective performance:Dielectric strength > 18 KV/mm, volume resistivity up to 3.5×10¹³ Ω·cm, providing reliable insulation protection under high-voltage working conditions. It also offers excellent shear adhesion to metals, glass, and various plastics including PC, ABS and PBT. Premium Applications: New Energy & High-end Manufacturing With its wide operating temperature range of -55℃ to 200℃,…

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SIGEL 1875 Self-Healing Silicone Gel Potting Solution for MAF Sensor

2026-05-08

In automotive electronic systems, the Mass Air Flow (MAF) sensor can be regarded as the engine’s respiratory monitor. It real-time measures the intake air flow and provides critical data for the ECU to precisely calculate fuel injection quantity. Once this precision component fails due to moisture ingress, thermal shock or mechanical stress, it will lead to increased fuel consumption and reduced power at the mild level; in severe cases, it triggers the engine warning light or even vehicle breakdown. However, many engineers overlook a core point during material selection: the performance of potting material directly determines the service life limit of the sensor. Four Major Technical Challenges for MAF Sensor Potting The operating environment of MAF sensors is far harsher than imagined. Under the hood, temperature fluctuates drastically from -40℃ to 150℃, accompanied by multiple hazards such as oil vapor, road salt spray and high-pressure water washing. This sets stringent requirements for potting materials: 1. High-level Sealing & Protection Moisture is the top killer of sensor circuits. Even tiny water vapor penetration will cause signal drift, corrosion and short circuit. 2. Excellent Thermal Shock Resistance Traditional rigid potting compounds easily generate internal stress under temperature cycling. Long-term stress may cause solder joint cracking or encapsulation delamination. 3. Critical Stress Buffering Capacity The internal MEMS chips and precision resistor networks of sensors are extremely sensitive to mechanical stress. The potting material must possess sufficient flexibility to absorb vibration and impact. 4. Uncompromised Long-Term Reliability The material must not experience oil bleeding, yellowing or hardening during long-term service; otherwise, sensor signal accuracy and response speed will be directly affected. SIGEL 1875: Self-Healing Silicone Gel Specially Developed for High-Reliability Sensor Encapsulation To address the above challenges, ELAPLUS launches SIGEL 1875 transparent two-component self-healing silicone gel. With fundamental innovation in material science, it delivers…

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5mm Full Depth Curing!ELAPLUS UV1020: Redefining the Performance Peak of White UV Dynamic Balancing Adhesives

2026-05-07

UV-curing adhesives have long been a key tool for improving production line efficiency in precision rotating component manufacturing, motor rotor dynamic balancing, and sensor packaging, thanks to their second-level curing speed. However, the industry has long faced a tough technical pain point: the “incomplete curing” issue of white/thick-layer UV adhesives. When the adhesive layer exceeds 3mm, traditional white UV adhesives often suffer from surface hardening but residual soft adhesive at the bottom. This not only causes a sharp drop in bonding strength but also hides quality risks such as falling off and imbalance for long-term product operation. Today, ELAPLUS officially launches UV1020 UV curable acrylic dynamic balancing adhesive. With its breakthrough deep-layer curing technology, it completely breaks the performance bottleneck of thick-layer white UV adhesives, becoming a veritable “top-tier” product in industrial applications. I. Core Pain Point: Why Do Thick-Layer White UV Adhesives Cure Incompletely? In the field of UV curing, curing depth depends on energy density and optical transmittance. To achieve visual opacity, traditional white UV adhesives are usually formulated with high-concentration light-shielding fillers (such as titanium dioxide). These fillers block visible light, while also strongly scattering and absorbing UV light. As a result, UV light cannot penetrate deeper than 3mm, failing to activate the photoinitiator at the bottom layer. For high-precision balanced motor rotors or thick-layer packaged sensors, this incomplete curing directly leads to bonding failure. II. Technical Breakthrough: 20000mJ/cm² Energy Input, Unlocking the 5mm Curing Limit The success of ELAPLUS UV1020 stems from in-depth insights into “energy for depth” and “optical system reconstruction”: High-Energy Curing SystemUV1020 recommends a curing energy of 20000mJ/cm² (based on 365nm LED light source), which is 2-4 times that of ordinary UV adhesives. Coupled with an optimized photoinitiator formula, it ensures thorough free radical reaction at the bottom layer even at a thickness…

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Repairable Silicone Gel for Cable Junction Box Potting: In-depth Analysis of SIGEL 1805 & SIGEL 3078

