• Certification
    ISO9001/ISO14001/IATF16949
    ROHS/UL/REACH/FDA
    Mail Contact
    kennis.zhu@elaplus.cc

    +86 18116225322

    Welcome to be our distributor

Industry Application

Home » Industry Application »

Excessive Unbalance after Motor Magnet Bonding? Check Adhesive Distribution and Runout First

2026-11-02

When excessive unbalance, rising vibration or abnormal noise occurs on motor rotors after magnet bonding, priority shall be given to checking magnet mass distribution, bond-line thickness, circumferential squeeze-out, rotor concentricity and cured assembly position, instead of immediately concluding insufficient structural bond strength. For robot joint motors, industrial servo motors and high-speed brushless motors, magnet bonding must deliver structural reliability while preventing mass distribution changes caused by inconsistent adhesive dosage and assembly deviation. Permanent magnet motor rotors generally consist of rotor core, magnets, shaft and required retention features. Once magnets are installed with adhesives or hybrid fastening methods, bond-line thickness and magnet placement affect rotor geometry, and local adhesive variation alters rotating mass distribution. Therefore, acceptable bonding and acceptable dynamic balance are two separate engineering judgements. Bond strength tests evaluate joint reliability, but cannot replace rotor runout, mass distribution and dynamic balance tests. 1. Why Does Unbalance Occur after Magnet Bonding? Under high-speed rotation, uneven mass distribution generates periodic centrifugal excitation. Deviations in magnet installation position, bond-line thickness or rotor geometry may shift the centre of mass away from the rotational axis and worsen vibration. During magnet assembly, inconsistent adhesive volume under individual magnets or excess adhesive squeezed and accumulated at a certain circumferential position changes cured mass distribution. For precision motors with small rotor diameter and high rated speed, even minor local mass variation must be assessed against dynamic balance requirements. Unbalance is not necessarily caused by the adhesive itself. Magnet mass tolerance, shaft eccentricity, core dimensional deviation, fixture error and bearing condition all affect test results. Phased inspection is required to locate the root cause. 2. How to Distinguish Issues from Adhesive Volume, Magnet Assembly and Rotor Geometry? It is recommended to record the baseline geometry of the rotor core before magnet mounting, inspect position and clearance after magnet…

More

Adhesive for Resolver Terminals? SIPC 1822 Silicone Protection Solution

2026-11-02

ELAPLUS SIPC 1822 one-component silicone adhesive sealant can be used for partial encapsulation protection of resolver terminals and lead connection zones. It is formulated to meet requirements for electrical insulation, moisture-proof sealing, lead retention and mechanical stress buffering. For resolvers used in servo motors, robot joint motors and new energy vehicle motors, the dispensing range, bond thickness and curing conditions shall be properly controlled to prevent adhesive creep into the air gap between stator and rotor or interference with precision assembly. A resolver is a critical component of motor position feedback systems, generally consisting of stator, rotor, windings, insulation bobbin and terminal connections. Stator winding leads are electrically joined to external circuits by soldering or other methods. The terminal region must maintain stable electrical performance under motor vibration, temperature cycling and long-duration operation. For resolver terminals confined in tight spaces, the adhesive shall protect joints while avoiding excessive local stiffness. Partial fixation and encapsulation with flexible silicone is a viable candidate protection approach. 1. Why Do Resolver Terminals Require Dispensed Adhesive Protection? Resolver terminals are usually connected to fine winding leads. Some assemblies also include metal solder tabs, plastic bobbins and harness junctions. During continuous motor operation, mechanical vibration and harness pull loads transfer to the root of terminals, subjecting solder joints to cyclic stress. In addition, ambient moisture and contaminants may compromise insulation around metal terminals and long-term joint stability. For eligible connection structures, silicone forms a local protective layer that reduces direct exposure of joints to environmental factors. Adhesive dispensing cannot replace qualified soldering or mechanical terminal retention. Improper lead routing, defective solder joints or inadequate mechanical fixation cannot be fundamentally resolved simply by applying more adhesive. 2. How to Diagnose Common Defects after Dispensing on Resolver Terminals Common failures include loose lead roots, incomplete terminal coverage, edge…

