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Elaplus Application Case of Lead Sealing for Air Flow Meter | Solution for Gasoline Resistant, Low Viscosity White Sealing Adhesive

2025-10-11

In automotive electronics, the Mass Air Flow Sensor (MAF) is one of the core components in the engine control system. It helps ECU accurately calculate fuel injection quantity by measuring the volume or mass of air entering the engine, thereby optimizing combustion efficiency and emission control.Air flow meters typically operate near the engine intake duct in complex environments such as high temperatures, fuel vapors, moisture, and strong mechanical vibrations. If its lead packaging is unreliable, signal interference, failure, and even safety hazards may occur. Therefore, choosing the appropriate sealing adhesive becomes the key to ensuring its long-term stable operation. Application ChallengeDuring the lead sealing process of the air flow meter, the customer made the following typical requirements:Resistant to 80 ℃ gasolineIf the lead is exposed to the volatile environment of gasoline for a long time, if the colloid is not resistant to oil, it is easy to swell and crack, leading to electrical failure.Low viscosity, easy to penetrateThe sealing adhesive should be able to flow to small gaps, avoid bubbles and voids, and ensure insulation and sealing effect at the lead.White appearanceWhite colloid is convenient for detecting the uniformity of encapsulation, and also meets aesthetic and identification requirements in certain situations.Recommended solution – EP 1702W white low viscosity potting adhesiveFor the special requirements of air flow meters, it is recommended to use EP 1702W sealant.Product Features:Chemical resistant media: Excellent resistance to gasoline, lubricants, moisture, etc., maintaining stable performance even in gasoline at 80 ℃;Low viscosity design: With excellent fluidity, it can easily fill the narrow gaps around the leads, reducing the risk of bubbles;Electrical insulation: After curing, a dense insulation layer is formed, effectively preventing short circuits and leakage;Advantages of curing: It can be cured at room temperature, has low heat release, low volume shrinkage rate, and avoids stress damage;Bright…

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Full analysis of Hall sensor encapsulation process | Professional protection to enhance reliability

2025-10-11

Hall sensors are an important type of magnetic field sensing device widely used in fields such as automotive electronics, industrial control, and consumer electronics. Due to its use of non airtight packaging, it is highly susceptible to external media and mechanical impacts in harsh environments such as high temperature, humidity, oil, vibration, etc. without effective protection. Therefore, potting and conformal coating are key components in the reliability design of Hall sensors. Sealing: Injecting sealing material into the interior of the shell to form a complete package, providing electrical insulation, protection, and mechanical reinforcement; Coating overlay: forming a thin film layer on the surface of PCB or sensitive components, mainly used for moisture, dust, and basic chemical protection.1、 Environmental and mechanical protection methods

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Detailed explanation of the difference between UV glue and single component epoxy glue – a must read popular science guide for choosing glue

2025-10-11

The selection of adhesives is crucial in modern manufacturing and maintenance industries. UV glue and single component epoxy glue, as two common adhesives, each have unique properties and application scenarios. This article will provide an in-depth analysis of the differences between UV glue and single component epoxy glue, helping you make the best choice based on your needs. 1、 What is UV glue?UV glue is a type of adhesive that quickly cures through exposure to ultraviolet radiation. It is usually a transparent liquid and suitable for various materials such as glass, plastic, metal, etc. UV glue curing speed is extremely fast, usually completed within seconds to minutes, greatly improving production efficiency.2、 What is single component epoxy adhesive?Single component epoxy adhesive is a pre prepared epoxy resin adhesive that can be used without mixing other components. It has excellent adhesive strength and chemical resistance, suitable for bonding materials such as metals, ceramics, plastics, etc. The curing time is relatively long, usually ranging from several hours to a day.3、 The main difference between UV glue and single component epoxy glueCuring methodUV glue: rapidly cured by UV irradiation, relying on UV energy.Single component epoxy adhesive: cured by chemical reaction at room temperature or heating conditions, without the need for external light source.curing timeUV glue: seconds to minutes, fast and efficient.Single component epoxy adhesive: several hours to 24 hours, suitable for low-speed assembly.Applicable materials and scenariosUV glue: suitable for transparent or semi transparent materials, commonly used for bonding electronic components and optical devices.Single component epoxy adhesive: suitable for various materials, especially metal and high-strength applications.Adhesive strength and durabilityUV glue: High adhesive strength, smooth surface, but limited effect on thick adhesive layers.Single component epoxy adhesive: excellent strength, corrosion resistance, and temperature resistance.construction technologyUV glue: UV lamp equipment is required, and the construction environment requires light…

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Elaplus Application Case: Thermal Insulation and Sealing Solution for Contactor Electronic Coil

