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Industry Application

How to Select Adhesives for PTC Heaters? Recommended Grades for Housing Sealing, Power‑Module Thermal Conduction and Connector Potting

2026-08-10

Multiple single‑material solutions shall be avoided for adhesives used in new‑energy‑vehicle PTC heaters. Material selection shall be carried out respectively for housing sealing, power‑module heat dissipation and local connector potting. For PTC heater applications, Elaplus recommends SIPA 1865‑2K for housing sealing, TCMP 1960‑2K for power‑module heat dissipation, and SIPA 3015‑2K for connector‑section potting, delivering a combined solution of “sealing + thermal conduction + insulation protection”. Adhesive Solution for PTC Heaters Why Multiple Types of Adhesives Are Required for PTC Heaters A new‑energy‑vehicle PTC heater integrates heating elements, power devices, control circuits, connectors and metal housings. Different positions face distinct challenges: Therefore, adopting one single high‑thermal‑conductivity adhesive or one single sealing adhesive for all positions hardly meets all functional requirements simultaneously. Recommended Grade for PTC Housing Sealing Elaplus SIPA 1865‑2K Within Elaplus PTC application solutions, SIPA 1865‑2K is mainly applied for housing sealing. Housing Sealing Main functions: For PTC housing‑sealing materials, initial bonding strength is not the only indicator. Interface delamination and sealing failure after thermal cycling shall be verified as key evaluation items. Recommended Grade for PTC Power‑Module Heat Dissipation Elaplus TCMP 1960‑2K Thermal Gel TCMP 1960‑2K is designated for heat dissipation of PTC power modules. Its core function is not rigidly bonding the power module in place, but filling the interface between power devices and heat‑dissipation structures to transfer heat efficiently to the metal housing. Key selection criteria:‑ Thermal conductivity‑ Interface gap‑filling capability‑ Material hardness‑ Assembly tolerance‑ Thermal‑cycling stability For power devices in particular, excessively hard thermal‑interface materials that introduce high assembly stress onto components shall be avoided. Recommended Grade for PTC Connector‑Section Potting Elaplus SIPA 3015‑2K SIPA 3015‑2K is used for potting of internal PTC connectors to provide local insulation, moisture resistance and fixation. Suitable for protection of:‑ Connector roots‑ Peripheral terminals‑ Local circuits‑ Electrical connection points PTC…

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Motor Lead‑Wire & Neck‑Section Adhesive Selection | High‑Temp, Oil‑Resistant & Anti‑Sagging Grade Recommendations

2026-08-10

Adhesives for motor lead‑wire fixing and neck‑section encapsulation shall be selected according to dispensing position, adhesive thixotropy, long‑term temperature resistance, oil resistance, lead‑wire material and curing process. For flexible fixation of heat‑shrinkable tubes and lead wires, evaluate Elaplus SIPC 1823. EP 1770‑1K is recommended for the neck‑section of brushless motors. EP 1770H‑1K can be applied for inter‑slot sealing of DC motor rotors. For motor housings or sealing positions exposed to oil media, evaluate SIPC 1887. Why Motor Lead‑Wires Require Fixation During motor operation, coil lead‑wires are subjected to continuous loads induced by vibration, electromagnetic force, thermal expansion‑contraction and high‑speed rotor motion. Without fixation at the lead‑wire root, the following failures may occur: Lead‑wire fixing adhesives shall maintain proper flexibility and shall not form rigid bending boundaries at lead‑wire roots. Recommended Grade for Brushless‑Motor Lead‑Wire Fixation SIPC 1823: One‑Component Silicone Lead‑Wire Fixing Adhesive SIPC 1823 is a one‑component silicone adhesive featuring fast tack‑free time and good bonding performance for heat‑shrinkable tubes. According to the datasheet, its viscosity is approx. 35 000 cps with service temperature ranging from ‑60 ℃ to 200 ℃. Suitable for: Note: The motor application schematic page of the datasheet marks SIPC 1822, whereas the parameter sheet lists SIPC 1823. Always confirm the final grade against the latest TDS for formal release, sampling and quotation. Recommended Grade for Brushless‑Motor Neck‑Section Encapsulation EP 1770‑1K: High‑Thixotropy Heat‑Curing Epoxy Adhesive EP 1770‑1K is a one‑component heat‑curing epoxy adhesive. It resists flow at ambient temperature and delivers moderate slight slump upon heating. Per datasheet, viscosity is approx. 150 000 cps; recommended curing profile: 120 ℃ for 60 minutes. Suitable for: Its rheological design of “no flow at room temperature, slight slump under heating” enables the adhesive to stay in place after dispensing, while achieving moderate wet‑out over coil surfaces during curing temperature rise. Recommended Grade for DC‑Motor Inter‑Slot Sealing…

