Adhesive solution for industrial electronics

SIGEL 1875 Self-Healing Silicone Gel Potting Solution for MAF Sensor

In automotive electronic systems, the Mass Air Flow (MAF) sensor can be regarded as the engine’s respiratory monitor. It real-time measures the intake air flow and provides critical data for the ECU to precisely calculate fuel injection quantity. Once this precision component fails due to moisture ingress, thermal shock or mechanical stress, it will lead to increased fuel consumption and reduced power at the mild level; in severe cases, it triggers the engine warning light or even vehicle breakdown. However, many engineers overlook a core point during material selection: the performance of potting material directly determines the service life limit of the sensor. Four Major Technical Challenges for MAF Sensor Potting The operating environment of MAF sensors is far harsher…

5mm Full Depth Curing!ELAPLUS UV1020: Redefining the Performance Peak of White UV Dynamic Balancing Adhesives

UV-curing adhesives have long been a key tool for improving production line efficiency in precision rotating component manufacturing, motor rotor dynamic balancing, and sensor packaging, thanks to their second-level curing speed. However, the industry has long faced a tough technical pain point: the “incomplete curing” issue of white/thick-layer UV adhesives. When the adhesive layer exceeds 3mm, traditional white UV adhesives often suffer from surface hardening but residual soft adhesive at the bottom. This not only causes a sharp drop in bonding strength but also hides quality risks such as falling off and imbalance for long-term product operation. Today, ELAPLUS officially launches UV1020 UV curable acrylic dynamic balancing adhesive. With its breakthrough deep-layer curing technology, it completely breaks the performance bottleneck…

Repairable Silicone Gel for Cable Junction Box Potting: In-depth Analysis of SIGEL 1805 & SIGEL 3078

In power transmission, communication infrastructure and industrial automation industries, cable junction boxes are core components for connecting and protecting cable joints. Their waterproof, moisture-proof and weather resistance directly determine the operational reliability of the entire system. Traditional potting materials have obvious application drawbacks: non-repairable after curing, failure prone to moisture, narrow temperature resistance range, etc. These issues raise maintenance costs and bring potential safety risks. ELAPLUS launches two repairable silicone gels, SIGEL 1805 and SIGEL 3078. Featuring premium performance and easy repairability, they deliver an innovative technical solution for cable junction box potting. Ⅰ. Industry Pain Points of Traditional Potting Materials 1. Core Requirements for Cable Junction Box Potting Core Demand Specific Requirement Performance Index Waterproof & Moisture-proof Block moisture intrusion and protect…

AI-Driven Computing Leap: How ELAPLUS Solves 1.6T Optical Module Thermal Challenges with High-Performance TIM Solutions

Driven by the AI and large language model revolution, global data centers are experiencing an unprecedented computing power arms race. As the “capillaries” supporting massive data transmission, high-speed optical communication modules are evolving at an unprecedented pace. As transmission rates advance from 100G to 800G/1.6T, optical module power consumption has surged from 3W to over 15W. With exponentially increasing heat density per unit volume, thermal design is no longer a simple auxiliary feature but a critical technical bottleneck determining module performance, stability and reliability. 01 What Causes Thermal Failure? The “heart” of an optical module is its internal TOSA (Transmitter Optical Sub-Assembly) and ROSA (Receiver Optical Sub-Assembly) components. Chip power consumption grows exponentially with transmission rates: a typical 100G module…

SIPA 1850 Thermal Potting Compound: An Ideal Heat Dissipation Solution for High-Power Fast Charging Era

With the widespread adoption of fast charging technology, chargers have evolved into compact, high-precision power conversion units. However, higher power density brings severe challenges: poor heat dissipation, moisture ingress and drop damage — three core factors that shorten the service life of chargers. How to ensure long-term stable operation of electronic components in limited space? ELAPLUS presents the optimal solution: SIPA 1850 Thermally Conductive Potting Compound. Hidden Pain Points in the Charger Industry Hardware failures account for a major proportion of after-sales costs for electronic manufacturers. The key industry pain points of chargers are as follows: ※Excessive heat accumulation: Rising PD fast charging power leads to surging heat generation of internal components. Unremoved heat will cause power reduction and accelerate aging…

Efficiency Meets Security: PUR 1603 A/B Two-Component Adhesive for PCB IC Encapsulation

In the modern electronics manufacturing industry, integrated circuits (ICs), serving as the “core brain” of devices, are critical to operational stability and design security. As electronic components evolve toward miniaturization and high integration, IC chips on printed circuit boards (PCBs) are exposed not only to complex mechanical stress,moisture corrosion and chemical erosion, but also to the risk of technology leakage. Traditional encapsulation materials often struggle to balance curing speed, stress relief and cost control. For this reason, PUR 1603 A/B two-component solvent-free room-temperature curing adhesive has become an ideal choice for IC encapsulation on printed circuit boards, thanks to its excellent physical properties and process adaptability. I. Core Technology: Resolving the Conflict Between High Efficiency & Low Stress IC encapsulation on…

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Industrial electronics

SIGEL 1875 Self-Healing Silicone Gel Potting Solution for MAF Sensor

5mm Full Depth Curing!ELAPLUS UV1020: Redefining the Performance Peak of White UV Dynamic Balancing Adhesives

Repairable Silicone Gel for Cable Junction Box Potting: In-depth Analysis of SIGEL 1805 & SIGEL 3078

AI-Driven Computing Leap: How ELAPLUS Solves 1.6T Optical Module Thermal Challenges with High-Performance TIM Solutions

SIPA 1850 Thermal Potting Compound: An Ideal Heat Dissipation Solution for High-Power Fast Charging Era

Efficiency Meets Security: PUR 1603 A/B Two-Component Adhesive for PCB IC Encapsulation

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