ELAPLUS provides silicone potting adhesive, epoxy potting adhesive, polyurethane potting adhesive, sealant, thermal material, thermal gel, conformal coating adhesive and other electronic adhesives
Color: Transparent;
Viscosity (25 ℃ mPa · s): 200 ± 50;
Density (25 ℃ g/cm3): 0.85 ± 0.05;
Appearance: Transparent
Type: two-component
Application: Used in power semiconductors, electronic sensors, automotive ECU integrated modules and other packaging protection IC chips, undersea fiber pottage and so on.
Color: A:Black liquid; B:Light yellow liquid
Viscosity(25°c,m Pa·with): A:40,000+10,000;B:100+50
Appication: tis suitable for packagqing protection of products with hioh themal conductity requirementsinmotors, automotive electonics. oertools reactors.and instrumenis. and has excelent adhesion ai
temperature resistance.
Product Description RTV SIPC 9338 neutral dealcoholized silicone adhesive sealant is a fluid hygroscopic curing silicone. After curing, it forms a flexible rubber body, which fully complies with the requirements of the EU ROHS directive. Alcohol substances are released during the curing process. It has no corrosion to materials such as polycarbonate (PC) and copper. It has good bonding and sealing properties for most materials, protecting electronic products in harsh conditions in a stable state. Feature: Application areas
More
Product introductionLiquid thermal gel gasket TCMP thermal conductivity 2.0 W/mK, double-packed, thixotropic low-stress application, liquid thermal gel gasket is designed to provide enhanced thermal management for advanced automotive batteries, automotive electronics, communication equipment, etc. , compared with traditional materials, it provides enhanced reliability and reworkability. Liquid thermal conductive gel gasket TCMP is a highly adaptable material that is easy to use and can eliminate assembly tolerances, making the components in production almost low compression force, protecting solder joints and other components. The liquid thermal gel gasket can be perfectly reworked and repaired, significantly reducing the overall cost. The automatically controlled feeding can significantly reduce waste, again reducing the overall cost. It is a two-component fast-curing liquid thermal gel gasket. , which can realize fully automated assembly an correspond to the thermal interface materials of Industry 4.0. Features
More
Product Description PUR 5110 A/B is a two-component solvent-free room temperature curing adhesive. Low odor, low VOC, in line with ROHS and REACH regulations. The process has wide operability and high physical properties of the finished product. It is suitable for machine dispensing and manual mixing operations; after curing, it has good adhesion, strong adhesion, excellent flexibility and elasticity, and good aging resistance and chemical resistance. Suitable for sealing and bonding various materials such as metal, plastic, rubber, polyester, etc. Feature
More
Product Description: SIPA 8230(7#) A/B is a two-component low-density silicone potting adhesive. It has good fluidity after mixing. The operation time can be adjusted according to the temperature. It can be deeply cured at room temperature. It is suitable for potting protection of various heat dissipation and temperature-resistant components. It fully complies with the EU ROHS directive and SVHC REACH requirements. Feature
More
Product Description:RTV SIPC9339 dealcoholized silicone adhesive sealant is a neutral silicone sealing material that absorbs moisture in the air and solidifies at room temperature.It is non-corrosive to materials and has good bonding and sealing properties for most plastics, metals and other materials, protecting electronic products in harsh conditions in a stable state. Feature:1 Excellent chemical resistance, low odor, good adhesion2 Low volatility not exceeding 500ppm, no corrosion and no fogging in a closed environment3 Resistant to moisture, dirt and other atmospheric components4 Reduce mechanical stress and tension caused by mechanical, thermal shock and vibration5 Excellent outdoor aging resistance, service life up to 20-30 years6 Stable mechanical and electrical properties between -60-200℃ Applications: Household appliances, construction machinery, photovoltaic module sealing, automotive lighting, LED bulbs, T-type lamps, PCB component fixing, bonding and sealing
More
Product Description EP 621 is a black, solvent-free, one-component epoxy structural adhesive. This product has good toughness and impact strength. When it is fully cured by heat, it can provide excellent bonding performance, electrical properties, moisture resistance and mechanical properties. It has high bonding strength to most substrates including glass, metal, ceramics, etc., and can meet the bonding and mechanical performance requirements at high temperatures. It is widely used in automotive electronics, pressure sensors, wiring harnesses, and motor magnetic sheet bonding.
More
Product Description: 6220 epoxy adhesive is a room temperature/heat curing resin adhesive. This two-component adhesive is designed for metal bonding, SMC fiberglass parts bonding, aluminum honeycomb panel splicing, motor product iron core bonding, ceramic membrane component sealing, soft magnetic unit potting, high temperature resistant sensor potting, etc. Feature: 1.Resistant to moisture, dirt and other atmospheric components2.High strength, excellent adhesion3.Good anti-pollution, low surface pretreatment requirements4.No solvent, no curing by-products5.Excellent high and low temperature resistance, -50℃-150℃6.Resistant to transformer oil, low attenuation7.Good adhesion to glass fiber cloth and steel plate
More
Product Features1.Single component semi-flow, fast heating and curing2.Black silicone elastomer adhesive3.Can be bonded to more substrates without primer, such as stainless steel, glass, ceramics, etc.4.Excellent flexibility and tear resistance5.Addition curing system: no curing by-products6.FDA food certification, ROHS\REACH certification7.Maintain elasticity and stability in the temperature range of -60℃~+280℃ Product ApplicationsMainly designed for bonding and sealing of electronic parts, FIPG on-site forming sealingDesigned to provide long-term thermal stability bonding for various metal, glass, plastic, and ceramic substratesTypical applications include: bonding of plastic shells and aluminum plates of automotive electronic devices, sealing of steam chambers and bottom plates of electric irons, bonding of chassis of hot water kettles, lamination of heating elements, and fixed bonding of wafers
MoreWe will reply within 24 working hours. If urgent, please help us to contact through email： Alice.sun@elaplus.cc .