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Motor Stator Thermally‑Conductive Potting Compound Selection | Recommended Grades for Robot Joint Motors and NEV Motors

2026-08-10

When selecting potting compounds for motor stators, thermal conductivity alone should not be the only comparison indicator. Viscosity, wet‑out capability, Tg, coefficient of thermal expansion (CTE), cure shrinkage, hardness and crack‑resistance performance shall also be evaluated simultaneously. For conventional epoxy potting of motor stators, evaluate Elaplus EP 1715. Choose EP 1716 for applications requiring high Tg, low shrinkage and crack resistance. For high‑power‑density applications such as robot‑joint motors and new‑energy‑vehicle motors where higher thermal conductivity is needed, evaluate EP 1796‑2# with a thermal conductivity of approx. 2.5 W/m·K. Motor Potting Why Do Motor Stators Require Potting? Stator windings continuously generate heat when energized. As motors trend toward miniaturization, higher rotational speed and elevated power density, heat inside windings becomes harder to dissipate in a timely manner. Motor stator potting compounds mainly deliver the following functions: Robot‑joint frameless torque motors, servo motors and new‑energy‑vehicle drive motors feature high power density, which places higher comprehensive requirements on motor thermally‑conductive potting compounds. Recommended Grades for Conventional Motor Stator Potting EP 1715: Epoxy Potting Compound for Stators EP 1715 is a 100:15 two‑component heat‑curing epoxy potting compound, suitable for potting of general‑purpose motor stators and windings. Recommended Applications: Parameters of EP 1715 may vary for different suffixes or formula versions. Always refer to the latest corresponding TDS for public release. Grade Recommendation for Motors Requiring High Tg and Crack Resistance EP 1716: High‑Tg Low‑Shrinkage Epoxy Potting Compound EP 1716 is a 100:5 two‑component epoxy potting compound characterized by high Tg, high temperature resistance, low cure shrinkage and crack resistance. Its service temperature ranges from approx. ‑50 ℃ to 180 ℃. Suitable for: High Tg helps the material maintain mechanical stability at elevated operating temperatures. Low cure shrinkage and low CTE help reduce thermal stress among windings, iron cores and cured compound. High‑Thermal‑Conductivity Grade for Motor Stators EP…

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Motor Magnet Bonding Adhesive Selection | Model Comparison for Permanent‑Magnet Motors and Small Motors

