• Certification
    ISO9001/ISO14001/IATF16949
    ROHS/UL/REACH/FDA
    Mail Contact
    angela.he@elaplus.cc

    +86 13291521819

    Welcome to be our distributor

Adhesive Knowledge

Silicone Gels VS Epoxy Resins: A Guide to Depth Comparison for Electronic Packaging Materials

2025-07-14

Silicone Gel and Epoxy Resin are the two most common types of materials in electronic packaging, sealing, thermal conductivity, protection and other applications. They are widely used in LED packaging, sensor sealing, power module, circuit board protection, automotive electronics, communication equipment, medical electronics and other fields.But many engineers in the selection, often the difference between these two materials is not clear enough: which is more suitable for high temperature environments? Which is softer, more resistant to yellowing? Today we will recommend four dimensions from the material characteristics, application scenarios, advantages and disadvantages, selection, comprehensive comparison of these two types of adhesive materials, help you choose adhesive science, improve product reliability! Organic Silicone Gel VS Epoxy ResinWhat is an organic silicone gel?Organic silicone gel is a high softness, good elasticity, deep curing silicone-based material, usually used as a dual component (A / B component) to form a soft gel-like structure after curing by room temperature or heating.Features Overview:Transparent or semi-transparent, low modulusSelf-healing, good stress releaseUV resistance, aging resistance, high and low temperature (-60 ℃ ~ +200 ℃)Strong electrical insulation, some models have thermal conductivityWhat is epoxy resin?Epoxy resin is a thermosetting material, used by resin and curing agent mixed, after curing to form a high strength, high hardness solid state structure. Widely used in electronic packaging, structural bonding, circuit protection, mold manufacturing and other fields.Features Overview:High mechanical strength and hardnessStable volume after curing, resistant to chemical corrosionExcellent high temperature resistance (generally up to 130 ℃ ~ 180 ℃)Excellent electrical insulation and adhesionIII. Organic Silicone Gel Vs Epoxy Resin Comparison TableComparison Dimensions Organic Silicone Gel Epoxy ResinAppearance/Hardness Soft, gel-like, good elasticity Hard, solid, high strengthCuring method Two-component, constant temperature or heating curing Two-component, heating/constant temperature curing requiredThermal conductivity Adjustable, 0.2 ~ 3.0 W/m·K, elastic thermal conductivity Adjustable, 0.5 ~ 1.5 W/m·K, structural…

More

What is the difference between sealant and hot melt adhesive? Read the article to understand their respective advantages and application scenarios

2025-07-14

In many areas such as electronics manufacturing, home appliance assembly, automotive electronics, LED lighting, and industrial packaging, the choice of “adhesives” is critical. Two common adhesive materials – Potting Compound and Hot Melt Adhesive – often appear in the same factory or even the same production line. But many engineers and procurers confuse their properties and scope of application when selecting.Today, we will analyze in detail: what is the difference between sealant and hot melt adhesive? What applications are they suitable for? How to choose the right type of adhesive to improve product reliability and production efficiency?

More

The multifunctionality of single component epoxy adhesives: applications, advantages, and key considerations

2025-05-15

In modern manufacturing, adhesives are no longer just adhesive materials, but also one of the core processes for improving product reliability, durability, and protective performance. Especially in high-precision industries such as electronics, electrical, automotive, and new energy, higher requirements have been put forward for the performance of adhesives. Single component epoxy adhesive is a pre mixed epoxy resin system that does not require manual mixing and can be quickly cured by heating. It is suitable for various industrial applications such as automated production, precision manufacturing, electronic packaging, and structural bonding. 1、 What is a single component epoxy adhesive? One component epoxy adhesive is a pre mixed epoxy resin system at the factory, which does not require secondary mixing by the user and can be used directly. It is usually cured by heating. This type of adhesive is stable when stored at room temperature for a long time, and only reacts quickly at a certain temperature to form a high-strength structure. Compared with traditional two-component adhesives, single component products greatly simplify the operation process, avoid human proportioning errors, and improve production efficiency, especially suitable for automated dispensing, sealing, or coating systems. 2、 The core advantages of single component epoxy adhesive ✅ 1. Convenient operation and efficient production No need for weighing and mixing, ready to use, greatly reducing the operating threshold and working time, especially suitable for assembly line operations and automation equipment, can significantly improve unit production capacity. ✅ 2. Fast curing, adjustable control Most products are cured by heating (such as 80 ℃/30 minutes or 120 ℃/10 minutes), and the curing window can be flexibly set according to the actual production cycle, supporting efficient batch processing. ✅ 3. Strong adhesion and wide applicability Epoxy system has excellent polarity and excellent adhesion to various substrates such as metals, ceramics, glass,…

More

What is the difference between sealant and hot melt adhesive? Understand clearly in one minute!

