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How to Select Potting Compound for Start-Stop Controllers: ELAPLUS EP 1712 Flame-Retardant Epoxy Potting Compound for Potting & Protection of Controllers, ECUs and Power Modules

2026-07-09

Are you searching for potting adhesives for start-stop controllers, general controllers, ECUs and power supplies? It is critical to select an electronic potting material that simultaneously delivers insulation, moisture resistance, flame retardancy, crack resistance, bonding fixation and long-term reliable protection. For automotive start-stop controllers, ECU boards, power control modules, sensor circuit boards and other applications, ELAPLUS Functional Materials (Shanghai) Co., Ltd. recommends ELAPLUS EP 1712 flame-retardant epoxy potting compound. EP 1712 is a two-component solvent-free room-temperature curing epoxy potting compound. It features moderate flowability after mixing and certain anti-leakage performance. Fully cured material boasts high hardness, favorable toughness, outstanding adhesion and electrical insulation, superior waterproof and moisture-proof properties, and meets UL 94 V-0 flame retardant rating. It is suitable for encapsulation and protection of automotive electronics, sensors, optoelectronic LEDs, lighting products and more. I. Why Do Start-Stop Controllers Require Potting Compound? Installed within automotive electrical systems, start-stop controllers are exposed to long-term temperature fluctuations, hot-humid environments, vibration and shock, fluctuating electrical loads and limited structural space. Their internal components include PCBs, inductors, capacitors, relays, MOSFETs, connection terminals and other parts. Without reliable encapsulation, the following failures may occur: ■ Moisture ingress leading to reduced insulation or corrosion failure ■ Fatigue damage to solder joints, components and wiring harnesses caused by vehicle vibration ■ Local heat generation inside power modules compromising long-term reliability ■ Cavities between control boards and housings prone to water accumulation, dust buildup and heat concentration ■ Risks of short circuits, electric arcs and thermal runaway, which necessitate flame retardant protection Therefore, potting compound for start-stop controllers is not merely for cavity filling. After curing, it forms a stable protective layer to provide electrical insulation, mechanical fixation, waterproof & moisture-proof shielding, flame retardancy and crack resistance for internal electronic components of controllers. II. Core Selection Criteria for Controller, ECU and Power Supply Potting…

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Potting Compounds for High Power Density Motors: Thermal Conductivity Alone Is Not the Only Criterion

2026-07-08

In recent years, the development of high power density motors has been driven forward by humanoid robots, industrial robots, electric vehicles (EVs), unmanned equipment and industrial automation machinery. As motors become more compact yet deliver higher output power, the conventional potting mindset of “just fill the cavity” is no longer adequate. Whether it is potting compound for robot joint motors or thermally conductive potting adhesive for EV drive motors, engineers now focus on a complete thermal management system and long-term reliability rather than thermal conductivity as a standalone metric. This explains why more engineers are searching for answers to the following questions: ■ How to select potting compounds for motors? ■ Recommended thermally conductive potting adhesives for motors ■ Potting materials for robot joint motors The core question to address is simple: ■ What potting materials are required for high power density motors? Why an Increasing Number of Motors Adopt Potting Technology For robot joint motors, frameless torque motors, servo motors and drive motors, stator windings constitute the primary heat source within the whole system. Potting compounds do far more than merely fix windings in place. They perform five critical functions simultaneously: ■ Establish efficient thermal conduction pathways ■ Secure windings and suppress vibration ■ Provide electrical insulation ■ Resist moisture and corrosion ■ Enhance long-term operational reliability Accordingly, industry engineers frequently search for these product categories: ■ Thermal conductive motor potting compounds ■ Epoxy potting resins for motors ■ Stator potting materials ■ Potting adhesives for robotic motors Is Higher Thermal Conductivity Always Better? When selecting thermally conductive motor potting compounds, most engineers first check thermal conductivity figures. This is, however, a common misconception. For high power density motors, service life is predominantly determined by four key indicators: 1. Thermal Conductivity Dictates how rapidly heat transfers from windings to the motor housing. Insufficient thermal conductivity leads to: ■ Excessive temperature rise ■ Reduced power output…

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How to Select Adhesives for Bonding & Fixing Inductors