2026-08-10

Adhesives for motor magnet bonding shall be selected based on motor rotational speed, long‑term temperature resistance, magnet‑to‑rotor substrate combination, adhesive layer thickness, curing method and production cycle. For conventional one‑component heat‑curing options, evaluate Elaplus EP 1739‑1K. Choose EP 1769‑1K when high Tg and high thixotropy are required. For two‑component systems with high shear strength and toughness, select EP 2029‑2K. For high‑frequency electromagnetic fast curing requirements in small motors, EP 1772‑1K is recommended. Why Mechanical Snap‑in Grooves Alone Are Not Enough for Motor Magnets During operation, permanent‑magnet motor magnets are subjected to: Adhesive failure may cause magnet displacement, detachment and rotor unbalance. In severe cases, the motor stator and housing can be damaged. Recommended Grades for Conventional Magnet Bonding EP 1739‑1K: One‑component semi‑fluid epoxy adhesive Motor Magnet Bonding EP 1739‑1K is a one‑component heat‑curing epoxy adhesive with semi‑fluid consistency. Its datasheet lists viscosity at approx. 27 000 cps and service temperature ranging from ‑50 ℃ to 200 ℃. Suitable for: EP 1769‑1K: High‑Tg & high‑thixotropy magnet‑bonding adhesive EP 1769‑1K is a one‑component low‑flow epoxy adhesive with viscosity ≥ 300 000 cps. Recommended curing profile: 120 ℃ for 30 minutes; service temperature: ‑50 ℃ ~ 200 ℃. Suitable for: Recommended Two‑Component Magnet‑Bonding Grade EP 2029‑2K: High‑shear epoxy structural adhesive Motor Epoxy Structural Adhesive EP 2029‑2K is a 2:1 two‑component epoxy adhesive featuring good peel resistance and shear strength. According to its datasheet, shear strength on stainless steel reaches approx. 6 MPa at 150 ℃; service temperature ranges from ‑50 ℃ to 180 ℃. Suitable for: Grade for High‑Volume Small‑Motor Production EP 1772‑1K: High‑frequency electromagnetic fast‑curing adhesive EP 1772‑1K is a one‑component epoxy adhesive that achieves fast curing within around 20 seconds via high‑frequency electromagnetic heating, ideal for magnet segment bonding of small‑size motors. Recommended applications: Elaplus EP 1739‑1K, EP 1769‑1K, EP 2029‑2K and EP 1772‑1K cover semi‑fluid thermal curing, high‑thixotropy high‑Tg, two‑component high‑shear and high‑frequency fast‑curing…

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How to Select Potting Materials for Server Power Supplies amid Rising Power Density

2026-08-08

When selecting potting materials for server power supplies, thermal conductivity alone should not be the sole consideration. With the continuous increase in power density of AI servers, power supply modules, high‑frequency transformers, inductors, PFC and DC‑DC modules are subjected to rising temperature rise, vibration and electrical stress. A suitable potting material must strike a balance among thermal conductivity, electrical insulation, stress resistance, flame retardancy, flowability and production cycle time. Improper material selection may lead to incomplete filling, excessive bubbles, cracking upon curing, component stress‑induced damage and unstable heat dissipation performance. 1. Why Do Server Power Supplies Require Potting? Server power supplies integrate a large number of power devices and magnetic components, operating continuously under high‑load, frequent start‑stop and persistent heat‑generation conditions. Potting materials generally deliver the following functions: It should be noted that potting does not mean fully filling the entire power‑supply module. High‑frequency transformers, inductors and auxiliary power supplies are suitable for potting. Between power semiconductors and heat sinks, thermal gels, thermal greases or other thermal interface materials are more applicable. 2. Do Not Rely Solely on Thermal Conductivity for Material Selection 2.1 Actual Thermal Resistance Outweighs Nominal Thermal Conductivity High nominal thermal conductivity does not guarantee superior practical heat dissipation. Whether a stable thermal conduction path can be formed after potting depends on multiple factors: For server power supplies, temperature‑rise tests on actual modules are recommended, instead of merely comparing W/m·K values from product datasheets. 2.2 Flowability Determines Potting Feasibility Fine winding gaps commonly exist inside high‑frequency transformers and inductors. Excessively high material viscosity prevents sufficient penetration into gaps among coils, bobbins and magnetic cores, resulting in bubbles or unfilled areas. Therefore, key points to verify during selection: High‑thermal‑conductivity materials contain abundant thermal fillers. Higher thermal conductivity is usually accompanied by increased viscosity and density. A balance between…

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Selecting BMS Conformal Coatings & CCS Fixing Adhesives: FPC, PI & Shadow Cure Model Recommendations