2025-05-15

In manufacturing industries such as electronics, automotive, and home appliances, potting adhesive and hot melt adhesive are often used for sealing, fixing, insulation, and other processes. But many people are not clear about the difference between these two types of glue. Today, Elaplus will explain their definitions, application scenarios, advantages and disadvantages, and selection suggestions in one go 👇 🔍 What is sealant?Potting compound is a liquid two-component or single component adhesive that can flow and completely encapsulate electronic components. After curing, it forms an elastic or rigid body with properties such as waterproof, moisture-proof, high and low temperature resistance, insulation, and chemical corrosion resistance.📌 Typical applications:LED driver power supply encapsulationTransformer, power module, sensor packagingAutomotive Electronic Control Module (ECU) Packaging🔥 What is hot melt adhesive?Hot melt adhesive is a thermoplastic adhesive that melts after heating and quickly solidifies after cooling. It is usually in the form of solid rods or particles and is commonly used in automated dispensing or spraying equipment.📌 Typical applications:Packaging industry sealingFurniture edgingQuick bonding of plastic parts for household appliances📊 Potting compound vs hot melt adhesive: key differences at a glanceItem                                                     potting compound                                                   hot melt adhesivePhysical state                                    liquid, needs to solidify solid                                  heated and melted for useCuring method:                                chemical reaction…

More

Silicon gel: ideal choice for electronic packaging and protection

2025-05-12

With the continuous improvement of high integration, lightweight, and high reliability requirements for electronic products, traditional packaging and protective materials are no longer able to meet their demanding performance requirements. Among many materials, silicone gel, with its excellent flexibility, electrical insulation, thermal stability and weather resistance, has become a popular packaging and potting material in many fields such as electronics, automobile, new energy, medical treatment, etc. In this paper, Yili’an will comprehensively analyze the application value of silicone gel from the aspects of product definition, performance advantages, application fields, use methods and selection suggestions.1, What is silicone gel?Organo silicon gel is a kind of polymer material based on polysiloxane structure, which is usually supplied in the form of A/B two-component liquid. After mixing, it is cured at room temperature or heating to form a soft elastic gel. Its hardness is much lower than that of ordinary silicone rubber, and it feels like jelly. It has excellent flexibility and resilience, which can effectively cushion external impact and maintain stable performance for a long time.Typical products such as ELAPLUS SIGEL 1806, ELAPLUS SIGEL 8605, ELAPLUS SIGEL 3006, etc. have good transparency, low stress, high insulation, and are suitable for protective packaging of various precision electronics.2, Performance advantages of organosilicon gel

More

Detailed explanation of the differences between UV sealant and epoxy sealant: performance comparison, application areas, and selection guidelines

2025-05-08

Potting adhesive is widely used in electronic manufacturing and industrial packaging to protect circuits, improve weather resistance, and extend product life. With the continuous improvement of process requirements, UV sealant and epoxy sealant have become the two most common choices in the industry due to their different curing mechanisms and performance characteristics. So what are the differences between them? This article comprehensively analyzes the curing principle, physical properties, applicable scenarios, advantages and disadvantages of Yilian from multiple dimensions. UV sealant and epoxy sealant 1、 What is UV sealant?UV sealant is a type of UV curable adhesive, usually a single component system, that can be quickly cured by UV irradiation. Suitable for application scenarios that require high efficiency, dense components, and transparency or partial transparency. UV sealing adhesiveCore features:✅ Rapid curing: curing can be completed within a few seconds to minutes under UV irradiation;✅ Good transparency: commonly used in LED packaging and optical sensors;✅ Easy to operate: single component system, no mixing required, suitable for automated dispensing;✅ Suitable for micro precision packaging: low viscosity, strong fluidity, suitable for filling small gaps;⚠️ Attention: UV glue must be transparent to cure, and shadow areas cannot be completely cured. It is necessary to use a photoinitiator or adopt a dual curing system (UV+heat curing).2、 What is epoxy sealant?Epoxy sealant is mainly a two-component thermosetting adhesive (there are also some single component thermosetting types), which is cured through chemical reactions at room temperature or under heating conditions. It occupies an important position in industrial applications due to its excellent mechanical properties and chemical stability. Epoxy sealantCore features:✅ Superior mechanical properties: After curing, it forms a hard material with impact resistance and compressive strength;✅ Strong ability to withstand high and low temperatures: able to withstand -40 ℃~150 ℃ for a long time, suitable for industries such…