More

Adhesive for Mounting Glass to Stainless Steel? EP 2025 Epoxy Bonding Solution

2026-11-02

ELAPLUS EP 2025 epoxy adhesive can be evaluated for bonding glass to stainless steel. Key control items include the thermal expansion mismatch between glass and metal, bond line thickness, bond area and residual stress generated during curing. For instrument viewing windows, equipment glass panels, sensor protective covers and metal frame assemblies, the adhesive must not only form stable interfacial bonds but also prevent local stress concentration that leads to glass cracking, edge delamination or seal failure. Glass is rigid yet sensitive to local tensile stress and edge defects. Stainless steel delivers good mechanical strength and machinability, but its thermal expansion behaviour differs from glass. Once joined by an adhesive layer, temperature fluctuation, assembly tolerance and external loads may translate into shear stress and peel stress at the bond interface. Therefore, bonding glass to stainless steel cannot be judged merely by initial bond strength. Comprehensive evaluation must consider structural design, material properties and long-term service conditions. 1. Why Do Glass-to-Stainless Steel Bonds Fail Easily? In industrial equipment, glass and stainless steel are commonly assembled via face bonding, perimeter frame bonding or inset mounting. Due to differing coefficients of thermal expansion, the two substrates expand and contract unequally when subjected to heating, cooling or thermal cycling. For ordinary soda-lime glass and common austenitic stainless steel, stainless steel generally has a higher linear expansion coefficient. Under temperature variation, an overly thin bond line, excessively large bonded area or rigid structural restraint may subject the interface to high shear and peel loads. The exact discrepancy depends on glass type, stainless steel grade and operating temperature range. In addition, tiny nicks on glass edges, oil contamination on stainless steel, uneven bond-line thickness and over-clamping during assembly can all trigger premature failure. Some joints appear strong at room temperature but delaminate after thermal cycling or prolonged…

More

Waterproof Potting Compound for Industrial Foot Switches? Selection of SIPC 1835 A/B Silicone

2026-11-02

ELAPLUS SIPC 1835 A/B two-component silicone potting compound is recommended for evaluation when internal electronic zones of industrial foot switches require waterproofing, moisture proofing and electrical insulation protection. It features elastic properties after cure, low shrinkage and protection for electronic devices, making it a candidate material for permitted potting zones inside foot switches. For assemblies with mechanical contacts, return springs and movable pedals, the stationary electronic cavity must be separated from moving mechanisms. The entire switch shall not be fully filled with adhesive. Industrial foot switches are widely used in automation equipment, machining machinery, test jigs and industrial control systems. Operators control equipment start-stop, signal input and other functions via foot actuation, so the switch must maintain stable electrical connections and mechanical performance under repeated cycling. Some foot switches use mechanical microswitches, while others adopt magnetic sensing, Hall effect or other non-contact detection structures. Adhesive application positions differ significantly between designs, and waterproof potting solutions are not universally interchangeable. 1. Why Do Industrial Foot Switches Require Potting Protection? Foot switches are generally mounted under machinery or near workstations, where they may be exposed to dust, water droplets, cleaning fluids and mechanical vibration. For units with internal PCBs, sensors or electronic signal processing modules, properly designed potting provides insulation and environmental protection for designated electronic areas. Nevertheless, waterproofing of foot switches does not rely entirely on internal potting. Pedal shafts, housing seams, cable outlets and other moving interfaces can also serve as ingress paths. Potting only the PCB while neglecting sealing at the housing and cable entry points will still allow moisture to penetrate other areas. Conversely, overfilling adhesive into moving mechanical zones to achieve full coverage may impair pedal return and contact operation. Therefore, material selection for industrial foot switches must treat electronic protection, housing sealing and mechanical movement separately….

More

Adhesive for Bonding TPU to TPU? ELAPLUS PUR 1602 Solution for Flexible Material Bonding

