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Geomagnetic Sensor Potting Adhesive | PUR 1661 Polyurethane Potting Compound – Waterproof Solution for Parking Spaces & Traffic Lights

2026-05-09

In the wave of smart city construction, geomagnetic sensors act as the perception nerve of intelligent transportation systems and play an increasingly critical role. Whether for intelligent billing of roadside parking spaces or intelligent timing control of traffic lights, geomagnetic sensors continuously collect data to support the intelligent operation of cities. However, these precision outdoor devices face severe challenges: How to equip these “behind-the-scenes heroes” with a sturdy protective shield? ELAPLUS PUR 1661 two-component polyurethane potting compound is specially developed to solve all these pain points. 1. Industry Pain Points & Challenges for Geomagnetic Sensors 1.1 Typical Application Scenarios Application Scenario Functional Requirement Typical Product Roadside Parking Space Parking occupancy detection & contactless payment Parking Detector Traffic Light Control Vehicle arrival detection & intelligent timing Vehicle Detector Smart Parking Lot Parking guidance & reverse car searching Space Detector Highway Traffic flow statistics & event detection Traffic Detector 1.2 Core Requirements for Potting Materials Core Requirement Specific Demand Performance Standard Fast Curing Limited on-site construction time Open time adjustable: 2~25 min High Strength Resist vehicle rolling pressure Hardness: Shore A67 Water & Moisture Resistance Block water penetration Extremely low water absorption Weather Resistance Long-term outdoor service Excellent weatherability Low-temperature Performance Stable operation in cold regions Superior low-temperature toughness Electrical Insulation Protect internal circuits Outstanding insulation performance Easy Application Convenient outdoor operation Pouch packaging & low viscosity 2. Solution: PUR 1661 Polyurethane Potting Compound 2.1 Product Introduction PUR 1661 is a two-component polyurethane potting material developed by ELAPLUS, customized for geomagnetic sensors and other outdoor electronic devices. 2.2 Six Core Advantages Advantage Description Fast Curing Open time optional from 2 to 25 min, adaptable to different construction schedules High Hardness Shore A67 hardness, no deformation under frequent vehicle rolling Pouch Packaging Easy for outdoor use, no complicated equipment required Low Viscosity Good fluidity and…

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Elaplus SIPC UV 3301: High-efficiency Silicone Conformal Coating Solution for PCB

2026-05-09

In the electronic manufacturing industry, the reliability of printed circuit boards (PCB) is the lifeline of electronic products. As electronic devices trend toward miniaturization and high integration, components on PCBs become increasingly densely arranged, making traditional single-cure conformal coatings face severe limitations. Conformal Coating for Gas Flow Meter One of the biggest challenges for engineers is shadow area curing dead zones. When UV light is blocked by tall components, the coating in shaded areas cannot cure completely, resulting in failed protection, short circuits, and even equipment corrosion. Today, we introduce Elaplus SIPC UV 3301, a UV/moisture dual-cure silicone conformal coating, and how it perfectly solves this industry pain point. I. Core Principle: Dual Curing Mechanism The key advantage of SIPC UV 3301 lies in its dual-protection curing design: Under UV irradiation at 300 mW/cm², the surface coating cures fully within 10 seconds to a tack-free state, greatly improving production line efficiency and throughput. 2.Moisture Secondary Curing (Full Shadow Cure) For shadow areas unreachable by UV light — such as component bottoms and pin gaps — the material absorbs atmospheric moisture to complete secondary curing. This mechanism ensures a tough elastic film forms in every gap of the PCB, completely eliminating risks caused by uncured residue. II. Extreme Temperature Resistance: -55℃ to 200℃ For automotive electronics, aerospace, and industrial automation equipment, drastic ambient temperature fluctuations are common operating conditions. SIPC UV 3301 delivers outstanding thermal stability: III. Excellent Electrical & Mechanical Properties SIPC UV 3301 excels in protective performance:Dielectric strength > 18 KV/mm, volume resistivity up to 3.5×10¹³ Ω·cm, providing reliable insulation protection under high-voltage working conditions. It also offers excellent shear adhesion to metals, glass, and various plastics including PC, ABS and PBT. Premium Applications: New Energy & High-end Manufacturing With its wide operating temperature range of -55℃ to 200℃,…

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SIGEL 1875 Self-Healing Silicone Gel Potting Solution for MAF Sensor

