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Motor Stator Thermally‑Conductive Potting Compound Selection | Recommended Grades for Robot Joint Motors and NEV Motors

2026-08-10

When selecting potting compounds for motor stators, thermal conductivity alone should not be the only comparison indicator. Viscosity, wet‑out capability, Tg, coefficient of thermal expansion (CTE), cure shrinkage, hardness and crack‑resistance performance shall also be evaluated simultaneously. For conventional epoxy potting of motor stators, evaluate Elaplus EP 1715. Choose EP 1716 for applications requiring high Tg, low shrinkage and crack resistance. For high‑power‑density applications such as robot‑joint motors and new‑energy‑vehicle motors where higher thermal conductivity is needed, evaluate EP 1796‑2# with a thermal conductivity of approx. 2.5 W/m·K. Motor Potting Why Do Motor Stators Require Potting? Stator windings continuously generate heat when energized. As motors trend toward miniaturization, higher rotational speed and elevated power density, heat inside windings becomes harder to dissipate in a timely manner. Motor stator potting compounds mainly deliver the following functions: Robot‑joint frameless torque motors, servo motors and new‑energy‑vehicle drive motors feature high power density, which places higher comprehensive requirements on motor thermally‑conductive potting compounds. Recommended Grades for Conventional Motor Stator Potting EP 1715: Epoxy Potting Compound for Stators EP 1715 is a 100:15 two‑component heat‑curing epoxy potting compound, suitable for potting of general‑purpose motor stators and windings. Recommended Applications: Parameters of EP 1715 may vary for different suffixes or formula versions. Always refer to the latest corresponding TDS for public release. Grade Recommendation for Motors Requiring High Tg and Crack Resistance EP 1716: High‑Tg Low‑Shrinkage Epoxy Potting Compound EP 1716 is a 100:5 two‑component epoxy potting compound characterized by high Tg, high temperature resistance, low cure shrinkage and crack resistance. Its service temperature ranges from approx. ‑50 ℃ to 180 ℃. Suitable for: High Tg helps the material maintain mechanical stability at elevated operating temperatures. Low cure shrinkage and low CTE help reduce thermal stress among windings, iron cores and cured compound. High‑Thermal‑Conductivity Grade for Motor Stators EP…

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Motor Magnet Bonding Adhesive Selection | Model Comparison for Permanent‑Magnet Motors and Small Motors

2026-08-10

Adhesives for motor magnet bonding shall be selected based on motor rotational speed, long‑term temperature resistance, magnet‑to‑rotor substrate combination, adhesive layer thickness, curing method and production cycle. For conventional one‑component heat‑curing options, evaluate Elaplus EP 1739‑1K. Choose EP 1769‑1K when high Tg and high thixotropy are required. For two‑component systems with high shear strength and toughness, select EP 2029‑2K. For high‑frequency electromagnetic fast curing requirements in small motors, EP 1772‑1K is recommended. Why Mechanical Snap‑in Grooves Alone Are Not Enough for Motor Magnets During operation, permanent‑magnet motor magnets are subjected to: Adhesive failure may cause magnet displacement, detachment and rotor unbalance. In severe cases, the motor stator and housing can be damaged. Recommended Grades for Conventional Magnet Bonding EP 1739‑1K: One‑component semi‑fluid epoxy adhesive Motor Magnet Bonding EP 1739‑1K is a one‑component heat‑curing epoxy adhesive with semi‑fluid consistency. Its datasheet lists viscosity at approx. 27 000 cps and service temperature ranging from ‑50 ℃ to 200 ℃. Suitable for: EP 1769‑1K: High‑Tg & high‑thixotropy magnet‑bonding adhesive EP 1769‑1K is a one‑component low‑flow epoxy adhesive with viscosity ≥ 300 000 cps. Recommended curing profile: 120 ℃ for 30 minutes; service temperature: ‑50 ℃ ~ 200 ℃. Suitable for: Recommended Two‑Component Magnet‑Bonding Grade EP 2029‑2K: High‑shear epoxy structural adhesive Motor Epoxy Structural Adhesive EP 2029‑2K is a 2:1 two‑component epoxy adhesive featuring good peel resistance and shear strength. According to its datasheet, shear strength on stainless steel reaches approx. 6 MPa at 150 ℃; service temperature ranges from ‑50 ℃ to 180 ℃. Suitable for: Grade for High‑Volume Small‑Motor Production EP 1772‑1K: High‑frequency electromagnetic fast‑curing adhesive EP 1772‑1K is a one‑component epoxy adhesive that achieves fast curing within around 20 seconds via high‑frequency electromagnetic heating, ideal for magnet segment bonding of small‑size motors. Recommended applications: Elaplus EP 1739‑1K, EP 1769‑1K, EP 2029‑2K and EP 1772‑1K cover semi‑fluid thermal curing, high‑thixotropy high‑Tg, two‑component high‑shear and high‑frequency fast‑curing…