2026-08-04

Adhesives for BMS and battery integrated busbars shall be selected according to circuit board moisture resistance, FPC & PI bonding, solder joint reinforcement, UV curing speed and shadow-area curing requirements. For fast conformal coating of BMS circuit boards, Elaplus UV Coating 9060M is available for evaluation; UV 1013 is suitable for integrated busbar and solder joint reinforcement; UV 1034 is the choice for FPC-to-PI bonding; UV SI 3301 delivers wide-temperature-range performance, flexible protection and supplementary curing in shadow areas. Why Do BMS Require Conformal Coating Protection? The BMS undertakes collection of cell voltage, temperature and current data. Once circuit corrosion, loose solder joints or reduced insulation occur, judgment of battery status may be adversely affected. Common risks for BMS and integrated busbars include: Therefore, BMS protection is not merely applying a layer of conformal coating. It also covers FPC fixation, integrated busbar reinforcement and stress buffering for solder joints. Recommended Grades for BMS Circuit Board Conformal Coating UV Coating 9060M: UV & Moisture Dual-Cure Conformal Coating UV Coating 9060M is a low-viscosity UV & moisture dual-cure material. Its viscosity specified in the datasheet is approximately 190 cps, with operating temperature ranging from -65℃ to 125℃. Suitable applications: Exposed areas achieve fast UV curing; component bottoms and shaded regions complete secondary curing via moisture. Recommended Grades for Integrated Busbar Reinforcement UV 1013: Fast UV Cure Reinforcement Adhesive UV 1013 is a one-component UV curable adhesive with viscosity around 20,000 cP. Typical curing time under 365 nm UV light is approx. 10 seconds as specified in the datasheet. Recommended applications: Recommended Grades for FPC & PI Bonding UV 1034: Adhesive Specially for FPC & PI Bonding UV 1034 is a UV curable adhesive featuring good adhesion compatibility with FPC and PI substrates. FPC Solder Joint Fixation Recommended applications: Recommended Grades for Wide-Temperature-Range…

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How to Select Structural Adhesives for Power Batteries? Recommended Grades for Bonding Cells, Trays and Cooling Plates

2026-08-03

Power battery structural adhesives shall be selected according to bonding positions, structural load capacity, modulus, impact resistance, thermal conductivity requirements and rework demands.For flexible structural bonding between cells, Elaplus PUR 1610 is available for evaluation; PUR 1665 is recommended when both thermal conduction and bonding performance are required; MSEP 2018, MA 9130AB or PUR 1603S can be assessed for bonding battery upper/lower covers and stiffeners; TCMP 1920-2K is suitable for areas between battery modules and cooling plates where disassembly and rework are necessary. Battery Pack Sealing Where Are Structural Adhesives Applied in Power Batteries? A power battery pack is not merely an arrangement of cells inside a tray. It is a complex structure continuously subjected to vibration, collision, temperature fluctuation and expansion during charging and discharging. Common bonding positions for structural adhesives: Different positions bear loads in different directions and serve distinct functions, so a single high-hardness structural adhesive cannot satisfy all application scenarios. Recommended Grades for Cell Structural Bonding PUR 1610: Flexible Polyurethane Structural Adhesive PUR 1610 is a 1:1 two-component polyurethane structural adhesive featuring excellent flexibility, low modulus, strong adhesion and outstanding impact resistance. Cell Structural Bonding Suitable applications: Cells may undergo slight dimensional changes during charging/discharging and temperature cycling. The flexible adhesive layer formed by PUR 1610 delivers reliable bonding strength while reducing mechanical constraints imposed by rigid adhesives on cells. PUR 1665: Thermally Conductive Polyurethane Structural Adhesive PUR 1665 is a 1:1 two-component thermally conductive polyurethane structural adhesive capable of structural bonding and heat transfer simultaneously. Suitable applications: Elaplus PUR 1665 achieves thermal conductivity ranging from 1.2 ~ 2.0 W/m·K, with a typical formulation of 1.3 W/m·K listed in the datasheet. Adhesive Selection for Battery Upper/Lower Covers & Stiffeners MSEP 2018: Tough Hybrid Structural Adhesive Battery Pack Sealing MSEP 2018 is a 2:1 hybrid structural adhesive…

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How to Select Potting Adhesives for Lithium Batteries: Comparison of Lightweight, Thermally Conductive and Flame-Retardant Grades