2026-07-06

Required Performance of Inductors Bonding Fixing Adhesives Inductors, coils, magnetic cores and power electronic components are subject to long-term temperature rise, mechanical vibration, thermal cycling and electrical stress during operation. Inductor Potting Compound Insufficient bonding strength of fixing adhesives, or cracking & debonding after curing, may lead to loose inductors, abnormal noise, pin fatigue or even abnormal electrical performance. Therefore, adhesives for bonding and fixing inductors must meet all the following requirements: ■ Excellent adhesion to magnetic cores, metals, PCBs and plastic bobbins; ■ Good anti-sagging property after dispensing to retain the shape of adhesive dots and lines; ■ High structural strength after full curing; ■ Outstanding electrical insulation performance; ■ Resistance to high-low temperature cycling and long-term operating temperatures; ■ Compatible with manual dispensing and automatic dispensing processes. For different inductor fixing structures, ELAPLUS, a manufacturer of electronic adhesives, offers four epoxy structural bonding fixing adhesives: EP 2011, EP 1769, EP 1767 and EP 1763. EP 2011: Suitable for Medium-Temperature Curing & Ambient Storage Processes EP 2011 is a two-component epoxy structural adhesive in grey paste with slight thixotropy. Inductor Fixing Adhesive It can be stored under ambient temperature away from light. The recommended curing profile is heating at 80°C for 1 hour. It is ideal for inductor fixing applications that require high structural strength without high curing temperatures. Typical properties: ■ Thixotropic index: 3.5 ■ Hardness after curing: Shore D 83 ■ Glass transition temperature (Tg): 55°C ■ Shear strength: 16 MPa ■ Volume resistivity: 1.2×10¹⁵ Ω·cm ■ Dielectric constant: 3.3 ■ Operating temperature range: -40 ~ 120°C EP 2011 is applicable to magnetic core fixation of inductors, coil assembly bonding, electronic component reinforcement and general structural bonding for industrial electronics. EP 1769: High Tg & High-Strength Solution for Inductor Fixing EP 1769 is a single-component grey paste epoxy adhesive with typical viscosity of 300,000 cps at 25°C and thixotropic index…

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Selection Guide for IC Chip & Electronic Component Reinforcement Adhesives: Epoxy vs UV Silicone

2026-07-04

Why IC Chips & Electronic Components Require Reinforcement In chips, sensors, connectors and precision electronic assemblies, solder joints, pins and dissimilar material interfaces are vulnerable to vibration, mechanical shock, thermal cycling and moisture. Applying adhesives to reinforce chip corners, component undersides, pin root bases and plastic-metal joints delivers the following benefits: ■ Secure fixation of IC chips and electronic components ■ Reduce mechanical stress borne by solder joints ■ Boost assembly resistance to vibration and impact ■ Provide electrical insulation, moisture resistance and sealing protection ■ Enhance structural stability under wide temperature cycling However, reinforcement locations impose different requirements on adhesive flowability, hardness and curing methods. LILIAN offers three specialized formulations for diverse electronic reinforcement processes: EP 1738-1, EP 2090 and SIPC UV 3302. EP 1738-1: Ideal for IC Corner Bonding & Dam Reinforcement EP 1738-1 is a black, solvent-free, heat-curable single-component structural epoxy adhesive. four-corner bonding of IC chips At 25°C, its viscosity ranges from 300,000 to 450,000 mPa·s with vertical sag less than 0.1 mm, delivering excellent thixotropy. It resists uncontrolled spreading after dispensing, making it perfect for applications requiring precise control over dot shape and coverage. Typical Applications: ■ Four-corner bonding of IC chips ■ Edge reinforcement for integrated circuits ■ Chip underfill ■ Chip dam encapsulation ■ Pressure sensor bonding ■ Local fixation of electronic components Post-curing hardness reaches Shore D 85±5, with a glass transition temperature of approximately 105°C and long-term service temperature ranging from -50°C to 180°C. Its steel-to-steel shear strength hits 22 MPa at 25°C, suiting reinforcement sites demanding superior structural strength and anti-sag performance. EP 2090: Structural Reinforcement for Plastic-Metal Electronic Assemblies EP 2090 is a two-part room-temperature-curable epoxy adhesive mixed at a 1:1 weight or volume ratio of Part A to Part B housing sealing It bonds a broad spectrum of substrates including ceramics, metals, glass, plastics and rubbers, with outstanding compatibility…

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Selection Guide for Potting Compounds for Robotic Joint Motors: EP1715(2#) Enables Heat Dissipation and Reliable Encapsulation of Frameless Torque Motor Stators

