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Industry Application

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Transparent Potting Compound for Photoelectric Reading Modules in Smart Water Meters? Selection of EP 1708 (7#) Epoxy Adhesive

2026-11-02

For transparent potting protection of photoelectric reading modules in smart water meters, ELAPLUS EP 1708 (Grade 7) two-component transparent epoxy potting compound is recommended for evaluation. It features high transparency, ambient or heat cure, and insulation protection for electronic components, suitable for photoelectric inspection and display assemblies qualified for epoxy encapsulation. For smart water meters adopting direct photoelectric reading, reflective detection or other optical sampling structures, it is critical to verify whether the potting layer interferes with the optical path, component positioning and long-term measurement stability. Transparency of the cured adhesive alone does not guarantee compliance with optical detection requirements. A smart water meter generally consists of a metering mechanism, signal acquisition unit, control circuit, communication module and other auxiliary structures. Different products may use magnetic induction, Hall detection, direct photoelectric reading or other signal collection methods, so the encapsulation requirements for internal electronic modules vary. For water meters with photoelectric detection, transmitters, receivers and associated circuits must operate stably under specified conditions. Some assemblies also require transparent protective materials for insulation, moisture resistance and structural retention. Unlike conventional opaque electronic potting, transparent potting compounds must satisfy basic electrical and environmental protection requirements, while also accounting for the influence of the adhesive layer on light transmission and detection signals. 1. Why Do Photoelectric Modules in Smart Water Meters Require Transparent Potting? The photoelectric sensing assemblies inside smart water meters use transmission, reflection or other optical principles to read the status of mechanical metering structures and convert it into electrical signals. If the detection zone requires a defined optical path, the transparency and optical compatibility of the potting material become key selection factors. Control circuits that do not participate in light transmission do not necessarily require transparent potting materials. A well-designed potting structure provides insulation and environmental protection for designated PCBs,…

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Adhesive for Securing PCB Components in Industrial LED Lights? Selection of SIPC 1826 Silicone Adhesive & Sealant

2026-11-02

For local fixation and sealing of PCB components inside industrial LED luminaires, ELAPLUS SIPC 1826 one-component alkoxy-cure silicone adhesive sealant is recommended for evaluation. It leverages adhesion, elastic protection and sealing properties to provide auxiliary fixation for designated electronic components and structural joints. For industrial luminaires requiring heat resistance, insulation and long-term environmental reliability, the dispensing scheme shall be defined based on actual substrates, bond-line thickness, cure mechanism and operating temperature. General component fixation adhesives shall not be used as the primary thermal interface material. PCB Component Securing Industrial LED luminaires are widely used in factory lighting, equipment indicators, automated production lines, warehouse lighting and other industrial environments. Compared with ordinary indoor lighting, some industrial luminaires are subjected to continuous operation, equipment vibration, temperature cycling, dust and other harsh conditions. Within LED driver power supplies and control PCBs, capacitors, inductors, connectors and other components may require local auxiliary securing. For luminaires with metal housings, plastic brackets or separate wiring cavities, elastic sealing materials may also be required at specified joints. This application differs from full-board potting. Its main purposes are to restrain movement of local components, protect selected connection zones and achieve required structural sealing. 1. Why Do Industrial LED Luminaires Need Component Fixing Adhesive? PCBs inside industrial LED lights are usually mounted to the housing via screws, snaps or other fasteners. However, certain large or heavy components may still experience vibrational loads during shipping, assembly and service. For inductors, capacitors and other tall components on driver boards, properly applied local auxiliary fixation reduces uncontrolled relative movement and lowers mechanical stress on solder joints. That said, adhesive cannot replace the PCB’s primary mounting structure or the original soldering of components. For heavy components, mechanical retention, pad design and assembly clearance shall be verified first before deciding whether dispensing is required….