2026-11-02

ELAPLUS PUR 1602 adhesive can be evaluated for TPU-to-TPU bonding. Key verification items include flexibility matching between the bond line and TPU substrates, interfacial adhesion, and joint stability after repeated flexing. For flexible sleeves, elastic structural parts and industrial protective components, the adhesive shall not only form a reliable bond but also avoid overly rigid local bond lines that restrict product deformation. TPU is a thermoplastic polyurethane elastomer with good abrasion resistance and elasticity, widely used for cable jackets, industrial protectors and flexible structures. Different TPU grades vary in hardness, surface condition and processing method, so the performance of the same adhesive may differ across materials. 1. Why Flexibility Matters for TPU-to-TPU Bonding For TPU assemblies subject to repeated bending or stretching, mismatch in deformability between the bond line and substrate can concentrate stress at the bond edge and shorten joint service life. For TPU parts only for static positioning, selection focuses mainly on adhesion strength and dimensional stability. For dynamic flexible structures, reliability under repeated flexing, peeling and long-term deformation shall be further evaluated. 2. Material Selection with PUR 1602 for TPU Bonding ELAPLUS PUR 1602 is a candidate grade for TPU-to-TPU joints. Suitability shall be verified against material grade, cured adhesive properties and actual service conditions. Application Requirement Selection Focus Recommended Validation TPU flexible sleeve Bond line flexibility and adhesion Flex test and peel test TPU industrial protector Bond area and structural strength Tensile test and environmental ageing TPU sealing structure Continuity of the adhesive layer Seal test and deformation test TPU positioning component Dimensional stability and assembly accuracy Dimension check before and after cure 3. Process Control for TPU Bonding Before bonding, confirm that TPU surfaces are free of obvious grease, dust and processing residues. For different TPU grades or specially surface-treated TPU, compatibility tests shall be…

More

Transparent Potting Compound for Photoelectric Reading Modules in Smart Water Meters? Selection of EP 1708 (7#) Epoxy Adhesive

2026-11-02

For transparent potting protection of photoelectric reading modules in smart water meters, ELAPLUS EP 1708 (Grade 7) two-component transparent epoxy potting compound is recommended for evaluation. It features high transparency, ambient or heat cure, and insulation protection for electronic components, suitable for photoelectric inspection and display assemblies qualified for epoxy encapsulation. For smart water meters adopting direct photoelectric reading, reflective detection or other optical sampling structures, it is critical to verify whether the potting layer interferes with the optical path, component positioning and long-term measurement stability. Transparency of the cured adhesive alone does not guarantee compliance with optical detection requirements. A smart water meter generally consists of a metering mechanism, signal acquisition unit, control circuit, communication module and other auxiliary structures. Different products may use magnetic induction, Hall detection, direct photoelectric reading or other signal collection methods, so the encapsulation requirements for internal electronic modules vary. For water meters with photoelectric detection, transmitters, receivers and associated circuits must operate stably under specified conditions. Some assemblies also require transparent protective materials for insulation, moisture resistance and structural retention. Unlike conventional opaque electronic potting, transparent potting compounds must satisfy basic electrical and environmental protection requirements, while also accounting for the influence of the adhesive layer on light transmission and detection signals. 1. Why Do Photoelectric Modules in Smart Water Meters Require Transparent Potting? The photoelectric sensing assemblies inside smart water meters use transmission, reflection or other optical principles to read the status of mechanical metering structures and convert it into electrical signals. If the detection zone requires a defined optical path, the transparency and optical compatibility of the potting material become key selection factors. Control circuits that do not participate in light transmission do not necessarily require transparent potting materials. A well-designed potting structure provides insulation and environmental protection for designated PCBs,…

More

Adhesive for Securing PCB Components in Industrial LED Lights? Selection of SIPC 1826 Silicone Adhesive & Sealant

2026-11-02

For local fixation and sealing of PCB components inside industrial LED luminaires, ELAPLUS SIPC 1826 one-component alkoxy-cure silicone adhesive sealant is recommended for evaluation. It leverages adhesion, elastic protection and sealing properties to provide auxiliary fixation for designated electronic components and structural joints. For industrial luminaires requiring heat resistance, insulation and long-term environmental reliability, the dispensing scheme shall be defined based on actual substrates, bond-line thickness, cure mechanism and operating temperature. General component fixation adhesives shall not be used as the primary thermal interface material. PCB Component Securing Industrial LED luminaires are widely used in factory lighting, equipment indicators, automated production lines, warehouse lighting and other industrial environments. Compared with ordinary indoor lighting, some industrial luminaires are subjected to continuous operation, equipment vibration, temperature cycling, dust and other harsh conditions. Within LED driver power supplies and control PCBs, capacitors, inductors, connectors and other components may require local auxiliary securing. For luminaires with metal housings, plastic brackets or separate wiring cavities, elastic sealing materials may also be required at specified joints. This application differs from full-board potting. Its main purposes are to restrain movement of local components, protect selected connection zones and achieve required structural sealing. 1. Why Do Industrial LED Luminaires Need Component Fixing Adhesive? PCBs inside industrial LED lights are usually mounted to the housing via screws, snaps or other fasteners. However, certain large or heavy components may still experience vibrational loads during shipping, assembly and service. For inductors, capacitors and other tall components on driver boards, properly applied local auxiliary fixation reduces uncontrolled relative movement and lowers mechanical stress on solder joints. That said, adhesive cannot replace the PCB’s primary mounting structure or the original soldering of components. For heavy components, mechanical retention, pad design and assembly clearance shall be verified first before deciding whether dispensing is required….

