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How to Choose PCB Conformal Coatings? Comparison of 6 ELAPLUS PCB Conformal Coating Models & Applications

2026-07-20

PCB conformal coatings shall be selected based on service environment, curing speed, PCB structure, film flexibility and rework requirements. For general industrial control boards, ELAPLUS SIPC 2121, SICOAT 9061 or SICOAT 9007 are available for evaluation. For PCBAs requiring fast UV curing plus secondary curing in shadow areas, UV Coating 9060-M is recommended. For automotive electronics and wide-temperature-range applications, UV SIPC 3301 is a key option to assess. ELAPLUS supplies silicone, UV curable and UV-moisture dual-cure PCB conformal coatings, compatible with spraying, brushing, selective coating and automatic inline curing processes. What Are the Functions of PCB Conformal Coatings? Also known as PCB protective lacquer, PCBA coating or Conformal Coating, PCB conformal coatings form a continuous protective film on PCB surfaces to mitigate damages to electronic circuits caused by: ■ Moisture and condensation ■ Salt spray and corrosive gases ■ Dust and ionic contaminants ■ Grease and certain chemical media ■ Thermal cycling between high and low temperatures ■ Circuit and solder joint damage induced by vibration Conformal coatings do not fully encapsulate the entire PCB; they only form a thin protective layer over circuit boards, solder joints and components. For electronic modules requiring full waterproofing, structural fixation or deep insulation, potting compounds are generally used together. Main Types of PCB Conformal Coatings Common PCB conformal coatings fall into four categories: silicone conformal coatings, acrylic conformal coatings, polyurethane conformal coatings and UV curable conformal coatings. Silicone Conformal Coatings Silicone coatings feature excellent high-low temperature resistance and retain good flexibility after curing. They are ideal for automotive electronics, industrial controllers, PV & energy storage boards and circuits subject to frequent thermal cycling. Recommended models: ■ SIPC 2121 ■ UV SIPC 3301 Low-Viscosity PCB Conformal Coatings Low-viscosity products spray easily and spread uniformly to form even thin films. Care must be taken to…

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How to Select Inductor Fixing Adhesives: Fluidity, Thixotropy and Temperature Resistance Must Be Considered Simultaneously

2026-07-16

Inductors, coils and magnetic cores are key components in power modules, filters, automotive electronic control units, communication equipment and industrial control systems. During transportation vibration, equipment operation and temperature cycling, inductors may shift, and magnetic cores can become loose due to mechanical shock. Solder joints bear sustained loads from component weight and vibration, which easily leads to fatigue cracking. Applying fixing adhesives to structurally reinforce inductor bases, magnetic cores and coils can share stress on solder joints and improve long-term reliability. I. Three Core Considerations for Selecting Inductor Fixing Adhesives Can the adhesive stay in the designated area? Inductors are usually surrounded by pads, pins and other components. Adhesives with excessive fluidity tend to flow and contaminate restricted zones. For local fixation, high-thixotropy paste materials are recommended. If penetration into bottom gaps is required, moderate fluidity is necessary. Can the cured adhesive withstand vibration? Materials must deliver sufficient shear strength and hardness to prevent inductor displacement under mechanical vibration. Can the adhesive withstand operating temperatures? Inductors can experience significant temperature rise during operation. The glass transition temperature (Tg) and service temperature range of the fixing adhesive must cover actual working conditions. II. Elaplus Recommended Products for Inductor Fixation EP 2011: Two-Part Epoxy Structural Adhesive EP 2011 is a grey two-part epoxy paste with slight sagging tendency. Key Properties: ■ Hardness: approx. Shore D 83 ■ Tg: approx. 55°C ■ Shear strength: approx. 16 MPa ■ Service temperature: -40 ~ 120°C ■ Suitable for large-area base bonding and room-temperature mixing processes Recommended Applications: ■ Inductor base bonding ■ Fixation of coils and brackets ■ Structural bonding for general industrial electronic components EP 1769: High-Thixotropy One-Part Epoxy Adhesive EP 1769 is a grey paste one-part epoxy; viscosity approx. 300,000 cps; thixotropy index approx. 4.5. Key Properties: ■ Hardness: approx. Shore D 80 ■ Tg: approx. 140°C ■ Shear strength: approx. 28 MPa ■ Service temperature:…