2025-10-11

In industrial control and power systems, contactors, as key electrical components, have long been responsible for high-frequency switching and high current carrying tasks. Its internal electronic coils not only require stable electrical performance, but also must balance thermal conductivity, protection, and reliability. How to choose the appropriate sealing adhesive has become the key to ensuring the long-term stable operation of the contactor. Thermal conductivity sealing of contactor electronic coilApplication Challenge The contactor electronic coil faces the following technical difficulties during use:Long term temperature resistance performance: It needs to work for a long time at -40 ℃~85 ℃ to ensure no cracking or failure.Double 85 reliability: After 14 days of high temperature and high humidity testing at 85 ℃/85% RH, it still needs to maintain stable performance without bulging or delamination.Efficient thermal conductivity: Electronic coils generate heat during operation and require a thermal conductivity of ≥ 1.5 W/m · K to effectively reduce temperature rise and improve service life.Cost and scalability: While meeting performance requirements, it is necessary to balance cost-effectiveness for large-scale application and promotion.Recommended solution – PUR 6650 (1.5W) thermal conductive sealantFor the special requirements of contactor electronic coils, it is recommended to use PUR 6650 (1.5W) two-component polyurethane sealant. Compared to epoxy systems, this product has better flexibility and cost advantages, making it particularly suitable for large-scale promotion and application.Product FeaturesExcellent temperature resistance: Long term operation in an environment of -40 ℃~85 ℃, stable performance.Double 85 verification passed: tested for 14 days under high temperature and high humidity conditions of 85 ℃/85% RH, it still maintains excellent insulation and adhesion.High thermal conductivity: thermal conductivity of 1.5 W/m · K, effectively dissipating coil heat and reducing temperature rise.Environmental safety: low odor, low VOC, compliant with ROHS and REACH regulations.Excellent process adaptability: It can be machine glued or manually mixed,…

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Case study | Application of Elaplus PCB board enclosure dam sealing

2025-09-19

In the field of electronic manufacturing, the reliability of PCB circuit boards directly determines the stability and service life of products. In order to resist moisture, dust, vibration, and chemical corrosion, encapsulation and dam sealing processes have become the core processes to ensure the long-term operation of circuit boards. Today we will share an example of the application of Yilian PCB board dam sealing. Application scenariosThree prevention measures for local potting: special areas of the PCB board need to be protected with a potting thickness of about 5mm. Stress free silicon gel must be used to avoid stress cracking or solder joint damage.Dam enclosure molding: in order to limit the filling area, it is necessary to use paste dam enclosure glue to construct the boundary first. It is required that the material does not collapse, the surface drying speed is fast, and it is compatible with the subsequent silicon gel, without “poisoning”.face challenges The sealing thickness is large, and if the material shrinks or generates stress, it is easy to cause virtual soldering of solder joints and damage to components.Conventional dam sealant is easy to collapse or slow to solidify, affecting the process efficiency, and some materials are incompatible with silicon gel, which may lead to incomplete solidification.The working environment of PCB is complex, and moisture-proof, waterproof, dustproof, and temperature resistant performance are indispensable. product solution

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Charging module MOS tube bottom heat dissipation adhesive solution | SIPA 1921 thermal conductive silicone

2025-09-18

In the current trend of fast charging, continuous miniaturization and high power of power modules, MOS transistors, as core power devices, often need to withstand high currents, high temperatures, and frequent working impacts. The heating problem of MOS transistors directly affects the efficiency and reliability of the entire charging module. If the heat dissipation is not timely, there may be a risk of excessive temperature rise, device performance degradation, or even failure.Therefore, how to achieve efficient heat dissipation at the bottom of MOS transistors while balancing adhesion and reliability has become a focus of attention for major power supply manufacturers.Background and ChallengesIn practical applications, there are several common solutions for heat dissipation at the bottom of MOS tubes in charging modules, including:Thermal pad: requires manual cutting and screw fixation, making assembly complex;Gap Filler: Similar to a soft cushion after curing, it has thermal conductivity but no adhesive force;RTV thermal conductive silicone: has adhesive properties, but has a long curing time at room temperature, which is not conducive to mass production;Thermal conductive silicone grease: It has good thermal conductivity in the initial stage, but it is prone to drying out after high temperature and long-term aging, resulting in a significant decrease in thermal conductivity.These traditional methods either have complex processes or lack long-term reliability, and cannot simultaneously meet the needs of “bonding+thermal conductivity+reliability”.Solution: SIPA 1921 high thermal conductivity siliconeTo solve this problem, a customer introduced Elaplus SIPA 1921 single component high thermal conductivity silicone gel in the bottom heat dissipation bonding process of MOS tubes.This material adopts a thermosetting and molded silicone system, and achieves a balance between high thermal conductivity and high strength adhesive force through a special liquid powder two-phase combination process. Bottom heat dissipation adhesive of MOS tube in charging module120 ℃ can cure in 30 minutes, greatly…

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Case study of connector PIN needle gluing | Low viscosity and high reliability, helping high-performance electronic packaging