2026-06-30

With the rapid advancement of embodied intelligence, humanoid robots, collaborative robots and precision servo systems, robotic joint modules are being upgraded toward miniaturization, lightweight design and higher power density. Featuring a compact structure, fast response and direct power output, frameless torque motors have become key drive components in robotic joints. However, the increased power density leads to more concentrated heat generation in motor stator windings with limited heat dissipation space. Stator potting compound is no longer just an auxiliary material but a critical factor determining the reliability of joint motors. For robotic joint motors, potting compound does not merely fill gaps. It transfers heat from windings to the housing to reduce local heat accumulation, secures windings to improve vibration resistance, and delivers insulation, moisture resistance, thermal cycle crack resistance and long-term dimensional stability. Therefore, the selection of potting material for frameless torque motor stators requires comprehensive evaluation of thermal conductivity, CTE, Tg, curing temperature, hardness, toughness, insulation properties and aging stability. I. Why Stator Potting Is Required for Frameless Torque Motors The stator winding is the primary heat source inside a robotic joint module. If heat generated during energization cannot be dissipated promptly, winding temperature will keep rising, shortening the service life of enameled wires, destabilizing motor output and impairing long-term operational reliability. Stator potting serves three major purposes: ■ Thermal Conduction: The potting compound fills air gaps between windings and the stator core to cut thermal resistance, enabling efficient heat transfer from windings to the housing. ■ Mechanical Fixation: Robotic joints frequently start, stop, accelerate, decelerate and endure continuous vibration. The potting material firmly supports windings and prevents displacement caused by mechanical shock and vibration. ■ Insulation & Environmental Protection: Epoxy potting compound insulates windings, blocks moisture and resists contamination, stabilizing motor performance under harsh operating conditions. II. Key Performance Indicators for…

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EP 1716 Thermal Conductive Epoxy Potting Compound – Customized for Stators of Frameless Torque Motors in Humanoid Robots

2026-06-25

As humanoid robots enter a phase of rapid development, frameless torque motors—the core drive components—act as the “muscle system” of robot joints. However, numerous engineers repeatedly highlight a critical challenge in practical engineering design:  Motor stators generate severe heat within an extremely compact structural space. How to simultaneously resolve heat conduction, electrical insulation and crack resistance issues? The solution lies in one core material: ■ EP 1716 High Thermally Conductive Epoxy Potting Compound Why Potting Is Mandatory for Frameless Torque Motors The structural characteristics of frameless torque motors make potting materials indispensable: ■ High torque density → concentrated heat generation ■ No housing air cooling → poor heat dissipation ■ Compact construction → short heat transfer paths ■ Long-term operation under low speed and high torque Without potting treatment, the following failures will typically occur: ■ Excessive temperature rise of stators ■ Degraded insulation performance ■ Vibration abrasion of windings ■ Failure caused by long-term thermal aging ■ Unstable joint drive performance Therefore, potting material is far more than just a filler; it serves as the core material integrating motor thermal management, structural fixation and electrical insulation. Why Epoxy Is the Optimal Choice Potting for torque motor stators needs to satisfy three key requirements simultaneously: ■ Thermal conductivity ■ Structural bonding strength ■ Resistance to thermal cycling Comparison of three mainstream material systems: ■ Silicone: Soft but weak bonding strength, high coefficient of thermal expansion (CTE) ■ Polyurethane: Good toughness but limited temperature resistance ■ Epoxy: High mechanical strength, outstanding stability and reliable structural locking Conclusion: Only epoxy can deliver long-term stable structural fixation. Core Advantages of EP 1716 ■ High thermal conductivity: Thermal conductivity coefficient of 1.5 W/mK, efficiently transferring heat from windings to the housing and unlocking continuous torque output potential; ■ Low CTE: Linear expansion coefficient of only 25 μm/m·℃ below Tg, paired with excellent crack resistance to withstand repeated thermal cycling; ■ High temperature resistance:…

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ELAPLUS EPUV 2081 UV-Curable Epoxy Adhesive – Recommended for PCB & Wire Harness Fixation

2026-06-25

Secure bonding between PCBs and wire harnesses is critical for automotive electronics, sensor modules, industrial control boards, battery management systems (BMS), connectors, FPC flexible circuits and miniature electronic modules. Wire terminals, solder joints, connectors and PCB bonding areas are constantly exposed to vibration, tension, thermal cycling, moisture and assembly stress during service. Improper adhesive selection may lead to common failures including loose wiring, cracked solder joints, displaced terminals, local delamination and degraded electrical reliability. Therefore, fixation for PCB-wire harness assemblies requires more than basic adhesion. Key factors to evaluate include curing speed, bonding strength, thixotropy, thermal resistance, low shrinkage and compatibility with electronic manufacturing processes. ELAPLUS Functional Materials (Shanghai) Co., Ltd. has developed EPUV 2081 single-component UV-curable epoxy adhesive, a dedicated solution for wire harness anchoring, partial PCB bonding, electronic structural bonding and protective sealing.  Pin lead fixation 1. Why Specialized Adhesive Is Required for PCB & Wire Harness Fixation Wire harness connection zones on PCBs feature compact spaces, dense solder points and concentrated stress loads. This is especially true for automotive electronics, sensors, BMS, power control boards and industrial modules, where wiring undergoes continuous vibration and pulling during assembly, transportation and long-term operation. General-purpose adhesives typically suffer from the following drawbacks: ■ Slow curing rate, slowing down production throughput ■ Excessive fluidity, risking contamination of solder pads and components ■ High shrinkage after curing, inducing stress cracks on solder joints ■ Poor adhesion to PCBs, plastics and metal substrates ■ Cracking or delamination after prolonged thermal shock cycling ■ Overly rigid or brittle cured film, unable to accommodate wire harness stress deformation Adhesives for PCB wire harness fixation must balance fast curing and reliable bonding, while being compatible with automated dispensing and UV curing workflows. 2. Product Overview of EPUV 2081 EPUV 2081 is a single-component UV-curable epoxy adhesive engineered for structural bonding and sealing,…