2026-05-06

In power transmission, communication infrastructure and industrial automation industries, cable junction boxes are core components for connecting and protecting cable joints. Their waterproof, moisture-proof and weather resistance directly determine the operational reliability of the entire system. Traditional potting materials have obvious application drawbacks: non-repairable after curing, failure prone to moisture, narrow temperature resistance range, etc. These issues raise maintenance costs and bring potential safety risks. ELAPLUS launches two repairable silicone gels, SIGEL 1805 and SIGEL 3078. Featuring premium performance and easy repairability, they deliver an innovative technical solution for cable junction box potting. Ⅰ. Industry Pain Points of Traditional Potting Materials 1. Core Requirements for Cable Junction Box Potting Core Demand Specific Requirement Performance Index Waterproof & Moisture-proof Block moisture intrusion and protect electrical connections Low oil bleeding, high dielectric strength Electrical Insulation Stable operation under high voltage Dielectric strength ≥25kV/mm Weather Resistance Long-term outdoor anti-aging Operating temperature: -60~200℃ Stress Buffering Relieve thermal stress and mechanical vibration High elasticity, low hardness Repairability Convenient later maintenance & cost saving Easy-to-remove gel state 2. Drawbacks of Traditional Materials Drawbacks Specific Performance Resulting Problems Non-repairable curing Rigid materials like epoxy resin cannot be removed without damaging components leading to high maintenance costs.  Oil bleeding & contamination Severe oil bleeding pollutes terminal blocks increases contact resistance and impairs electrical performance. Narrow temperature resistance Softens at high temperature and cracks at low temperature failing in extreme outdoor conditions Overly strong adhesion Firm bonding with substrates causes component damage during repair 3. Advantages of Silicone Gel    ※Soft gel state after curing to eliminate mechanical stress ※Repairable design for easy removal without component damage ※Ultra-low oil bleeding to avoid metal contact contamination ※Wide temperature tolerance: -60℃ ~ 200℃ for harsh environments ※Superior dielectric strength for reliable high-voltage protection Ⅱ. Product Introduction 1. SIGEL 1805 Two-component Silicone Gel Product Positioning SIGEL 1805 is a…

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AI-Driven Computing Leap: How ELAPLUS Solves 1.6T Optical Module Thermal Challenges with High-Performance TIM Solutions

2026-04-27

Driven by the AI and large language model revolution, global data centers are experiencing an unprecedented computing power arms race. As the “capillaries” supporting massive data transmission, high-speed optical communication modules are evolving at an unprecedented pace. As transmission rates advance from 100G to 800G/1.6T, optical module power consumption has surged from 3W to over 15W. With exponentially increasing heat density per unit volume, thermal design is no longer a simple auxiliary feature but a critical technical bottleneck determining module performance, stability and reliability. 01 What Causes Thermal Failure? The “heart” of an optical module is its internal TOSA (Transmitter Optical Sub-Assembly) and ROSA (Receiver Optical Sub-Assembly) components. Chip power consumption grows exponentially with transmission rates: a typical 100G module consumes about 3W, while 800G modules have reached 12-15W, and 1.6T modules are heading toward over 20W. 800G Optical Module Power Consumption: 12~15W 4-5 times that of the 100G era · Thermal management solutions must evolve in tandem In practical applications, thermal failure stems from multiple dimensions. 02 ELAPLUS Thermal Management Solutions Product Categories Model Feature Thermal Gel One-component curable 3100# 250um BLT, 10.2W/m-K，Low Volatility 3380# 250um BLT,8.4W/m-K，Low Volatility 3365# 100um BLT, 6.2W/m-K，Low Volatility 3335# 60um BLT, 3.5W/m-K One-component pre-cured TCMP 80#\100# 250um BLT, 8.5/10.0W/m-K，Low Volatility Two-component curable TCMP 1980# 200um BLT8.5W/m-K, shore 00 30 Thermal Pad GP 60 SF 6.0W/m-K, shore 00 55，Non-silicone Thermal Pad TCMP 130# 13W/m-K, Silicone Thermal Pad In the AI era where computing power defines competitiveness, every iteration of optical communication technology pushes the boundaries of physics. ELAPLUS upholds the brand spirit of “keeping chasing forever,” providing not just materials but comprehensive thermal management system solutions tailored to real-world scenarios for global ICT enterprises. Through continuous materials science innovation, ELAPLUS is empowering partners to break through thermal bottlenecks, enabling every beam of light to connect the future of the intelligent world at lower temperatures and higher efficiency.

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