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Slow Actuation of Solenoid Valve Coils after Potting? Check Armature Clearance & Temperature Rise First, Then Select PUR 1680 Polyurethane Potting Compound

2026-11-02

Manufacturer: ELAPLUS Electronic Adhesives Category: Industry Application Date: 22 Oct 2026, 10:54 AM If a solenoid valve exhibits slow pull-in, unstable operation or failure to act normally after coil potting, priority should be given to inspecting moving armature clearance, coil temperature rise, assembly alignment and adhesive overflow into non-potting zones, rather than immediately attributing the fault to insufficient insulation of the potting material. For stationary coils and terminal cavities requiring insulation, moisture resistance and auxiliary fixation, ELAPLUS PUR 1680(D70) A/B two-component polyurethane potting compound may be evaluated. Compatibility with the solenoid assembly must be verified on actual hardware. Coil Potting Solenoid valves are widely used in industrial automation, pneumatic controls, hydraulic systems, fluid control and various electromechanical equipment. The basic principle is that energising the coil generates a magnetic field to drive the movable armature, which actuates the mechanical structure to open, close or switch the valve. In some solenoid designs, the coil assembly is potted to protect windings, connection terminals and other fixed electrical components. A properly designed potting scheme provides insulation, moisture protection and mechanical retention. However, inappropriate potting scope, assembly positioning or thermal design can impair the performance of the electromagnetic actuator. Therefore, material selection for solenoid potting must balance electrical protection and mechanical movement requirements. The full encapsulation approach used for static electronic modules cannot be copied indiscriminately to all solenoid configurations. 1. Why Might Potting Cause Slow Pull-In? Reliable pull-in depends on electromagnetic force generated by the coil overcoming spring force, friction and other applied loads. Coil current, magnetic circuit geometry, armature position and operating temperature all affect final actuation. If potting material encroaches into regions intended for free movement, mechanical resistance increases and prevents the armature from travelling through its designed stroke. For constructions where the coil chamber is fully isolated from the armature,…

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Adhesive for Bonding Automotive LCD Screens and Bezels? Application & Process Selection of SIPA 1830 H50

2026-11-02

For bonding automotive LCD screens to bezels, silicone adhesives featuring elastic bonding, temperature-cycle resistance and stable dispensing performance are recommended for evaluation as candidate materials for such display modules. For automotive display assemblies requiring a balance of bezel fixation, assembly precision and long-term environmental reliability, priority should be given to substrate compatibility, glue line position, assembly gap and curing process, rather than simply pursuing high initial bond strength. With the development of smart cockpits in new energy vehicles, central control screens, instrument displays, passenger entertainment screens and other automotive display modules impose stricter requirements on lightweight design, assembly consistency and long-term reliability. An automotive display module generally consists of a display panel, cover glass, bezel, bracket and related electronic components. Adhesives may be used for bezel fixation, local sealing or other structural joints depending on the design. It is essential to define the actual bonding area first. For joints between LCD panels and bezels, the material must not only secure parts during assembly, but also accommodate dimensional changes of dissimilar substrates under temperature variation. 1. Key Requirements for Bonding Automotive Screens and Bezels Automotive display screens must form structural joints within a narrow bezel width. The dispense position and cured profile of the adhesive directly affect assembly dimensions and cosmetic appearance. Compared with ordinary electronic housing bonding, display modules also require protection of optical zones, bezel positioning and controlled mechanical loading on the display panel. For large-size screens, the differential thermal expansion between bezel and display panel must also be considered in material selection. Therefore, bezel-bonding adhesives for displays must satisfy substrate adhesion, appropriate flexibility, process controllability and environmental reliability simultaneously. Selection Item Core Requirement Impact on Adhesive Selection Substrate Compatibility Adhesion to glass, metal or actual bezel materials Determines interfacial bonding reliability Glue Line Profile Suit narrow-bezel dispensing and…

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What Potting Adhesive for Ignition Controller PCBs? Application Recommendation for PUR 1670 Polyurethane Potting Compound

2026-11-02

ELAPLUS PUR 1670 A/B two-component polyurethane potting compound is recommended as the primary candidate for ignition controller PCB potting. Featuring low viscosity, long pot life, flexibility and electrical insulation, it suits electronic control modules that require a balance of circuit protection, environmental resistance and assembly processability. For ignition controllers containing drive circuits, control components and terminals, define the potting scope according to actual operating voltage, temperature rise, housing geometry and electrical safety requirements, rather than simply filling the entire cavity as the selection criterion. Ignition controllers are widely used in industrial equipment and related systems with electronic ignition control functions. Ignition control modules in different machines may adopt standalone PCBs, drive components, connection terminals and plastic or metal housings, resulting in varied electronic architectures and operating conditions. In service, ignition control boards perform specified signal processing and drive control functions, and some circuits are subject to high voltage or transient electrical stress. Therefore, the potting material must not only provide environmental protection for designated circuits, but also comply with electrical design and long-term operation requirements. For ignition control modules with dedicated potting cavities, polyurethane potting compounds are a viable option for insulation, flexible protection and auxiliary fixation. Ignition Transformer Potting 1. Why Do Ignition Controller PCBs Require Potting? Ignition controllers generally contain control circuits, drive components and electrical interconnections. For electronics requiring environmental protection, potting compound covers selected PCB areas and reduces direct exposure of circuits to moisture and contaminants. When modules are subjected to vibration or temperature cycling during equipment operation, properly selected potting material delivers mechanical protection to components and absorbs partial structural deformation. For circuits with high-voltage requirements, the electrical insulation performance of the potting material is a critical indicator. However, potting does not eliminate the original design requirements for electrical clearance, creepage distance and other safety…