More

Epoxy sealant: an ideal choice for electronic packaging protection

2025-05-08

In the field of modern electronic manufacturing, epoxy sealant has become the preferred material for electrical insulation, mechanical protection, and environmental sealing. Whether it’s power modules, automotive electronics, LED drivers, transformers, or sensors, epoxy potting adhesive provides reliable and long-lasting packaging solutions with its excellent performance. Epoxy sealantWhat is epoxy sealant?Epoxy potting adhesive is a two-component or one component adhesive based on epoxy resin, commonly used for potting protection of electronic devices. Its characteristics are high adhesive strength, strong thermosetting, low shrinkage rate, and the formation of a dense and hard protective layer after curing. It can effectively prevent water, dust, and corrosion, and has excellent electrical insulation performance.The core advantages of epoxy sealantExcellent electrical insulation performancePrevent current leakage and breakdown, and protect the stable operation of components in high voltage environments.Excellent weather resistance and heat resistanceCapable of withstanding temperature fluctuations ranging from -40 ° C to 150 ° C, suitable for outdoor and high-temperature work environments.High adhesion forceIt can firmly adhere to the surfaces of various materials such as metal, plastic, glass, ceramics, etc., enhancing the overall structural strength.Strong seismic and impact resistance performanceAfter curing, it forms a tough structure that effectively absorbs external stress and prevents component detachment or damage.Good flame retardancyMultiple products have achieved UL 94V-0 flame retardant rating, meeting electrical safety regulations.Application fields of epoxy sealantEpoxy sealant is widely used in the following industries and products:Power module and adapter: improve voltage and moisture resistance levelsLED driver power supply: prevents electrical breakdown and extends service lifeAutomotive electronics (such as sensors, control modules): heat-resistant and earthquake resistant, ensuring driving safetyTransformers and Inductive Components: Improving Insulation and Reducing NoiseNew energy battery pack: Enhance packaging strength to prevent internal short circuitsTypical recommendation: ELAPLUS epoxy sealant EP 1712EP 1712 is a two-component epoxy potting material with the following characteristics:Good toughness and…

More

Why does UV glue turn yellow and how to prevent it?

2025-04-25

Transparent UV glue is essential in various industries, from electronic manufacturing to medical applications, due to its fast curing and long-lasting bonding properties. However, over time, the application of UV glue may experience discoloration, where the cured glue turns yellow. This phenomenon will seriously affect the functional performance and aesthetics of the product. So, why does UV glue turn yellow? How to effectively solve this problem? Now let’s explore the key factors that cause UV glue to turn yellow with Yi Lian, and find ways to alleviate and prevent it! Why UV glue turns yellow and how to prevent itThe yellowing phenomenon of UV glue refers to the gradual discoloration of the originally transparent UV glue due to various factors during use. Here are some of the main reasons for UV glue yellowing:Degradation of UV stabilizers: In order to protect UV adhesives from the effects of ultraviolet (UV) radiation, many manufacturers add UV stabilizers to adhesive formulations. However, prolonged exposure to ultraviolet radiation can lead to the degradation of these stabilizers, reducing their protective effectiveness. Eventually, the adhesive will start to turn yellow and lose its original transparency.Oxidation reaction: Components in UV adhesives, such as resins and additives, are prone to oxidation when exposed to light and oxygen in the air. Oxidation produces peroxide structures and free radicals, leading to discoloration of transparent materials. Oxygen is particularly destructive to materials containing unsaturated double bonds or easily oxidizable functional groups. At high temperatures, oxidation reactions accelerate, and even stable single bonds like C-C can break, leading to yellowing. Long term exposure to strong light or high temperature will further intensify oxidation, making yellowing more severe.Exposure to light and high temperatures: When UV adhesives are directly exposed to sunlight or strong artificial light for a long time, the ultraviolet rays in the…

More

Elaplus Science Popularization:Why do Electronic Products Need Thermal Management?

2025-04-18

Up to 55% of electronic product failures are caused by heat Most electronic products, such as power transistors, CPUs, and power diodes, generate a significant amount of heat, which may need to be considered in order to extend their lifespan and improve reliability.During operation, the temperature of electronic components will rise until the heat generated inside the device equals the heat dissipated to the surrounding environment, and the device reaches equilibrium. The temperature may be high enough to significantly shorten the shelf life of components and even cause equipment failure.The result of temperature rise will affect the operation of active and passive components in integrated circuits. If the temperature rises high enough, the heated active or passive components may not function properly or even fail completely. This type of failure includes thermal runaway, junction failure, metallization failure, corrosion, resistance drift, and electromigration diffusion. Therefore, minimizing temperature rise in electronic packaging is crucial.What causes the temperature of electronic packaging to rise? Improve power density and currentThe insatiable demand for higher performance processors has led to a steady increase in power consumption in all segmented markets, such as mobile and high-performance desktops, as well as servers and workstations. The increasing power density and current levels in microprocessors have always been the main heat sources, causing concerns about thermal management of on-chip hotspots, packaging, and interconnect Joule heating.PCB surface component density is higherAnother reason why thermal management of electronic circuit boards has attracted attention is that the electronics industry is witnessing a trend of handheld devices and household appliances becoming thinner and smaller. That’s why PCBs are becoming more compact, and the space between components on electronic PCBs is getting closer, making it harder to transfer heat from PCB components.So what if the radiator is not enough?Maximizing the contact area between the radiator…

More
Mail Mail
angela.he@elaplus.cc
Wechat/WhatsApp Wechat/WhatsApp
+86 13291521819

sample request

We will reply within 24 working hours. If urgent, please help us to contact through email: angela.he@elaplus.cc