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How to Select MEMS Encapsulation Adhesives: Low Stress, Low Shrinkage and Matched Thermal Expansion Are Critical

2026-07-16

MEMS pressure sensors, inertial sensors, accelerometers, gyroscopes, microphones and other devices generally incorporate miniature sensitive chips, micromechanical structures and precision electrodes. Such components are extremely susceptible to mechanical stress. Excessive cure shrinkage or high modulus of encapsulation adhesives, or a large mismatch in coefficient of thermal expansion (CTE) between the adhesive and chips, may lead to zero drift, sensitivity deviation and even structural damage. Therefore, when selecting MEMS encapsulation adhesives, bonding strength alone is not sufficient; priority should also be given to whether the material can relieve stress. I. Three Common Adhesive Application Zones in MEMS Packaging 1. Precision Bonding of MEMS Chips Chips need to be accurately fixed onto substrates while avoiding excessive shrinkage stress exerted on chips by cured adhesives. Required material properties: ■ Low cure shrinkage ■ Good positional retention ■ Thermal expansion performance matched with substrates ■ Stable bonding strength ■ Compatibility with precision dispensing or active alignment processes 2. Electrode Protection for MEMS Chips Electrodes and bonding areas require protection against moisture, corrosion and vibration, yet must not be fully constrained by high-hardness materials. Low-modulus silicone gels or flexible silicones can form a protective layer while reserving certain displacement space for chips and bonding wires. 3. Lid Bonding & Housing Sealing MEMS lid sealing must block moisture vapor and contaminants. Additional requirements may include electrostatic discharge (ESD) protection, optical stability and dispensing within narrow gaps. II. Eilian Recommended Adhesive Grades for MEMS Packaging SIPA 3000 One-Part Addition-Cure Silicone One-part semi-flowable silicone adhesive and sealant; viscosity ~40,000 cps; hardness Shore A 28 after curing; elongation >250%. Recommended applications: ■ MEMS lid bonding ■ Housing sealing ■ Flexible reinforcement of solder joints ■ Areas requiring both adhesion and stress buffering High elongation helps absorb displacement induced by vibration and thermal expansion. SIPA 3003 Chip Mounting Adhesive One-part semi-fluid silicone; viscosity ~20,000 cps; hardness Shore A 50;…

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How to Select Adhesives for Bonding Motor Magnets & Magnet Segments — Reliable Bonding Solutions for High-Speed Motors

2026-07-15

Why Do Motor Magnets/Magnet Segments Require Specialized Adhesives? In permanent magnet synchronous motors (PMSM), brushless DC motors (BLDC), servo motors and robot joint motors, magnets (magnet segments) are generally fixed onto the inner wall of rotors. As motors evolve toward higher power density, higher rotational speed and miniaturization, magnet bonding materials must deliver sufficient bonding strength while maintaining stable performance under high centrifugal force, high-temperature cycling and long-term vibration. Insufficient bonding performance may lead to: ■ Magnet detachment ■ Rotor unbalance ■ Increased motor noise ■ Reduced output torque ■ Failure during high-speed operation ■ Shortened motor service life Therefore, magnet bonding adhesive has become a critical material affecting reliability in motor manufacturing. Required Performance Specifications for Magnet & Magnet Segment Adhesives Motor Magnet Adhesive High Shear Strength During high-speed rotation, magnets are subjected to tremendous continuous centrifugal force. The adhesive must possess high shear strength to securely hold magnets over long-term operation and prevent displacement or detachment. High Temperature Resistance Drive motors for new energy vehicles, robot joint motors and industrial servo systems operate at elevated temperatures for extended periods. Magnet adhesives should feature a high glass transition temperature (Tg) to avoid softening, creep or degradation of bonding performance under high temperatures. Excellent Electrical Insulation Beyond structural bonding, magnet adhesives provide reliable electrical insulation protection to prevent electric leakage and partial discharge, improving long-term operational stability of motors. Thermal Shock Resistance Motors undergo frequent start-stop cycles and temperature fluctuations. The adhesive layer should exhibit good anti-fatigue properties and remain stable under repeated thermal expansion and contraction, resisting cracking or delamination. ELAPLUS Bonding Solutions for Motor Magnets & Magnet Segments ELAPLUS offers a range of single-component epoxy structural adhesives to match diverse motor manufacturing processes. Flux Motor Magnet Sheet Bonding EP 1739-1K Single-Component Epoxy Adhesive Suitable for medium-temperature fast curing processes. Product Features: ■ Single-component structural epoxy…

