Color: A:Black liquid; B:Light yellow liquid
Viscosity(25°c,m Pa·with): A:40,000+10,000;B:100+50
Appication: tis suitable for packagqing protection of products with hioh themal conductity requirementsinmotors, automotive electonics. oertools reactors.and instrumenis. and has excelent adhesion ai
temperature resistance.
Product Description: 6220 epoxy adhesive is a room temperature/heat curing resin adhesive. This two-component adhesive is designed for metal bonding, SMC fiberglass parts bonding, aluminum honeycomb panel splicing, motor product iron core bonding, ceramic membrane component sealing, soft magnetic unit potting, high temperature resistant sensor potting, etc. Feature: 1.Resistant to moisture, dirt and other atmospheric components2.High strength, excellent adhesion3.Good anti-pollution, low surface pretreatment requirements4.No solvent, no curing by-products5.Excellent high and low temperature resistance, -50℃-150℃6.Resistant to transformer oil, low attenuation7.Good adhesion to glass fiber cloth and steel plate
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Product descriptionEP 6108 series is a two-component solvent-free ambient curable epoxy structural adhesive with low viscosity, high hardness, chemical resistance and mechanical properties. Feature:Low viscosity, good toughnessHigh transparency, no wrinkles on the surfaceExcellent electrical insulation and stabilityGood waterproof and moisture-proofOperating temperature range -40-120 °C
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Product descriptionEP 6118 Grey Epoxy Structural Encapsulant is an epoxy adhesive with fast chamber curing speed.This two-component epoxy adhesive is designed to bond ceramics, metals, glass, plastics, rubber, paper, cloth and other products.EP 6118 grey epoxy structural potting adhesive cures without heating. After thoroughlymixing the A and B components with 3:1 (weight ratio or volume ratio), the product has a long operating time of 2 hours, good foaming, and forms a gray hard protective layer after curing. Feature1.Resistant to moisture, dirt and other atmospheric components2.High strength, excellent adhesion3.Good anti-pollution and low surface pretreatment requirements4.No solvents, no curing by-products5.Stable mechanical and electrical properties between -5 0-120°C6.It has good adhesion to plastic PC, glass fiber and steel plate
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Product Description: EP 6112 is a two-component solvent-less, room temperature curing epoxy potting material for automotive, automotive electronics, power tools, reactors, instruments with high thermal conductivity requirements of the product package protection, and has excellent adhesion and heat resistance. FEATURES1.Heat curing will bring high heat resistance2. Excellent adhesion, anti-cracking3.Low CTE linear expansion coefficient4. Having a high thermal conductivity5.Excellent electrical insulation, stability6. UL approved，yellow card number is E3401997.Very low water absorption, good waterproof, moisture resistance
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Product Description: EP 6688 epoxy encapsulant is one component epoxy adhesive cured by heat, designed for general structure adhesive applications.The cured material can provide excellent shear strength, along with impact and heat resistance. It ‘s designed for protection of bare semiconductor devices. BGA, IC memory cards, Chip carriers, Hybrid circuits, Chip-on-board, Multi-chip modules and Pin grid arrays , Automotive applications. Feature: One component ,solvent freeEasy to handlingLow stressNo Halogenlow VOC, low odorHigh shear and impact strengthHigh temperature resistanceExcellent outing agingExcellent electrical insulationGood moisture resistanceExhibits relatively high flow
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This compound can be cured by room temperature, the curing process is low temperature,low shrinkage rate.Solid surface light, not cracking, moisture proof, insulation Feature Application Used for general electronic components filling and sealing of circuit boards.Room temperature can be cured, the curing process is low temperature, low shrinkage rate. Solid surface light, not cracking, moisture proof, insulation. Item Unit Standards Typical Value Color – Visual inspection transparent Viscosity 25℃, mPa·s GB/T 10247-2008 200±50 Tack-free time 25℃, 55%RH,min GB/T13477-2002 20-40 Density 25℃, g/cm3 ASTM D792 0.85±0.05 Tensile Strength MPa GB/T 528-2009 38 Elongation at break % GB/T 528-2009 200 Thermal Conductivity W/m.K GB/T 10297-1998 0.247 T-peel strength， T-Peel N/mm，Sandblasted Iron(1mm), Fe-Fe，170℃ 20min —— 8.31
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EP 6113A/B is a two-component solvent-free, room temperature curing epoxy potting material, which is suitable for packaging and protection of products with high thermal conductivity requirements in motors, automotive electronics, power tools, reactors, and meters, and has excellent adhesion and temperature resistance.
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Viscosity (25℃, mPa·s) : A: 70,000±20,000 (4#/5rpm); B:45±15 (1#/60rpm); Density (25℃, g/cm3) : A:1.77; B:1.21; Hardness (Shore D, 25℃) : 90±5 (after mixed curing); Thermal conductivity (W/m.k) : 0.7 (after mixed curing);
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