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Integrated adhesive solution for electronic devices

Industrial electronics

Industrial electronics

Industry Application Consumer Electronics

Potting Compounds for High Power Density Motors: Thermal Conductivity Alone Is Not the Only Criterion

In recent years, the development of high power density motors has been driven forward by humanoid robots, industrial robots, electric vehicles (EVs), unmanned equipment and industrial automation machinery. As motors become more compact yet deliver higher output power, the conventional potting mindset of “just fill the cavity” is no longer adequate. Whether it is potting compound for robot joint motors or thermally conductive potting adhesive for EV drive motors, engineers now focus on a complete thermal management system and long-term reliability rather than thermal conductivity as a standalone metric. This explains why more engineers are searching for answers to the following questions: ■ How to select potting compounds for motors? ■ Recommended thermally conductive potting adhesives for motors ■ Potting materials for robot joint…

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How to Select Adhesives for Bonding & Fixing Inductors

Required Performance of Inductors Bonding Fixing Adhesives Inductors, coils, magnetic cores and power electronic components are subject to long-term temperature rise, mechanical vibration, thermal cycling and electrical stress during operation. Inductor Potting Compound Insufficient bonding strength of fixing adhesives, or cracking & debonding after curing, may lead to loose inductors, abnormal noise, pin fatigue or even abnormal electrical performance. Therefore, adhesives for bonding and fixing inductors must meet all the following requirements: ■ Excellent adhesion to magnetic cores, metals, PCBs and plastic bobbins; ■ Good anti-sagging property after dispensing to retain the shape of adhesive dots and lines; ■ High structural strength after full curing; ■ Outstanding electrical insulation performance; ■ Resistance to high-low temperature cycling and long-term operating temperatures; ■ Compatible with manual dispensing and…

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Selection Guide for IC Chip & Electronic Component Reinforcement Adhesives: Epoxy vs UV Silicone

Why IC Chips & Electronic Components Require Reinforcement In chips, sensors, connectors and precision electronic assemblies, solder joints, pins and dissimilar material interfaces are vulnerable to vibration, mechanical shock, thermal cycling and moisture. Applying adhesives to reinforce chip corners, component undersides, pin root bases and plastic-metal joints delivers the following benefits: ■ Secure fixation of IC chips and electronic components ■ Reduce mechanical stress borne by solder joints ■ Boost assembly resistance to vibration and impact ■ Provide electrical insulation, moisture resistance and sealing protection ■ Enhance structural stability under wide temperature cycling However, reinforcement locations impose different requirements on adhesive flowability, hardness and curing methods. LILIAN offers three specialized formulations for diverse electronic reinforcement processes: EP 1738-1, EP 2090 and SIPC UV 3302. EP…

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Selection Guide for Potting Compounds for Robotic Joint Motors: EP1715(2#) Enables Heat Dissipation and Reliable Encapsulation of Frameless Torque Motor Stators

With the rapid advancement of embodied intelligence, humanoid robots, collaborative robots and precision servo systems, robotic joint modules are being upgraded toward miniaturization, lightweight design and higher power density. Featuring a compact structure, fast response and direct power output, frameless torque motors have become key drive components in robotic joints. However, the increased power density leads to more concentrated heat generation in motor stator windings with limited heat dissipation space. Stator potting compound is no longer just an auxiliary material but a critical factor determining the reliability of joint motors. For robotic joint motors, potting compound does not merely fill gaps. It transfers heat from windings to the housing to reduce local heat accumulation, secures windings to improve vibration resistance,…

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EP 1716 Thermal Conductive Epoxy Potting Compound – Customized for Stators of Frameless Torque Motors in Humanoid Robots

As humanoid robots enter a phase of rapid development, frameless torque motors—the core drive components—act as the “muscle system” of robot joints. However, numerous engineers repeatedly highlight a critical challenge in practical engineering design:  Motor stators generate severe heat within an extremely compact structural space. How to simultaneously resolve heat conduction, electrical insulation and crack resistance issues? The solution lies in one core material: ■ EP 1716 High Thermally Conductive Epoxy Potting Compound Why Potting Is Mandatory for Frameless Torque Motors The structural characteristics of frameless torque motors make potting materials indispensable: ■ High torque density → concentrated heat generation ■ No housing air cooling → poor heat dissipation ■ Compact construction → short heat transfer paths ■ Long-term operation under low speed and high…

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ELAPLUS EPUV 2081 UV-Curable Epoxy Adhesive – Recommended for PCB & Wire Harness Fixation

Secure bonding between PCBs and wire harnesses is critical for automotive electronics, sensor modules, industrial control boards, battery management systems (BMS), connectors, FPC flexible circuits and miniature electronic modules. Wire terminals, solder joints, connectors and PCB bonding areas are constantly exposed to vibration, tension, thermal cycling, moisture and assembly stress during service. Improper adhesive selection may lead to common failures including loose wiring, cracked solder joints, displaced terminals, local delamination and degraded electrical reliability. Therefore, fixation for PCB-wire harness assemblies requires more than basic adhesion. Key factors to evaluate include curing speed, bonding strength, thixotropy, thermal resistance, low shrinkage and compatibility with electronic manufacturing processes. ELAPLUS Functional Materials (Shanghai) Co., Ltd. has developed EPUV 2081 single-component UV-curable epoxy adhesive, a…

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Bonding • Sealing • Thermal conductive

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