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How to Select Potting Materials for Server Power Supplies amid Rising Power Density

2026-08-08

When selecting potting materials for server power supplies, thermal conductivity alone should not be the sole consideration. With the continuous increase in power density of AI servers, power supply modules, high‑frequency transformers, inductors, PFC and DC‑DC modules are subjected to rising temperature rise, vibration and electrical stress. A suitable potting material must strike a balance among thermal conductivity, electrical insulation, stress resistance, flame retardancy, flowability and production cycle time. Improper material selection may lead to incomplete filling, excessive bubbles, cracking upon curing, component stress‑induced damage and unstable heat dissipation performance. 1. Why Do Server Power Supplies Require Potting? Server power supplies integrate a large number of power devices and magnetic components, operating continuously under high‑load, frequent start‑stop and persistent heat‑generation conditions. Potting materials generally deliver the following functions: It should be noted that potting does not mean fully filling the entire power‑supply module. High‑frequency transformers, inductors and auxiliary power supplies are suitable for potting. Between power semiconductors and heat sinks, thermal gels, thermal greases or other thermal interface materials are more applicable. 2. Do Not Rely Solely on Thermal Conductivity for Material Selection 2.1 Actual Thermal Resistance Outweighs Nominal Thermal Conductivity High nominal thermal conductivity does not guarantee superior practical heat dissipation. Whether a stable thermal conduction path can be formed after potting depends on multiple factors: For server power supplies, temperature‑rise tests on actual modules are recommended, instead of merely comparing W/m·K values from product datasheets. 2.2 Flowability Determines Potting Feasibility Fine winding gaps commonly exist inside high‑frequency transformers and inductors. Excessively high material viscosity prevents sufficient penetration into gaps among coils, bobbins and magnetic cores, resulting in bubbles or unfilled areas. Therefore, key points to verify during selection: High‑thermal‑conductivity materials contain abundant thermal fillers. Higher thermal conductivity is usually accompanied by increased viscosity and density. A balance between…

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Selecting BMS Conformal Coatings & CCS Fixing Adhesives: FPC, PI & Shadow Cure Model Recommendations