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What Potting Adhesive for Outdoor LED Display Driver Boards? Selection of SIPA 3015 and SIPA 3040 Silicone Potting Compounds

2026-11-02

ELAPLUS SIPA 3015 A/B and SIPA 3040 A/B two-component silicone potting compounds are recommended for evaluation on outdoor LED display driver boards. Both materials feature a 1:1 mixing ratio, adhesive addition-cure chemistry, and support room-temperature or heat curing. For display driver modules requiring circuit insulation, environmental protection and adhesion to plastic or metal housings, compare their actual flowability, thermal management compatibility and curing process first, followed by validation on complete display assemblies. Outdoor LED displays are widely used for commercial advertising, traffic message broadcasting, industrial information display and other public signage applications. Compared with indoor displays, outdoor systems must withstand harsher environmental conditions, so internal drive circuits and power control assemblies require dedicated environmental protection design. The electronic structure of display modules may include LED chips, driver ICs, PCBs, terminals and plastic or metal brackets. Protection requirements vary by location. Potting for driver boards targets designated circuit zones and cavities, and must not be confused with optical encapsulation of the LED light-emitting surface. Therefore, when selecting potting adhesive for outdoor displays, define the dispensing area first, then select materials according to electrical, thermal and mechanical requirements. 1. Why Do Outdoor LED Display Driver Boards Need Potting? During long-term operation, outdoor displays are exposed to day-night temperature cycling, humid air, dust and self-generated heat. For driver PCBs housed in dedicated cavities, potting compound covers specified circuits, solder joints and components to provide insulation and environmental protection for electronic assemblies. Some display modules secure PCBs with plastic brackets or metal housings; the potting material also offers component support and auxiliary fixation. If the material bonds properly to the housing substrate, it helps maintain stable adhesion of the potting layer inside the assembly. Nevertheless, driver board potting cannot replace the overall housing sealing design of the full display module. Overall waterproof performance remains…

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PUR foam 1612｜Polyurethane Formed-In-Place Foam Gasket Sealant, Simplifying Sealing for Complex Housings!

2026-11-02

One-pass dispensing, in-situ foaming, seamless forming. PUR foam 1612 Foam Sealant For electrical control boxes, industrial cabinets, automotive electronics housings and new energy equipment, sealing performance is critical not only for dustproof and waterproof functions, but also directly impacts product assembly efficiency, production tact time and long-term operational reliability. For housing sealing structures with complex geometries, ELAPLUS PUR foam 1612 polyurethane formed-in-place foam gasket sealant is recommended. This product is developed around the FIPFG (Formed-In-Place Foam Gasket) process. With two-component metered dispensing, it forms a continuous foam gasket along the sealing zone of workpieces, delivering a flexible sealing solution for complex contours, irregular grooves and automated production lines. The shift from traditional prefabricated gaskets to formed-in-place foam sealing changes not only the material form, but the entire sealing workflow. 01｜Why Choose PUR Foam 1612? Shifting sealing from pre-assembled gaskets to on-site forming Conventional rubber gaskets require custom moulds according to housing contours, followed by gasket fabrication and manual or machine installation. For electrical control boxes and equipment housings with complex structures and multiple variants, numerous gasket specifications raise costs for mould development, material management and assembly. FIPFG (Formed-In-Place Foam Gasket) technology offers an alternative: automated dispensing equipment applies adhesive directly along pre-defined paths on workpieces. The material foams and cures in situ to form a continuous sealing bead. The application benefits of PUR foam 1612 lie mainly in three aspects: 02｜Two-Component Mixing, In-Situ Chemical Foaming From liquid adhesive to elastic foam gasket PUR foam 1612 adopts the polyurethane formed-in-place foam gasket technology. During application, the two components are metered and blended by dispensing equipment, then deposited onto workpiece surfaces or sealing grooves along programmed paths. Chemical reaction generates foam structures which cure gradually. Unlike conventional non-foaming sealants, formed-in-place foam sealants expand after dispensing and change cross-sectional geometry, yielding foam seals…