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How to Select Potting Compound for Strain Gauge Pressure Sensors? ELAPLUS EP 2016 AB Flexible Epoxy Solution Reduces Stress and Improves Measurement Stability

2026-07-14

The core of a strain gauge pressure sensor lies in its sensitive element, which captures tiny deformations and converts pressure variations into electrical signals. Such sensors are highly susceptible to structural stress. If the potting material is overly rigid, or generates excessive curing shrinkage and thermal stress, it will impose extra loads on strain gauges, solder joints, leads and sensitive cores, resulting in zero drift, fluctuating sensitivity and poor long-term measurement stability. Therefore, when choosing potting compounds for pressure sensors, hardness alone is not the key factor. Priority should be given to materials featuring flexibility and low stress, reliable adhesion, stable temperature resistance, contamination resistance, oil resistance and long-term fixation performance. For strain gauge pressure sensors, high-temperature resistant sensors, soft magnetic component potting and other applications, ELAPLUS Functional Materials (Shanghai) Co., Ltd. recommends the two-component flexible structural epoxy ELAPLUS EP 2016 A/B. According to the product datasheet, EP 2016 A/B is a two-part epoxy curable at room or elevated temperature, suitable for metal bonding, soft magnetic component encapsulation and high-temperature sensor potting. After curing, it delivers high mechanical strength, outstanding adhesion, wide temperature resistance and excellent contamination resistance. I. Why Overly Rigid Potting Materials Are Unsuitable for Strain Gauge Pressure Sensors A strain gauge pressure sensor generally consists of an elastic body, strain gauges, bridge circuit, leads, PCB, housing and sealing structure. During operation, the elastic body must produce consistent, repeatable micro-deformation. Hard potting materials will compromise product reliability in the following aspects: ■ Extra stress impairs measurement accuracy Strain gauges output signals by detecting minimal strain. Ultra-rigid potting compounds generate additional stress during curing shrinkage, thermal cycling or mechanical vibration, triggering sensor zero drift, unstable output or sensitivity deviation. ■ Thermal cycling causes interfacial tension Pressure sensors are widely deployed in automotive equipment, industrial machinery, hydraulic systems and engine oil pressure…

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Potting Compound Selection for EMI Filter PCBs – ELAPLUS PUR 1635 Polyurethane Potting Compound Delivers Waterproof, Flame-Retardant & Insulating Protection