2026-08-04

Adhesives for BMS and battery integrated busbars shall be selected according to circuit board moisture resistance, FPC & PI bonding, solder joint reinforcement, UV curing speed and shadow-area curing requirements. For fast conformal coating of BMS circuit boards, Elaplus UV Coating 9060M is available for evaluation; UV 1013 is suitable for integrated busbar and solder joint reinforcement; UV 1034 is the choice for FPC-to-PI bonding; UV SI 3301 delivers wide-temperature-range performance, flexible protection and supplementary curing in shadow areas. Why Do BMS Require Conformal Coating Protection? The BMS undertakes collection of cell voltage, temperature and current data. Once circuit corrosion, loose solder joints or reduced insulation occur, judgment of battery status may be adversely affected. Common risks for BMS and integrated busbars include: Therefore, BMS protection is not merely applying a layer of conformal coating. It also covers FPC fixation, integrated busbar reinforcement and stress buffering for solder joints. Recommended Grades for BMS Circuit Board Conformal Coating UV Coating 9060M: UV & Moisture Dual-Cure Conformal Coating UV Coating 9060M is a low-viscosity UV & moisture dual-cure material. Its viscosity specified in the datasheet is approximately 190 cps, with operating temperature ranging from -65℃ to 125℃. Suitable applications: Exposed areas achieve fast UV curing; component bottoms and shaded regions complete secondary curing via moisture. Recommended Grades for Integrated Busbar Reinforcement UV 1013: Fast UV Cure Reinforcement Adhesive UV 1013 is a one-component UV curable adhesive with viscosity around 20,000 cP. Typical curing time under 365 nm UV light is approx. 10 seconds as specified in the datasheet. Recommended applications: Recommended Grades for FPC & PI Bonding UV 1034: Adhesive Specially for FPC & PI Bonding UV 1034 is a UV curable adhesive featuring good adhesion compatibility with FPC and PI substrates. FPC Solder Joint Fixation Recommended applications: Recommended Grades for Wide-Temperature-Range…

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How to Select Structural Adhesives for Power Batteries? Recommended Grades for Bonding Cells, Trays and Cooling Plates

2026-08-03

Power battery structural adhesives shall be selected according to bonding positions, structural load capacity, modulus, impact resistance, thermal conductivity requirements and rework demands.For flexible structural bonding between cells, Elaplus PUR 1610 is available for evaluation; PUR 1665 is recommended when both thermal conduction and bonding performance are required; MSEP 2018, MA 9130AB or PUR 1603S can be assessed for bonding battery upper/lower covers and stiffeners; TCMP 1920-2K is suitable for areas between battery modules and cooling plates where disassembly and rework are necessary. Battery Pack Sealing Where Are Structural Adhesives Applied in Power Batteries? A power battery pack is not merely an arrangement of cells inside a tray. It is a complex structure continuously subjected to vibration, collision, temperature fluctuation and expansion during charging and discharging. Common bonding positions for structural adhesives: Different positions bear loads in different directions and serve distinct functions, so a single high-hardness structural adhesive cannot satisfy all application scenarios. Recommended Grades for Cell Structural Bonding PUR 1610: Flexible Polyurethane Structural Adhesive PUR 1610 is a 1:1 two-component polyurethane structural adhesive featuring excellent flexibility, low modulus, strong adhesion and outstanding impact resistance. Cell Structural Bonding Suitable applications: Cells may undergo slight dimensional changes during charging/discharging and temperature cycling. The flexible adhesive layer formed by PUR 1610 delivers reliable bonding strength while reducing mechanical constraints imposed by rigid adhesives on cells. PUR 1665: Thermally Conductive Polyurethane Structural Adhesive PUR 1665 is a 1:1 two-component thermally conductive polyurethane structural adhesive capable of structural bonding and heat transfer simultaneously. Suitable applications: Elaplus PUR 1665 achieves thermal conductivity ranging from 1.2 ~ 2.0 W/m·K, with a typical formulation of 1.3 W/m·K listed in the datasheet. Adhesive Selection for Battery Upper/Lower Covers & Stiffeners MSEP 2018: Tough Hybrid Structural Adhesive Battery Pack Sealing MSEP 2018 is a 2:1 hybrid structural adhesive…

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How to Select Potting Adhesives for Lithium Batteries: Comparison of Lightweight, Thermally Conductive and Flame-Retardant Grades