2025-09-18

In the field of electronic manufacturing, the sealing and sealing of connector PIN pins is a key step in ensuring the long-term stability and performance of products. Recently, we solved the challenge for a customer to simultaneously meet the complex requirements of reflow soldering heat resistance, high adhesion, low viscosity and easy sealing of the potting adhesive in a PA6+GF30% shell+PIN needle tin plated structure.Customer ChallengeSpecial structureThe shell is made of PA6+GF30% reinforced nylon, and the surface of the PIN needle is plated with tin, which requires high adhesion of the adhesive and significant differences in thermal expansion coefficients between different materials.Strict process requirementsIt must undergo reflow soldering process, requiring the adhesive to have excellent high-temperature resistance and not bubble, crack or fail at high temperatures.Sealing process restrictionsThe sealing adhesive needs to have low viscosity (≤ 3000 mPa · s) to ensure smooth flow into the gap between the PIN needle and the housing, forming a complete seal.Insulation and protective performanceIt must have good electrical insulation performance and long-term stability against moisture and dirt.SolutionWe provide our customers with two high reliability organic silicone adhesive systems, which ultimately form the following technical matching:Sealing and sealing of connector PIN pinsOption 1: SIPA 8715 adhesive sealantCore advantages:1: 1 two-component addition molding silicone, with strong adhesion, can be used with PA nylon without the need for a primer PBT、 Good adhesion of common polar materials such as tin plated copperLow viscosity (better than 3000 mPa · s), excellent flowability, able to accurately fill small gapsCan be cured at room temperature or by heating, convenient for flexible process adjustmentNo by-products during solidification, avoiding bubbles and stress concentrationWide working temperature range (-60 ℃~220 ℃), fully capable of reflow soldering thermal shockOption 2: SIPC 9030 RTV sealant Core advantages:Single component neutral curing, room temperature moisture absorption curingGood…

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【 Case Study 】 Analysis of Damping Terminal Sealing Process and Adhesive Solution: SIPC 2130 and 1908 Double Adhesive Combination, Excellent Performance!

2025-09-18

In the field of precision electronic components, the sealing treatment of damping terminals is a key link to improve product reliability and extend service life. It can not only effectively isolate the erosion of the external environment, but also endow the terminal with excellent mechanical properties. Today, we will delve into a successful case of damping terminal sealing, revealing how to achieve a dual improvement in performance and efficiency through precise adhesive solutions.1、 Project Background: Challenges and Opportunities CoexistThis case focuses on the encapsulation of high-performance damping terminals. Faced with increasingly stringent market demands, our engineering team needs to address a series of technical challenges while ensuring the insulation and durability of electronic connections within the terminals. The core goals include: using black adhesive on the front-end to achieve light blocking and aesthetics; The backend needs to use transparent adhesive for easy detection; More importantly, the adhesive must adhere tightly to the fiberglass material and have moderate hardness and excellent resilience after curing to cope with complex mechanical stresses. 2、 Elaborate on the requirements for adhesive: considerations for continuous improvementClear color differentiation and diverse functionsFront end black adhesive: mainly responsible for preventing light, peeping, and enhancing the integrated appearance of the product. Black can effectively absorb and block light, protect internal sensitive components from light exposure, and enhance the professionalism and sophistication of the product.Backend transparent adhesive: The core value lies in its transparency. It allows engineers to visually inspect the sealing quality, such as the condition of bubbles, gel filling, and the position of internal components, and is an indispensable part of quality control and process optimization.Excellent adhesion performance, seamlessly integrated with fiberglassThe surface characteristics of fiberglass materials commonly used in damping terminals pose a challenge to the adhesive strength of glue. We require the adhesive to achieve seamless…

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PCB dam sealing and potting – guardians of electronic components

2025-09-18

In the trend of miniaturization and high integration of modern electronic products, the protection of electronic components has become particularly important. The dam enclosure and sealing process, as important means in the field of electronic protection, provides comprehensive protection for electronic products, effectively improving their reliability and service life. Dam enclosure technology: building a solid defense lineThe enclosure process, as the name suggests, is to form a “dam” around electronic components or circuit boards to restrict the flow range of subsequent sealant. This’ dam ‘is usually formed by colloids with high viscosity, which not only ensures that the sealant evenly covers the target area, but also avoids colloid overflow and contamination of non target areas.The role of dam enclosure technology:Precise control of sealing range: The dam sealant can precisely define the sealing area, avoiding the sealant from flowing into areas that should not be covered, such as connectors, heat sinks, etc., ensuring the functional integrity of the product.Save material costs: By limiting the amount of sealant used, reduce colloid waste and thus lower production costs.Improving product aesthetics: The dam can make the edges of the sealant neat and beautiful, enhancing the overall appearance quality of the product.Enhance local protection: For certain areas that require local key protection, a dam can form a thicker protective layer, providing stronger mechanical support and environmental protection.Elaplus SIPC 2150 dam sealant: Building a solid foundation for protectionIn order to meet the demand for high-performance protection in electronic products, Elaplus has launched SIPC 2150 single component dealcoholized/environmentally friendly sealant silicone as an ideal choice for dam enclosure processes.As a neutral dealcoholized adhesive sealant, SIPC 2150 has excellent mechanical properties and excellent adhesive sealing performance for PC, PA plastic, concrete, wood, felt, EVA foam, metal (iron, aluminum, stainless steel) and other materials. Core advantages of SIPC 2150:Low…

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