2026-07-13

EMI filter circuit boards are widely integrated into power supplies, electronic controllers, industrial equipment, communication hardware, new energy systems and other assemblies. Their core function is to suppress electromagnetic interference and stabilize circuit performance. Filter PCBs are densely populated with inductors, capacitors, solder joints, terminals, PCB traces, alongside plastic and metal housings. During long-term operation, these components are exposed to multiple hazards including moisture, dust, vibration, temperature cycling and electrical safety risks. Therefore, when selecting potting adhesive for EMI filter motherboards, full filling capacity alone is insufficient. Critical performance metrics to evaluate include electrical insulation, water & moisture resistance, flame retardancy, flexibility, low shrinkage, weatherability and adhesion to various substrates. For EMI filter PCB potting applications, Elaplus Functional Materials (Shanghai) Co., Ltd. recommends the two-component polyurethane potting compound ELAPLUS PUR 1635, which provides long-term stable sealing and electrical protection for filter circuit boards. Potting for EMI Filter Circuit Boards I. Why EMI Filter PCBs Require Potting Protection EMI filters are critical anti-interference components within power systems, commonly deployed in power modules, controllers, charging equipment, industrial electronics, inverters, energy storage units and communication devices. Without reliable potting encapsulation during continuous energized operation, filter PCBs are prone to the following failures: 1.Moisture ingress degrades insulation performance Solder points, terminals, inductors, capacitors and PCB traces on EMI filter boards are highly sensitive to humidity. Prolonged moisture penetration can cause degraded insulation, electric leakage, component corrosion and even short circuits. Waterproof & moisture-resistant potting compound forms a protective film over all electronic parts, mitigating failure risks in hot-humid operating environments. 2.Vibration and shock loosen electronic components Power equipment, industrial controllers and vehicle-mounted electronics are subject to constant vibration and mechanical impact. Tall components such as inductors and capacitors will suffer solder joint fatigue, displacement or poor electrical contact if not secured by potting resin. The…

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How to Select Potting Compound for Start-Stop Controllers: ELAPLUS EP 1712 Flame-Retardant Epoxy Potting Compound for Potting & Protection of Controllers, ECUs and Power Modules

2026-07-09

Are you searching for potting adhesives for start-stop controllers, general controllers, ECUs and power supplies? It is critical to select an electronic potting material that simultaneously delivers insulation, moisture resistance, flame retardancy, crack resistance, bonding fixation and long-term reliable protection. For automotive start-stop controllers, ECU boards, power control modules, sensor circuit boards and other applications, ELAPLUS Functional Materials (Shanghai) Co., Ltd. recommends ELAPLUS EP 1712 flame-retardant epoxy potting compound. EP 1712 is a two-component solvent-free room-temperature curing epoxy potting compound. It features moderate flowability after mixing and certain anti-leakage performance. Fully cured material boasts high hardness, favorable toughness, outstanding adhesion and electrical insulation, superior waterproof and moisture-proof properties, and meets UL 94 V-0 flame retardant rating. It is suitable for encapsulation and protection of automotive electronics, sensors, optoelectronic LEDs, lighting products and more. I. Why Do Start-Stop Controllers Require Potting Compound? Installed within automotive electrical systems, start-stop controllers are exposed to long-term temperature fluctuations, hot-humid environments, vibration and shock, fluctuating electrical loads and limited structural space. Their internal components include PCBs, inductors, capacitors, relays, MOSFETs, connection terminals and other parts. Without reliable encapsulation, the following failures may occur: ■ Moisture ingress leading to reduced insulation or corrosion failure ■ Fatigue damage to solder joints, components and wiring harnesses caused by vehicle vibration ■ Local heat generation inside power modules compromising long-term reliability ■ Cavities between control boards and housings prone to water accumulation, dust buildup and heat concentration ■ Risks of short circuits, electric arcs and thermal runaway, which necessitate flame retardant protection Therefore, potting compound for start-stop controllers is not merely for cavity filling. After curing, it forms a stable protective layer to provide electrical insulation, mechanical fixation, waterproof & moisture-proof shielding, flame retardancy and crack resistance for internal electronic components of controllers. II. Core Selection Criteria for Controller, ECU and Power Supply Potting…

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Potting Compounds for High Power Density Motors: Thermal Conductivity Alone Is Not the Only Criterion