2026-05-08

In automotive electronic systems, the Mass Air Flow (MAF) sensor can be regarded as the engine’s respiratory monitor. It real-time measures the intake air flow and provides critical data for the ECU to precisely calculate fuel injection quantity. Once this precision component fails due to moisture ingress, thermal shock or mechanical stress, it will lead to increased fuel consumption and reduced power at the mild level; in severe cases, it triggers the engine warning light or even vehicle breakdown. However, many engineers overlook a core point during material selection: the performance of potting material directly determines the service life limit of the sensor. Four Major Technical Challenges for MAF Sensor Potting The operating environment of MAF sensors is far harsher than imagined. Under the hood, temperature fluctuates drastically from -40℃ to 150℃, accompanied by multiple hazards such as oil vapor, road salt spray and high-pressure water washing. This sets stringent requirements for potting materials: 1. High-level Sealing & Protection Moisture is the top killer of sensor circuits. Even tiny water vapor penetration will cause signal drift, corrosion and short circuit. 2. Excellent Thermal Shock Resistance Traditional rigid potting compounds easily generate internal stress under temperature cycling. Long-term stress may cause solder joint cracking or encapsulation delamination. 3. Critical Stress Buffering Capacity The internal MEMS chips and precision resistor networks of sensors are extremely sensitive to mechanical stress. The potting material must possess sufficient flexibility to absorb vibration and impact. 4. Uncompromised Long-Term Reliability The material must not experience oil bleeding, yellowing or hardening during long-term service; otherwise, sensor signal accuracy and response speed will be directly affected. SIGEL 1875: Self-Healing Silicone Gel Specially Developed for High-Reliability Sensor Encapsulation To address the above challenges, ELAPLUS launches SIGEL 1875 transparent two-component self-healing silicone gel. With fundamental innovation in material science, it delivers…

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5mm Full Depth Curing!ELAPLUS UV1020: Redefining the Performance Peak of White UV Dynamic Balancing Adhesives

2026-05-07

UV-curing adhesives have long been a key tool for improving production line efficiency in precision rotating component manufacturing, motor rotor dynamic balancing, and sensor packaging, thanks to their second-level curing speed. However, the industry has long faced a tough technical pain point: the “incomplete curing” issue of white/thick-layer UV adhesives. When the adhesive layer exceeds 3mm, traditional white UV adhesives often suffer from surface hardening but residual soft adhesive at the bottom. This not only causes a sharp drop in bonding strength but also hides quality risks such as falling off and imbalance for long-term product operation. Today, ELAPLUS officially launches UV1020 UV curable acrylic dynamic balancing adhesive. With its breakthrough deep-layer curing technology, it completely breaks the performance bottleneck of thick-layer white UV adhesives, becoming a veritable “top-tier” product in industrial applications. I. Core Pain Point: Why Do Thick-Layer White UV Adhesives Cure Incompletely? In the field of UV curing, curing depth depends on energy density and optical transmittance. To achieve visual opacity, traditional white UV adhesives are usually formulated with high-concentration light-shielding fillers (such as titanium dioxide). These fillers block visible light, while also strongly scattering and absorbing UV light. As a result, UV light cannot penetrate deeper than 3mm, failing to activate the photoinitiator at the bottom layer. For high-precision balanced motor rotors or thick-layer packaged sensors, this incomplete curing directly leads to bonding failure. II. Technical Breakthrough: 20000mJ/cm² Energy Input, Unlocking the 5mm Curing Limit The success of ELAPLUS UV1020 stems from in-depth insights into “energy for depth” and “optical system reconstruction”: High-Energy Curing SystemUV1020 recommends a curing energy of 20000mJ/cm² (based on 365nm LED light source), which is 2-4 times that of ordinary UV adhesives. Coupled with an optimized photoinitiator formula, it ensures thorough free radical reaction at the bottom layer even at a thickness…

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Repairable Silicone Gel for Cable Junction Box Potting: In-depth Analysis of SIGEL 1805 & SIGEL 3078

