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Integrated adhesive solution for electronic devices

Industrial electronics

Industrial electronics

Industry Application Consumer Electronics

How to Select Potting Compound for Liquid‑Level Sensors? “Water‑Resistant” Does Not Equal “Oil‑Resistant”

When selecting potting and sealing materials for liquid‑level sensors, the primary question shall be: What medium will the sensor be immersed in long‑term? Instead of simply asking: “Is this adhesive waterproof?” Water, engine oil, fuel, coolant, brake fluid and other industrial media exert completely different effects on polymer materials. ELAPLUS industrial sensor solutions treat oil‑resistant sealing as an independent application category, separate from bulk potting, pin sealing and substrate fixation. Six Conditions to Confirm Before Material Selection for Liquid‑level Sensors Condition Rationale Medium name Determines chemical compatibility of material Medium temperature High temperature accelerates material aging Immersion duration Short‑term exposure ≠ long‑term immersion Presence of pressure Affects medium penetration at interfaces Housing material Influences bonding performance Chip‑to‑adhesive contact status Determines…

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How to Select Encapsulation Materials for MEMS? Is FSGEL 3200C Fluorosilicone Gel Suitable for MEMS Chip Protection?

MEMS encapsulation materials shall balance low‑stress performance, environmental protection, media resistance and precision dispensing capability. For pressure sensors, automotive sensors and industrial MEMS devices, soft gel can be adopted for local protection when rigid potting materials may impose mechanical stress on sensitive structures. ELAPLUS FSGEL 3200C is a one‑component thixotropic fluorosilicone gel. It delivers flexible coating for MEMS chips, solder joints and lead areas, and is applicable for sensor encapsulation exposed to harsh media such as oil, fuel, solvents and moisture. This marks one major difference between MEMS encapsulation and ordinary PCB potting: MEMS encapsulation is not merely “sealing the chip”. It aims to provide protection while minimizing material‑induced interference to sensitive structures. Why Low‑stress Materials Are Required for MEMS…

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How to Select Potting Compound for Steering‑Angle Sensors: Positional Accuracy Matters More Than Ultra‑High Bonding Strength

For adhesives used in steering‑angle, position and magnetic‑encoding sensors, fixation is not the only priority. It is critical to maintain stable relative component positions after curing, vibration exposure and temperature variation. Even if no delamination occurs, large cure shrinkage of potting material may lead to position deviation, zero‑point shift or output errors. Material Requirements for Different Zones of Steering‑Angle Sensors Zone Key Requirements Magnet Stable positioning Hall / magneto‑sensitive component Low‑stress fixation PCB Moisture resistance PIN pins Waterproofing Housing Sealing performance Wiring harness Vibration resistance Why Dimensional Stability Is Critical The theoretical gap between magnet and Hall chip is fixed. A dimension change of 0.X mm in potting layer may be negligible for general mechanical parts, yet it requires thorough validation…

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How to Select Potting Compound for TPMS Tire‑Pressure Sensors: Harsh Operating Conditions Inside Tires Are More Complex Than Expected

Adhesives for TPMS tire‑pressure sensors must cope with far more than water resistance. They also need to withstand continuous vibration generated by tire rotation, thermal cycling, PCB and chip protection, moisture and long‑term mechanical shock. Therefore, TPMS potting shall prioritize low‑stress performance, electrical insulation, vibration resistance and environmental stability, rather than simply selecting materials with maximum hardness. What Components Need Protection Inside TPMS Component Main Risks Material Requirements MEMS chip Stress, moisture Low‑stress protection PCB Vibration, moisture Potting & moisture‑proofing Solder joints Cyclic loading Stress buffering Battery connections Vibration Mechanical fixation Housing Moisture ingress Sealing Why Polyurethane Deserves Consideration If your TPMS requires moderate mechanical protection while avoiding overly rigid high‑modulus epoxy systems, flexible polyurethane potting materials are worth evaluation….

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How to Select Potting Compounds for Temperature Sensors: Poor Thermal Conductivity of Adhesives May Slow Down Sensor Response

The biggest difference between adhesives for temperature sensors and general‑purpose electronic potting materials lies in that the material not only protects components, but also forms part of the heat transfer path from the measured environment to the sensing element. Therefore, potting compounds for temperature sensors shall balance thermal conductivity, electrical insulation, filling performance, temperature resistance and stress‑relief properties, rather than simply pursuing maximum sealing tightness. Within ELAPLUS existing sensor solutions, thermal greases, potting silicones or thermally conductive silicones can be adopted inside temperature sensors to achieve favorable thermal conductivity and fast response. Quick‑Selection Guide for Temperature‑Sensor Adhesives Epoxy encapsulation for NTC components potting for temperature‑pressure sensors potting for temperature‑sensor wire harnesses Structure Main Challenge Material Key Considerations NTC components &…

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How to Select Potting Compounds for Automotive Pressure Sensors: Different Design Philosophies for Core‑Element Protection vs Housing Sealing

When selecting adhesives for automotive pressure sensors, simply searching for “high‑temperature waterproof potting compound” is not sufficient. You need to break down the structure into sensing core element, PCB/leads, housing, pin terminals and media‑contact zones. For the core element, low‑stress performance and long‑term stability are prioritized. For housing sections, adhesion and sealing stand as key requirements. For full‑cavity potting, flowability, insulation and thermal‑cycle resistance must also be taken into account. ELAPLUS sensor‑oriented solutions separate oil‑resistant sealing, pin‑terminal sealing, FPC fixation, ceramic‑substrate bonding and overall potting, instead of adopting one single material for all positions. Pressure Transmitter Table: Adhesive Selection for Different Zones of Pressure Sensors Application Position Primary Task Key Considerations Selection Direction Pressure‑sensing core Sensitive‑component protection Low stress, electrical…

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