2026-07-30

Lithium battery potting compounds shall be selected based on lightweight requirements, thermal conductivity, flame retardancy, operating temperature, cured hardness and potting volume. If battery pack weight reduction is required, Elaplus PUR FOAM 1685 or SIPA 2100-7# can be evaluated. For applications requiring flexible flame retardancy and moderate thermal conductivity, PUR 1680 is recommended. Where a wide service temperature range and low-stress protection from silicone materials are needed, SIPA 1850 is the preferred option. Why Do Lithium Batteries Require Potting Compounds? Lithium battery potting compounds are mainly used to fill voids between battery cells, BMS, high-voltage components and the enclosure, delivering the following protections for battery systems: Low-Density Lithium Battery Potting Compound ■ Waterproof and moistureproof performance ■ Electrical insulation ■ Component fixation ■ Vibration and shock resistance ■ Flame retardant protection ■ Heat transfer ■ Prevention of dust and contaminant ingress Nevertheless, battery packs generally require large-volume potting. Materials with excessive density will significantly increase the overall pack weight. Therefore, when choosing lithium battery potting compounds, thermal conductivity and unit price cannot be the only evaluation criteria. Recommended Potting Compounds for Lightweight Battery Packs PUR FOAM 1685: Foamed Polyurethane Potting Compound PUR FOAM 1685 is a 1:1 two-component foaming polyurethane potting compound. Key Features: ■ Working life: approx. 1–5 minutes ■ Foaming completes within around 10 minutes ■ Foamed density: approx. 0.2 g/ml ■ Suitable for large-volume lightweight void filling Recommended Applications: ■ Cavity filling of battery packs ■ Cushioning protection between battery cell modules ■ Weight-sensitive energy storage batteries and power batteries ■ Structures demanding reduced weight per unit potting volume For foamed potting materials, strict control shall be implemented on expansion ratio, cell uniformity, foaming pressure and impacts on cell structures. SIPA 2100-7#: Low-Density Silicone Potting Compound SIPA 2100-7# is a 1:1 low-density silicone potting compound with a…

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How to Select Thermal Gel, Thermal Pad and Thermal Putty? Recommended Grades of Electronic Thermal Materials

2026-07-22

Electronic thermal interface materials shall be selected based on interface gap, assembly pressure, rework requirements, thermal conductivity, dispensing process and component stress. Elaplus TCMP thermal gel is recommended for irregular gaps and automated dispensing. TCMP 3375 can be evaluated for applications with high heat flux and curing positioning demands. GP 50 thermal putty suits large gaps and reworkable structures. GP 600 thermal pads are ideal for fixed-thickness mass assembly. If both thermal conduction and bonding are required, SIPA 1921 or SIPC 1928 are available options. Why Thermal Interface Materials Are Needed Even With Heatsinks Surfaces of chips, power modules and heatsinks look flat visually, yet they feature numerous micro bumps and air voids at the microscopic level. Air has poor thermal conductivity. Direct contact between chips and housings leads to insufficient effective contact area and high interfacial thermal resistance. Thermal gels, thermal pads and thermal putty fill these voids to form continuous thermal conduction paths. Suitable Applications for Thermal Gel TCMP Two-Part Thermal Gel Series TCMP series adopts a 1:1 mixing ratio and offers multiple thermal conductivity grades to match different thermal design targets. Key Features Recommended Applications: 1、IGBT and power modules; 2、ECU, MCU and automotive controllers; 3、Communication base stations; 4、Optical modules; 5、AI server boards; 6、LED driver power supplies. TCMP 3375: Curable High-Thermal-Conductivity Gel As specified in the datasheet, TCMP 3375 is a one-part curable thermal gel with thermal conductivity of approx. 7.5 W/m·K, viscosity ranging from 280,000 ~ 350,000 cps and cured hardness of Shore 00 50. Recommended Applications： 1、High heat-flux chips; 2、Interfaces requiring shape retention after dispensing; 3、Structures where material migration or pump-out shall be avoided; 4、Long-term thermal conduction between chips and heat dissipation housings. Suitable Applications for Thermal Putty GP 50: Pre-Cured Thermal Putty GP 50 is a one-part pre-cured thermal putty with thermal conductivity of approx….