2026-05-06

In power transmission, communication infrastructure and industrial automation industries, cable junction boxes are core components for connecting and protecting cable joints. Their waterproof, moisture-proof and weather resistance directly determine the operational reliability of the entire system. Traditional potting materials have obvious application drawbacks: non-repairable after curing, failure prone to moisture, narrow temperature resistance range, etc. These issues raise maintenance costs and bring potential safety risks. ELAPLUS launches two repairable silicone gels, SIGEL 1805 and SIGEL 3078. Featuring premium performance and easy repairability, they deliver an innovative technical solution for cable junction box potting. Ⅰ. Industry Pain Points of Traditional Potting Materials 1. Core Requirements for Cable Junction Box Potting Core Demand Specific Requirement Performance Index Waterproof & Moisture-proof Block moisture intrusion and protect electrical connections Low oil bleeding, high dielectric strength Electrical Insulation Stable operation under high voltage Dielectric strength ≥25kV/mm Weather Resistance Long-term outdoor anti-aging Operating temperature: -60~200℃ Stress Buffering Relieve thermal stress and mechanical vibration High elasticity, low hardness Repairability Convenient later maintenance & cost saving Easy-to-remove gel state 2. Drawbacks of Traditional Materials Drawbacks Specific Performance Resulting Problems Non-repairable curing Rigid materials like epoxy resin cannot be removed without damaging components leading to high maintenance costs.  Oil bleeding & contamination Severe oil bleeding pollutes terminal blocks increases contact resistance and impairs electrical performance. Narrow temperature resistance Softens at high temperature and cracks at low temperature failing in extreme outdoor conditions Overly strong adhesion Firm bonding with substrates causes component damage during repair 3. Advantages of Silicone Gel    ※Soft gel state after curing to eliminate mechanical stress ※Repairable design for easy removal without component damage ※Ultra-low oil bleeding to avoid metal contact contamination ※Wide temperature tolerance: -60℃ ~ 200℃ for harsh environments ※Superior dielectric strength for reliable high-voltage protection Ⅱ. Product Introduction 1. SIGEL 1805 Two-component Silicone Gel Product Positioning SIGEL 1805 is a…

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AI-Driven Computing Leap: How ELAPLUS Solves 1.6T Optical Module Thermal Challenges with High-Performance TIM Solutions

2026-04-27

Driven by the AI and large language model revolution, global data centers are experiencing an unprecedented computing power arms race. As the “capillaries” supporting massive data transmission, high-speed optical communication modules are evolving at an unprecedented pace. As transmission rates advance from 100G to 800G/1.6T, optical module power consumption has surged from 3W to over 15W. With exponentially increasing heat density per unit volume, thermal design is no longer a simple auxiliary feature but a critical technical bottleneck determining module performance, stability and reliability. 01 What Causes Thermal Failure? The “heart” of an optical module is its internal TOSA (Transmitter Optical Sub-Assembly) and ROSA (Receiver Optical Sub-Assembly) components. Chip power consumption grows exponentially with transmission rates: a typical 100G module consumes about 3W, while 800G modules have reached 12-15W, and 1.6T modules are heading toward over 20W. 800G Optical Module Power Consumption: 12~15W 4-5 times that of the 100G era · Thermal management solutions must evolve in tandem In practical applications, thermal failure stems from multiple dimensions. 02 ELAPLUS Thermal Management Solutions Product Categories Model Feature Thermal Gel One-component curable 3100# 250um BLT, 10.2W/m-K，Low Volatility 3380# 250um BLT,8.4W/m-K，Low Volatility 3365# 100um BLT, 6.2W/m-K，Low Volatility 3335# 60um BLT, 3.5W/m-K One-component pre-cured TCMP 80#\100# 250um BLT, 8.5/10.0W/m-K，Low Volatility Two-component curable TCMP 1980# 200um BLT8.5W/m-K, shore 00 30 Thermal Pad GP 60 SF 6.0W/m-K, shore 00 55，Non-silicone Thermal Pad TCMP 130# 13W/m-K, Silicone Thermal Pad In the AI era where computing power defines competitiveness, every iteration of optical communication technology pushes the boundaries of physics. ELAPLUS upholds the brand spirit of “keeping chasing forever,” providing not just materials but comprehensive thermal management system solutions tailored to real-world scenarios for global ICT enterprises. Through continuous materials science innovation, ELAPLUS is empowering partners to break through thermal bottlenecks, enabling every beam of light to connect the future of the intelligent world at lower temperatures and higher efficiency.

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SIPA 1850 Thermal Potting Compound: An Ideal Heat Dissipation Solution for High-Power Fast Charging Era

2026-04-24

With the widespread adoption of fast charging technology, chargers have evolved into compact, high-precision power conversion units. However, higher power density brings severe challenges: poor heat dissipation, moisture ingress and drop damage — three core factors that shorten the service life of chargers. How to ensure long-term stable operation of electronic components in limited space? ELAPLUS presents the optimal solution: SIPA 1850 Thermally Conductive Potting Compound. Hidden Pain Points in the Charger Industry Hardware failures account for a major proportion of after-sales costs for electronic manufacturers. The key industry pain points of chargers are as follows: ※Excessive heat accumulation: Rising PD fast charging power leads to surging heat generation of internal components. Unremoved heat will cause power reduction and accelerate aging of electrolytic capacitors and other parts. ※Environmental corrosion: Chargers are often used in humid scenarios such as kitchens, bathrooms and high-humidity areas. Moisture penetration easily causes internal circuit short circuits. ※Mechanical damage: Frequent dropping and vibration loosen welding points and damage fragile internal components. SIPA 1850: All-Round Protection for Core Components Developed by ELAPLUS, SIPA 1850 is a two-component silicone thermally conductive potting compound with balanced performance and comprehensive protection. Efficient Heat Dissipation Featuring high thermal conductivity, SIPA 1850 rapidly transfers heat from components to the housing. It effectively reduces the core temperature rise of high-power chargers, ensuring stable output under long-term high-load operation. Superior Waterproof & Moistureproof Performance Fully potted PCBs form a dense protective layer after curing. The compound maintains excellent insulation under extreme humidity, greatly improving product safety and reliability. Shock & Vibration Resistance Cured silicone rubber retains unique elasticity to absorb external impact and vibration energy. It provides effective cushioning for SMD components and stabilizes internal structures against drops and shocks. Wide Application Scenarios Beyond chargers, SIPA 1850 serves as a reliable protective material for multiple…