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What Potting Adhesive for UAV On-Board Auxiliary Control Boards? Selection Solution for PUR 1618 Low-Hardness Polyurethane Gel

2026-11-02

ELAPLUS PUR 1618 A/B two-component low-hardness polyurethane gel is recommended as the primary candidate for potting of UAV on-board auxiliary control boards. Featuring low viscosity, post-cure flexibility and electrical insulation, it suits electronic control assemblies requiring local environmental protection and elastic cushioning. For auxiliary power supplies or control modules with higher structural support requirements, PUR 1661 A/B may be compared, while potting weight gain, actual temperature rise and equipment maintenance requirements must be assessed simultaneously. Low-altitude UAVs commonly integrate flight control systems, auxiliary power supplies, communication interfaces, status monitoring and other electronic modules. Electronic assemblies differ in mounting position, heat generation and protection requirements, so uniform potting material selection criteria are not applicable. For auxiliary control boards requiring protection, potting serves as part of the insulation, moisture-proofing and mechanical buffering design. Since UAVs are highly sensitive to weight, heat dissipation and maintenance clearance, define the actual protection scope first instead of fully filling the entire PCB by default. 1. Why Elastic Potting Is Required for UAV Auxiliary Control Boards During take-off, landing and normal flight, on-board electronics are subjected to vibration, temperature fluctuation and other environmental loads. For auxiliary control modules installed inside the airframe, properly selected potting adhesive covers designated circuits and provides mechanical protection for selected components and connection points. Unlike stationary industrial equipment, UAVs are sensitive to assembly weight. Additional mass introduced by potting compound is directly added to the airborne system. Therefore, material density, fill volume and structural protection performance shall all be considered in material selection. Furthermore, on-board electronic assemblies include components and connectors of varied sizes, and the mechanical properties of cured adhesive must match the actual structure. Low-hardness potting systems are preferred for PCBs that need to retain compliance. Note that precision inertial sensors, barometric sensors and other mechanically stress-sensitive devices may have…

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What Potting Adhesive for AC Cooling Fan PCBs? Application Recommendation of SIPA 1850 (30#) High-Thermal-Conductivity Silicone Potting Compound

2026-11-02

ELAPLUS SIPA 1850 (30#), a two-component high-thermal-conductivity silicone potting compound, is recommended for potting of AC cooling fan PCBs. It features a thermal conductivity of 3.0 W/(m·K), combining electrical insulation, elastic cushioning and thermal protection. This material is suitable for fan control modules requiring a balance of heat dissipation, circuit protection and resistance to operational vibration. Compared with potting solutions designed solely for high hardness, silicone elastic systems can buffer mechanical and thermal deformation between components, PCBs and housings to a reasonable extent, while the potting layer protects internal electronic circuits. AC cooling fans are widely used in industrial power supplies, communication equipment, energy storage converters, frequency inverters, server power supplies and industrial control systems. Some AC fans integrate control PCBs, drive components, capacitors and connection terminals. During long continuous operation, electronic circuits must withstand internal temperature rise, motor vibration and varying ambient conditions. Therefore, selection of potting adhesive for AC fans should not be based merely on waterproof sealing; thermal conductivity, insulation, post-cure hardness and manufacturing process must also be comprehensively evaluated. 1. Why Do AC Cooling Fan PCBs Require Potting Adhesive? The core function of an AC cooling fan is to deliver continuous airflow for equipment, yet the fan’s own control circuitry also requires reliable protection. For fan modules with integrated PCBs, potting adhesive covers designated electronic components, solder joints and circuit areas to form a relatively complete insulating protective layer. Under long-term operation, control boards are subject to motor vibration and equipment temperature cycling. Proper potting material provides mechanical support for components and connection points, and the flexibility of the cured compound absorbs part of the vibration loads. For applications exposed to moisture, dust or other environmental contaminants, potting forms part of the overall protection scheme and reduces direct exposure of electronic circuits to the outside environment….

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