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How to Select Potting Compounds for PCBA: Comparison of Epoxy, Polyurethane & Silicone Grades

2026-07-22

Potting compounds for PCBA shall be selected according to component stress sensitivity, operating temperature, thermal conductivity requirements, structural strength, potting clearance and rework demands. Silicone potting compound SIPA 1850 is suitable for modules with wide temperature range, low stress and frequent thermal cycling; PUR 1650 and PUR 1680 are recommended for control boards requiring flexibility, vibration resistance and gap filling; EP 1715 and EP 1780 apply to electronic modules demanding robust structural support, temperature resistance and dimensional stability. Why is PCBA Potting Required? PCBA potting refers to filling liquid compound between the PCB and housing, which cures to encapsulate printed circuit boards, solder joints and electronic components. Its core functions include: Compared with conformal coating, potting compounds form much thicker layers and deliver more comprehensive protection, yet they bring higher weight, greater exotherm during curing and increased difficulty for rework. Recommended Silicone Potting Compounds for PCBA SIPA 1850AB: Thermally Conductive Silicone Potting Compound SIPA 1850 is a 1:1 two-part thermally conductive silicone potting material. Its mixed viscosity is approximately 3000 cps. Multiple thermal conductivity grades ranging from 0.8 to 4.0 W/m·K are available, with cured hardness of Shore A 55. Typical Applications: 1、Automotive electronic controllers; 2、OBC, power supply and inductor modules; 3、Photovoltaic inverters; 4、Energy storage electronic modules; 5、PCBAs exposed to frequent thermal cycling; 6、Components sensitive to mechanical stress. Cured silicone remains elastic, capable of absorbing thermal displacement between PCBs, copper busbars, plastics and metal housings. Recommended Polyurethane Potting Compounds for PCBA PUR 1650AB: Low-Hardness Thermally Conductive Polyurethane PUR 1650 is a 5:1 low-hardness thermally conductive polyurethane potting material. Its mixed viscosity is roughly 600 cps with thermal conductivity of approx. 1 W/m·K. Typical Applications: 1、PCBAs with complex structures and narrow gaps; 2、Control boards requiring low-stress protection; 3、Sensors and compact electronic modules; 4、Equipment demanding low-temperature flexibility. PUR 1680AB: Balanced Flexibility &…

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Adhesives Selection for FPC Fixation: Recommended Grades for Solder Joint, NTC and Rigid‑Flex Reinforcement

2026-07-22

Adhesives for FPC fixation shall feature flexibility, low stress, good adhesion to PI substrates, excellent flex resistance and compatibility with high-speed dispensing.For rapid reinforcement of solder joints and leads, you may evaluate Elaplus UV 1013 or UV 1018. UV 1017 is recommended for rigid-flex transition areas without dynamic bending requirements. For large-area flexible conformal protection, UV Coating 9060-M or UV SIPC 3301 are available. SIPC 1857-1 can be assessed for flexible fixation of NTC sensors and leads. Why do failures frequently occur at solder joints and rigid-flex interfaces of FPCs? The FPC substrate itself withstands bending, whereas solder joints, chips, connectors and adhesive layers are generally stiffer than the flexible circuit. When the FPC undergoes bending or vibration, stress tends to concentrate at the following locations: If the fixing adhesive features excessively high modulus and is applied over an overly large area, the reinforcement layer may conversely become a new crack initiation boundary. Adhesives used on FPCs mainly serve for SMD component fixation, flexible conformal protection, wire encapsulation and NTC sealing. After curing, the adhesives must remain flexible to avoid impairing the bendability of flexible circuits. Recommended adhesive grades for FPC solder joint reinforcement UV 1013: Flexible UV Fixing Adhesive UV 1013 is a UV-curable modified acrylate adhesive with semi-thixotropic property and outstanding toughness. Recommended applications: Its semi-thixotropic consistency enables the adhesive to wrap solder joints while minimizing excessive flow-out. UV 1018: Balanced fixation and stress buffering UV 1018 suits rapid encapsulation of FPC components, solder joints and partial circuits, striking a balance between curing speed and flexibility. Recommended applications: Adhesive selection for rigid-flex transition zones UV 1017: Local high-strength reinforcement UV 1017 is designed for rigid-flex transition areas requiring high bonding strength without continuous dynamic bending. Typical applications: UV 1017 is not suitable for large-area coverage over primary dynamic…

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