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Efficiency Meets Security: PUR 1603 A/B Two-Component Adhesive for PCB IC Encapsulation

2026-04-23

In the modern electronics manufacturing industry, integrated circuits (ICs), serving as the “core brain” of devices, are critical to operational stability and design security. As electronic components evolve toward miniaturization and high integration, IC chips on printed circuit boards (PCBs) are exposed not only to complex mechanical stress,moisture corrosion and chemical erosion, but also to the risk of technology leakage. Traditional encapsulation materials often struggle to balance curing speed, stress relief and cost control. For this reason, PUR 1603 A/B two-component solvent-free room-temperature curing adhesive has become an ideal choice for IC encapsulation on printed circuit boards, thanks to its excellent physical properties and process adaptability. I. Core Technology: Resolving the Conflict Between High Efficiency & Low Stress IC encapsulation on printed circuit boards (COB process or partial potting) imposes stringent requirements on adhesives. Featuring precisely engineered molecular structure, PUR 1603 A/B delivers essential protection while addressing key industry pain points: · Fast Curing at Room Temperature: 30-Minute Cycle for Boosted Productivity Curing time directly determines production efficiency in high-speed electronics manufacturing. PUR 1603 A/B uses a high-efficiency catalytic system and achieves full curing within 30 minutes at room temperature.Unlike conventional one-component heat-curing adhesives, it requires no expensive tunnel ovens or high-energy heat treatment, greatly reducing energy consumption and eliminating thermal damage to precision components. · Low-Modulus Flexibility: Reliable Protection Against Thermal Shock Differences in coefficient of thermal expansion (CTE) among PCB substrates, IC chips and encapsulants often cause internal stress, leading to solder joint cracking or chip failure.Cured PUR 1603 A/B offers excellent low modulus and high flexibility. Its elastic nature effectively absorbs stress during thermal cycling, providing long-term cushioning for delicate pins and precision components. · Superior Confidentiality: Safeguarding Core Intellectual Property Anti-reverse engineering is critical for high-performance circuits and proprietary designs. PUR 1603 A/B provides outstanding opacity, forming…

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Application of Elaplus UV Moisture Organic Silicone Adhesive in New Energy Vehicles

2026-03-18

1、 The current situation of the electronic adhesive market for new energy vehiclesNew energy vehicles are reshaping the global automotive industry at an unprecedented pace. According to industry forecasts, global sales of new energy vehicles will exceed 20 million units by 2025, and the penetration rate of the Chinese market will reach over 50%. In this grand context, the electrification rate of automobiles continues to increase – the number of electronic components used in a mid to high end new energy vehicle has grown from hundreds of traditional fuel vehicles to thousands. Lithium battery encapsulationAlong with the explosive growth in the number of electronic components, the demand for reliability is also constantly increasing. The working environment of new energy vehicles is much more demanding than traditional vehicles: high temperatures generated by the electric drive system, strong electromagnetic interference near the power battery, vibration and impact caused by complex road conditions, and high and low temperature cycles caused by extreme weather… These factors all place higher demands on the protection capabilities of automotive electronics. 20 million+ Global Sales Forecast for 2025 50%+ Penetration rate in the Chinese market 3-5kg Usage of adhesive for bicycles 10 billion+ Global market size by 2025 Adhesive, as a key material in electronic component manufacturing, undertakes multiple functions such as bonding, sealing, protection, and thermal conductivity. In the field of new energy vehicle electronics, the demand for high reliability adhesives is rapidly increasing. It is estimated that the usage of various adhesives for a single new energy vehicle is about 3 to 5 kilograms, and the global market size will exceed 10 billion yuan by 2025. 2、 Elaplus’s productsSince its establishment, Elaplus Functional Materials (Shanghai) Co., Ltd. has always focused on the research and manufacturing of functional silicone materials. The company’s product line covers multiple series…

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