Thermal conductive materials
√ Thermal conductivity coefficient 1.0w/m.k~7.0/m.k
√ Provide thermal conductive grease, thermal conductive gasket, thermal conductive gel, thermal conductive potting adhesive and thermal conductive adhesive &sealant
TCMP 8820 liquid thermal conductive gap filler
Product introductionLiquid thermal gel gasket TCMP thermal conductivity 2.0 W/mK, double-packed, thixotropic low-stress application, liquid thermal gel gasket is designed to provide enhanced thermal management for advanced automotive batteries, automotive electronics, communication equipment, etc. , compared with traditional materials, it provides enhanced reliability and reworkability. Liquid thermal conductive gel gasket TCMP is a highly adaptable material that is easy to use and can eliminate assembly tolerances, making the components in production almost low compression force, protecting solder joints and other components. The liquid thermal gel gasket can be perfectly reworked and repaired, significantly reducing the overall cost. The automatically controlled feeding can significantly reduce waste, again reducing the overall cost. It is a two-component fast-curing liquid thermal gel gasket. , which can realize fully automated assembly an correspond to the thermal interface materials of Industry 4.0. Features
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