Electronic Adhesive FAQs

ELAPLUS Functional Material Shanghai Co., Ltd. supplies organic polymer adhesives and functional materials for electronic manufacturing. Its portfolio covers potting, bonding and sealing, thermal management, conformal coating, UV curing, silicone gels and related materials. ELAPLUS can also support product selection, sample evaluation and process optimization for specific applications.

The main product families include epoxy, silicone and polyurethane potting compounds; adhesive sealants and structural adhesives; thermal gels, thermal grease, thermal pads and thermally conductive potting materials; silicone and fluorosilicone gels; PCB conformal coatings; UV-curable adhesives; and lubrication materials.

Typical applications include new energy vehicles, automotive electronics, motors, robotics, sensors, industrial controls, power electronics, photovoltaic and energy storage systems, semiconductors, optical modules, data centers, household appliances, consumer electronics and LED lighting.

Yes. For a more accurate recommendation, provide the substrate, assembly structure, bond-line or potting thickness, operating temperature, curing conditions, thermal and electrical requirements, flame-retardancy requirements, reliability tests and estimated material consumption.

Yes. Submit the application, substrates, current process, target performance, estimated usage and the problems you need to solve. Sample testing should be followed by real-part validation and the required reliability tests before mass production.

Evaluate the chemistry, viscosity, thermal conductivity, hardness, coefficient of thermal expansion, cure shrinkage, operating temperature, electrical insulation, flame resistance, waterproofing and rework requirements. Start with the assembly structure and potential failure modes instead of selecting a material from one specification alone.

Epoxy potting compounds generally provide high strength, adhesion and dimensional stability. Silicone materials offer excellent flexibility and high- and low-temperature performance, making them suitable for thermal cycling and stress-sensitive components. Polyurethane materials often balance flexibility, adhesion and waterproofing. The final choice depends on the complete mechanical, thermal, electrical and processing requirements.

No. Higher thermal conductivity can affect viscosity, density, flow, processing cost and stress. The final thermal result also depends on bond-line thickness, contact area, interface resistance, heat-sink design and the complete heat path. Select a practical thermal level based on simulation or temperature-rise testing.

One-component materials simplify dispensing but may require moisture, UV light or heat to cure. Two-component materials can support thicker sections and room-temperature curing, but the ratio, mixing quality and dispensing equipment must be controlled. Consider production rate, cure depth, storage and equipment capability.

No. Aluminum, copper, stainless steel, glass, ceramics, FR-4 and engineering plastics have different surface energies and thermal expansion behavior. Oils, release agents and oxide layers can also reduce adhesion. Test the real substrates and confirm whether cleaning, abrasion, plasma treatment or primer is required.

Common causes include air introduced during mixing, moisture in the material or substrate, trapped air in complex structures, excessive dispensing speed, high viscosity and gas expansion during heated curing. Improvements may include preheating, vacuum degassing, bottom-up filling, flow-path optimization and staged curing.

Possible causes include CTE mismatch, cure shrinkage, excessive potting thickness, reaction exotherm, excessive modulus, surface contamination and thermal-cycle stress. Determine whether the failure is cohesive cracking, interface delamination or component damage before adjusting material modulus, CTE, surface preparation, thickness or cure profile.

Check for an incorrect mix ratio, incomplete mixing, cross-contamination, low curing temperature, expired material or cure inhibition. Inspect the metering equipment, static mixer, initial purge, storage records and actual part temperature. A small-cup test can help separate a material problem from an equipment or process problem.

Thick epoxy sections can generate concentrated reaction heat, resulting in internal stress, discoloration, cracking or component damage. Use a lower-exotherm or longer-working-time formulation, reduce the pour thickness, fill in stages and follow a verified stepped cure schedule.

Distinguish handling time, demolding time, full cure and the time required to reach final electrical and mechanical properties. Cure speed depends on material volume, assembly geometry, ambient conditions, oven uniformity and part thermal mass. Use the TDS as a starting point and validate the real assembly.

Thermal grease is suitable for thin interfaces and low contact resistance. Thermal pads simplify assembly and compensate for tolerances. Thermal gels support automated dispensing, irregular gaps and low-stress filling. Thermally conductive potting compounds add overall fixation, insulation and environmental protection.

A conformal coating forms a thin protective film on a PCB and focuses on moisture, salt-fog, insulation and corrosion protection. Potting fills a cavity or encapsulates components, providing stronger environmental and mechanical protection but usually increasing weight, material consumption and rework difficulty.

UV light rapidly cures exposed areas and supports a fast production cycle. Areas under connectors or components that are not reached by UV can continue curing through moisture. Coating thickness, UV dose, shadow depth and secondary-cure conditions must still be validated.

Orange peel can be related to viscosity, atomization, spray distance and leveling time. Craters may result from oil, silicone contamination or surface-tension differences. Bubbles can be caused by excessive coating thickness, board moisture or overly fast curing. Review cleaning, material temperature, spray settings, film thickness and cure conditions.

Motor stator potting should balance thermal conductivity, electrical insulation, low CTE, adhesion, crack resistance, impregnation and curing temperature. High-power-density and frameless torque motors also require evaluation of winding fill, magnet-wire compatibility, temperature resistance and interface reliability after thermal cycling.

Contact ELAPLUS with the product model and application information to request the applicable TDS, SDS and available test documents. Product specifications, compliance statements and packaging details may change by model or revision, so engineering decisions should use the latest controlled documents.

For clearly defined projects, requirements such as color, viscosity, hardness, thermal conductivity, working time, curing conditions, flame resistance, temperature range and media resistance can be discussed. Custom development normally includes requirement review, laboratory evaluation, sample testing, pilot validation and production approval.

Storage temperature, light protection, shelf life and open-container life depend on the chemistry. UV adhesives normally require protection from light; polyurethane and some silicone materials are moisture-sensitive; and two-component products must be protected from cross-contamination. Follow the product label, TDS and SDS.

A typical process includes requirement review, initial material selection, small-scale process testing, performance and reliability validation, equipment compatibility, pilot production and final production approval. Record the mix ratio, dispensing settings, cure profile, environmental conditions and test results.

Use the Contact page on the ELAPLUS English website or email kennis.zhu@elaplus.cc. Include the application drawing, bonding or potting location, substrates, operating temperature, curing limits, test standards and estimated volume to improve the speed and accuracy of the recommendation.