More

Slow Actuation of Solenoid Valve Coils after Potting? Check Armature Clearance & Temperature Rise First, Then Select PUR 1680 Polyurethane Potting Compound

2026-11-02

Manufacturer: ELAPLUS Electronic Adhesives Category: Industry Application Date: 22 Oct 2026, 10:54 AM If a solenoid valve exhibits slow pull-in, unstable operation or failure to act normally after coil potting, priority should be given to inspecting moving armature clearance, coil temperature rise, assembly alignment and adhesive overflow into non-potting zones, rather than immediately attributing the fault to insufficient insulation of the potting material. For stationary coils and terminal cavities requiring insulation, moisture resistance and auxiliary fixation, ELAPLUS PUR 1680(D70) A/B two-component polyurethane potting compound may be evaluated. Compatibility with the solenoid assembly must be verified on actual hardware. Coil Potting Solenoid valves are widely used in industrial automation, pneumatic controls, hydraulic systems, fluid control and various electromechanical equipment. The basic principle is that energising the coil generates a magnetic field to drive the movable armature, which actuates the mechanical structure to open, close or switch the valve. In some solenoid designs, the coil assembly is potted to protect windings, connection terminals and other fixed electrical components. A properly designed potting scheme provides insulation, moisture protection and mechanical retention. However, inappropriate potting scope, assembly positioning or thermal design can impair the performance of the electromagnetic actuator. Therefore, material selection for solenoid potting must balance electrical protection and mechanical movement requirements. The full encapsulation approach used for static electronic modules cannot be copied indiscriminately to all solenoid configurations. 1. Why Might Potting Cause Slow Pull-In? Reliable pull-in depends on electromagnetic force generated by the coil overcoming spring force, friction and other applied loads. Coil current, magnetic circuit geometry, armature position and operating temperature all affect final actuation. If potting material encroaches into regions intended for free movement, mechanical resistance increases and prevents the armature from travelling through its designed stroke. For constructions where the coil chamber is fully isolated from the armature,…

More

Adhesive for Bonding Automotive LCD Screens and Bezels? Application & Process Selection of SIPA 1830 H50

2026-11-02

For bonding automotive LCD screens to bezels, silicone adhesives featuring elastic bonding, temperature-cycle resistance and stable dispensing performance are recommended for evaluation as candidate materials for such display modules. For automotive display assemblies requiring a balance of bezel fixation, assembly precision and long-term environmental reliability, priority should be given to substrate compatibility, glue line position, assembly gap and curing process, rather than simply pursuing high initial bond strength. With the development of smart cockpits in new energy vehicles, central control screens, instrument displays, passenger entertainment screens and other automotive display modules impose stricter requirements on lightweight design, assembly consistency and long-term reliability. An automotive display module generally consists of a display panel, cover glass, bezel, bracket and related electronic components. Adhesives may be used for bezel fixation, local sealing or other structural joints depending on the design. It is essential to define the actual bonding area first. For joints between LCD panels and bezels, the material must not only secure parts during assembly, but also accommodate dimensional changes of dissimilar substrates under temperature variation. 1. Key Requirements for Bonding Automotive Screens and Bezels Automotive display screens must form structural joints within a narrow bezel width. The dispense position and cured profile of the adhesive directly affect assembly dimensions and cosmetic appearance. Compared with ordinary electronic housing bonding, display modules also require protection of optical zones, bezel positioning and controlled mechanical loading on the display panel. For large-size screens, the differential thermal expansion between bezel and display panel must also be considered in material selection. Therefore, bezel-bonding adhesives for displays must satisfy substrate adhesion, appropriate flexibility, process controllability and environmental reliability simultaneously. Selection Item Core Requirement Impact on Adhesive Selection Substrate Compatibility Adhesion to glass, metal or actual bezel materials Determines interfacial bonding reliability Glue Line Profile Suit narrow-bezel dispensing and…

More

COPYRIGHT ◎ 2023 Elaplus Functional Materials Co. LTD

Mail Mail
eddie.zhang@elaplus.cc
 WhatsApp WhatsApp
+86 155 1820 1251
WeChat WeChat
WeChat

sample request

We will reply within 24 working hours. If urgent, please help us to contact through email： kennis.zhu@elaplus.cc