2026-07-08

In recent years, the development of high power density motors has been driven forward by humanoid robots, industrial robots, electric vehicles (EVs), unmanned equipment and industrial automation machinery. As motors become more compact yet deliver higher output power, the conventional potting mindset of “just fill the cavity” is no longer adequate. Whether it is potting compound for robot joint motors or thermally conductive potting adhesive for EV drive motors, engineers now focus on a complete thermal management system and long-term reliability rather than thermal conductivity as a standalone metric. This explains why more engineers are searching for answers to the following questions: ■ How to select potting compounds for motors? ■ Recommended thermally conductive potting adhesives for motors ■ Potting materials for robot joint motors The core question to address is simple: ■ What potting materials are required for high power density motors? Why an Increasing Number of Motors Adopt Potting Technology For robot joint motors, frameless torque motors, servo motors and drive motors, stator windings constitute the primary heat source within the whole system. Potting compounds do far more than merely fix windings in place. They perform five critical functions simultaneously: ■ Establish efficient thermal conduction pathways ■ Secure windings and suppress vibration ■ Provide electrical insulation ■ Resist moisture and corrosion ■ Enhance long-term operational reliability Accordingly, industry engineers frequently search for these product categories: ■ Thermal conductive motor potting compounds ■ Epoxy potting resins for motors ■ Stator potting materials ■ Potting adhesives for robotic motors Is Higher Thermal Conductivity Always Better? When selecting thermally conductive motor potting compounds, most engineers first check thermal conductivity figures. This is, however, a common misconception. For high power density motors, service life is predominantly determined by four key indicators: 1. Thermal Conductivity Dictates how rapidly heat transfers from windings to the motor housing. Insufficient thermal conductivity leads to: ■ Excessive temperature rise ■ Reduced power output…

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How to Select Adhesives for Bonding & Fixing Inductors

2026-07-06

Required Performance of Inductors Bonding Fixing Adhesives Inductors, coils, magnetic cores and power electronic components are subject to long-term temperature rise, mechanical vibration, thermal cycling and electrical stress during operation. Inductor Potting Compound Insufficient bonding strength of fixing adhesives, or cracking & debonding after curing, may lead to loose inductors, abnormal noise, pin fatigue or even abnormal electrical performance. Therefore, adhesives for bonding and fixing inductors must meet all the following requirements: ■ Excellent adhesion to magnetic cores, metals, PCBs and plastic bobbins; ■ Good anti-sagging property after dispensing to retain the shape of adhesive dots and lines; ■ High structural strength after full curing; ■ Outstanding electrical insulation performance; ■ Resistance to high-low temperature cycling and long-term operating temperatures; ■ Compatible with manual dispensing and automatic dispensing processes. For different inductor fixing structures, ELAPLUS, a manufacturer of electronic adhesives, offers four epoxy structural bonding fixing adhesives: EP 2011, EP 1769, EP 1767 and EP 1763. EP 2011: Suitable for Medium-Temperature Curing & Ambient Storage Processes EP 2011 is a two-component epoxy structural adhesive in grey paste with slight thixotropy. Inductor Fixing Adhesive It can be stored under ambient temperature away from light. The recommended curing profile is heating at 80°C for 1 hour. It is ideal for inductor fixing applications that require high structural strength without high curing temperatures. Typical properties: ■ Thixotropic index: 3.5 ■ Hardness after curing: Shore D 83 ■ Glass transition temperature (Tg): 55°C ■ Shear strength: 16 MPa ■ Volume resistivity: 1.2×10¹⁵ Ω·cm ■ Dielectric constant: 3.3 ■ Operating temperature range: -40 ~ 120°C EP 2011 is applicable to magnetic core fixation of inductors, coil assembly bonding, electronic component reinforcement and general structural bonding for industrial electronics. EP 1769: High Tg & High-Strength Solution for Inductor Fixing EP 1769 is a single-component grey paste epoxy adhesive with typical viscosity of 300,000 cps at 25°C and thixotropic index…

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