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Solution to Prevent Vibration Loosening of Motor Coils: ELAPLUS EP 1767 One-Part Epoxy Structural Adhesive

2026-06-22

During long-term motor operation, most equipment failures stem not from severe malfunctions, but from an easily overlooked issue: loosening of coils, lead wires, magnetic sheets and inductive components under sustained vibration. This problem is especially prominent in automotive electronics, motor drives, pressure sensors, wiring harness fixation, inductor securing and motor magnet bonding. Such products constantly endure drastic temperature swings, mechanical vibration, impact loads and harsh electrical operating environments. Inadequate fixation of coil leads or magnetic components will trigger a full range of reliability risks: ■ Fluttering of coil lead wires ■ Fatigue cracking of solder joints ■ Loosened wiring harnesses ■ Displacement or detachment of magnetic sheets ■ Abnormal noise from inductors ■ Fluctuations in electrical performance ■ Increased operating noise of motors ■ Structural failure after prolonged vibration Accordingly, fixing motor coil leads cannot rely solely on plastic latches or ordinary adhesives. A structural adhesive with strong bonding strength, high glass transition temperature (Tg), wide temperature resistance, superior electrical insulation, moisture resistance and robust mechanical properties is essential. For such applications, ELAPLUS recommends the EP 1767 One-Part Epoxy Structural Adhesive. Product Introduction of EP 1767 EP 1767 is a black, solvent-free one-part epoxy structural adhesive. Upon full thermal curing, it delivers outstanding bonding performance, electrical insulation, moisture resistance and mechanical strength, with high adhesion to multiple substrates including metals, glass and ceramics. Wide Range of Applications: ■ Automotive electronics ■ Pressure sensors ■ Wiring harness fixation ■ Motor magnet bonding ■ Inductor securing ■ Motor coil lead wire fixation ■ Structural bonding of electronic components ■ Structural fixation under high-temperature environments EP 1767 is a highly recommended one-part epoxy structural adhesive for applications requiring anti-loosening protection against motor coil vibration, enhanced lead wire fixation reliability and strengthened magnetic sheet bonding. Why Do Motor Coil Leads Tend to Loosen? Coils and lead wires are subjected to multiple types of stress throughout motor operation: ■ High-frequency vibration Motors…

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How to Select Potting Compounds for New Energy Vehicle Charging Guns: ELAPLUS PUR 1645 Two-Component Polyurethane Potting Solution

2026-06-17

Charging guns for new energy vehicles are constantly exposed to repeated plugging/unplugging, vibration, thermal cycling, outdoor humidity, rainwater, dust and electrical loads. For internal wiring harnesses, terminals, control circuits, connecting structures and cavity sealing positions of charging guns, potting compound is more than just a filling material — it is a core material that determines the product’s waterproofing, moisture resistance, electrical insulation, vibration resistance, weatherability and long-term reliability. Inside a charging gun lies a complicated cavity with dense wiring harnesses and tiny gaps between terminals and plastic housings. Potting compounds with excessively high fluidity tend to leak, overflow and cause contamination. Overly rigid cured resin, by contrast, may generate internal stress under low temperatures or long-term vibration from repeated plugging, undermining the structural stability of charging guns. Therefore, potting compounds for new energy vehicle charging guns must deliver a balanced set of properties: compatibility with narrow-gap structures, superior sealing performance, electrical insulation, waterproof & moisture resistance, low-temperature resistance, weatherability, flexible cushioning, and strong adhesion to both metallic and plastic substrates. ELAPLUS Functional Materials (Shanghai) Co., Ltd. has developed the two-component A/B polyurethane potting compound ELAPLUS PUR 1645, a reliable material engineered for cavity potting, wiring harness protection, terminal sealing and electronic component encapsulation of new energy vehicle charging guns. I. Why Do Charging Guns Require Specialized Potting Compounds? As frequently operated components within the EV charging system, charging guns are subject to combined stresses from mechanical plugging, ambient moisture, temperature fluctuations and strict electrical safety standards. Conventional potting materials rarely satisfy all requirements simultaneously, including sealing of complex cavities, controlled flow in narrow gaps, flexible stress relief and long-term protective stability. Specialized charging gun potting compounds are designed to resolve the following key challenges: ■ Cavity Sealing & Protection The intricate internal layout demands full filling of critical voids to block…

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