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Certification
ISO9001/ISO14001/IATF16949
ROHS/UL/REACH/ FDA+86 13291521819
EP1716A/B 2K Thermal conductive Epoxy potting material
Color: A:Black liquid; B:Light yellow liquid
Viscosity(25°c,m Pa·with): A:40,000+10,000;B:100+50
Appication: tis suitable for packagqing protection of products with hioh themal conductity requirementsinmotors, automotive electonics. oertools reactors.and instrumenis. and has excelent adhesion ai
temperature resistance.
- color: A:Black liquid; B:Light yellow liquid
- viscosity(25°C,m Pa·with): A:40,000±10,000; B:100±50
- Application：It is suitable for packaging protection of products with high thermal conductivity requirements in motors, automotive electronics, power tools, reactors, and instruments, and has excellent adhesion and temperature resistance.
Product Details
Product description
EP 1716A/B is a two-component solvent-free ambient curing epoxy potting material that can also be cured by temperature. It is suitable for packaging protection of products with high thermal conductivity requirements in motors, automotive electronics, power tools, reactors, and instruments, and has excellent adhesion and temperature resistance.
Product characteristics
■ Excellent adhesion and crack resistance
■ Low CTE linear expansion coefficient
■ High thermal conductivity
■ Excellent electrical insulation and stability
■ It can be used for a long time at -50–150 °C
■ Very low water absorption, good waterproof, moisture-proof
Technical parameters before and after curing:
| Before curing | Test the project | Test standards | unit | PART A | PART B |
| color | Visual inspection | — | Black liquid | Light yellow liquid | |
| viscosity | GB/T 10247-2008 | 25°C,m Pa·with | 40,000±10,000 | 100±50 | |
| density | GB/T 13354-92 | 25°C,g/cm3 | 2.6±0.1 | 0.95±0.05 | |
| Mixing ratio | Mass ratio | Ratio=A:B | 100：5 | ||
| Mixed viscosity | GB/T 10247-2008 | 25°C,m Pa·with | 6,000±1,500 | ||
| Operation time | GB/T 10247-2008 | 25℃，min | 60 | ||
| After curing | hardness | GB/T 531.1-2008 | Shore D | 90 | |
| Thermal conductivity | GB/T 10297-1998 | W/mK | 1.5 | ||
| Coefficient of expansion | GB/T 20673-2006 | μm/(m,°C) | 25, < Tg62, > Tg | ||
| Glass transition temperature | DSC | ℃ | 95, curing 80°C 3hr; 105, curing 120°C 2hr; | ||
| Shear strength | GB 6328-86 | MPa，Fe-FeMPa,Al-Al | ≥10≥8 | ||
| Dielectric strength | GB/T 1693-2007 | kV/mm(25°C) | ≥18 | ||
| Loss factors | GB/T 1693-2007 | （1MHz）(25℃) | 0.09 | ||
| Dielectric constant | GB/T 1693-2007 | （1MHz）(25℃) | 3.1 | ||
| Volume resistance | GB/T 1692-92 | DC500V,Ω· cm | 1.00E +15 | ||
| Use temperature | GBT 20028-2005 | ℃ | -50–150 | ||
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