2026-07-30

Lithium battery potting compounds shall be selected based on lightweight requirements, thermal conductivity, flame retardancy, operating temperature, cured hardness and potting volume. If battery pack weight reduction is required, Elaplus PUR FOAM 1685 or SIPA 2100-7# can be evaluated. For applications requiring flexible flame retardancy and moderate thermal conductivity, PUR 1680 is recommended. Where a wide service temperature range and low-stress protection from silicone materials are needed, SIPA 1850 is the preferred option. Why Do Lithium Batteries Require Potting Compounds? Lithium battery potting compounds are mainly used to fill voids between battery cells, BMS, high-voltage components and the enclosure, delivering the following protections for battery systems: Low-Density Lithium Battery Potting Compound ■ Waterproof and moistureproof performance ■ Electrical insulation ■ Component fixation ■ Vibration and shock resistance ■ Flame retardant protection ■ Heat transfer ■ Prevention of dust and contaminant ingress Nevertheless, battery packs generally require large-volume potting. Materials with excessive density will significantly increase the overall pack weight. Therefore, when choosing lithium battery potting compounds, thermal conductivity and unit price cannot be the only evaluation criteria. Recommended Potting Compounds for Lightweight Battery Packs PUR FOAM 1685: Foamed Polyurethane Potting Compound PUR FOAM 1685 is a 1:1 two-component foaming polyurethane potting compound. Key Features: ■ Working life: approx. 1–5 minutes ■ Foaming completes within around 10 minutes ■ Foamed density: approx. 0.2 g/ml ■ Suitable for large-volume lightweight void filling Recommended Applications: ■ Cavity filling of battery packs ■ Cushioning protection between battery cell modules ■ Weight-sensitive energy storage batteries and power batteries ■ Structures demanding reduced weight per unit potting volume For foamed potting materials, strict control shall be implemented on expansion ratio, cell uniformity, foaming pressure and impacts on cell structures. SIPA 2100-7#: Low-Density Silicone Potting Compound SIPA 2100-7# is a 1:1 low-density silicone potting compound with a…

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How to Select Thermal Gel, Thermal Pad and Thermal Putty? Recommended Grades of Electronic Thermal Materials

2026-07-22

Electronic thermal interface materials shall be selected based on interface gap, assembly pressure, rework requirements, thermal conductivity, dispensing process and component stress. Elaplus TCMP thermal gel is recommended for irregular gaps and automated dispensing. TCMP 3375 can be evaluated for applications with high heat flux and curing positioning demands. GP 50 thermal putty suits large gaps and reworkable structures. GP 600 thermal pads are ideal for fixed-thickness mass assembly. If both thermal conduction and bonding are required, SIPA 1921 or SIPC 1928 are available options. Why Thermal Interface Materials Are Needed Even With Heatsinks Surfaces of chips, power modules and heatsinks look flat visually, yet they feature numerous micro bumps and air voids at the microscopic level. Air has poor thermal conductivity. Direct contact between chips and housings leads to insufficient effective contact area and high interfacial thermal resistance. Thermal gels, thermal pads and thermal putty fill these voids to form continuous thermal conduction paths. Suitable Applications for Thermal Gel TCMP Two-Part Thermal Gel Series TCMP series adopts a 1:1 mixing ratio and offers multiple thermal conductivity grades to match different thermal design targets. Key Features Recommended Applications: 1、IGBT and power modules; 2、ECU, MCU and automotive controllers; 3、Communication base stations; 4、Optical modules; 5、AI server boards; 6、LED driver power supplies. TCMP 3375: Curable High-Thermal-Conductivity Gel As specified in the datasheet, TCMP 3375 is a one-part curable thermal gel with thermal conductivity of approx. 7.5 W/m·K, viscosity ranging from 280,000 ~ 350,000 cps and cured hardness of Shore 00 50. Recommended Applications: 1、High heat-flux chips; 2、Interfaces requiring shape retention after dispensing; 3、Structures where material migration or pump-out shall be avoided; 4、Long-term thermal conduction between chips and heat dissipation housings. Suitable Applications for Thermal Putty GP 50: Pre-Cured Thermal Putty GP 50 is a one-part pre-cured thermal putty with thermal conductivity of approx….

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