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Industry Application

What Adhesives for Humanoid Robots? Selection Guide for Joint Motors, Magnets and Sensors

2026-08-18

Common electronic adhesives for humanoid robots mainly include thermal conductive potting compounds, structural adhesives, thermal conductive gels, silicone gels, conformal coatings and sealants. One single material cannot fit all positions. For joint‑motor stators, thermal conductivity, insulation and mechanical fixation are critical. For magnet bonding, high‑temperature adhesion and vibration resistance are essential. Power devices such as MOSFETs require thermal‑interface materials with low thermal resistance. Torque / pressure sensors are best protected by low‑stress silicone gels. Control PCBs generally adopt conformal coatings for moisture‑proof and insulation protection. For these applications, ELAPLUS provides electronic functional‑material solutions including EP 1715 (2#), EP 1769, SIPA 1850, TCMP series, FSGEL 3200, COATING 9060 UV and others. 1. Why Do Humanoid Robots Need Electronic Adhesives? Humanoid robots are highly integrated with frameless torque motors, reducers, drivers, AI computing modules, torque sensors, encoders, control PCBs, batteries and wiring harness systems. During walking, running, jumping, handling, emergency stop and frequent direction switching, internal electronic and mechanical components are continuously exposed to: Accordingly, electronic adhesives for humanoid robots serve six core purposes:thermal conduction, electrical insulation, structural bonding, potting protection, vibration damping and moisture‑proof sealing. The higher the robot’s motion performance, the less designers should rely merely on initial bond strength or single thermal‑conductivity values. Thermal cycling, vibration, shock, fatigue and property retention after long‑term aging must also be evaluated. 2. Which Adhesive for Humanoid‑Robot Joint‑Motor Stators? Recommended: Thermally conductive epoxy potting compound The stator of a humanoid‑robot joint motor requires potting materials delivering thermal conduction, electrical insulation and mechanical fixation.In frameless torque motors, copper windings continuously generate heat. Large air gaps between windings and metal housings severely degrade heat dissipation efficiency. Potting establishes a heat‑transfer path:Windings → Potting Material → Motor Housingwhile mechanically locking the coils in place. Recommended Model: ELAPLUS EP 1715 (2#)EP 1715 (2#) is a two‑component thermally…

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How to Select Potting Compounds for EV Charging Guns?Recommended Grades for Charging Connectors, Charging Piles and OBC

2026-08-17

Different materials shall be adopted for various positions within charging systems. PUR 1645 is suitable for potting of charging gun housings; PUR 1660 GR can be evaluated for applications requiring low viscosity and extended pot life. EP 1788 is recommended for charging sockets. The SIPA 1850 series is an option for inductors inside charging piles. PUR 1680 or SIPA 1850 can be used for thermally conductive potting of OBC units. Why Flexibility and Flame Retardancy Are Emphasized for Charging Gun Potting? Charging guns are continuously subjected to: Although high-hardness materials deliver strong fixing performance, they tend to generate localized stress upon drop impact. PUR 1645A/B Elaplus PUR 1645 is a 100:10 two-component polyurethane potting compound. It features outstanding flexibility after curing and complies with UL94 V-0 flame retardancy standard.It is therefore ideal for charging gun cavity potting. PUR 1660 GR PUR 1660 GR is a 1:1 two-component polyurethane potting compound characterized by low viscosity, long pot life and favorable temperature & weather resistance.This grade is recommended for evaluation on charging guns with intricate internal structures where full penetration of encapsulant into narrow gaps is required. Recommended Adhesive for Charging Sockets EP 1788A/B EP 1788 is a 100:15 two-component epoxy potting compound with: Recommended Grade for Charging Pile Inductors SIPA 1850A/B Series SIPA 1850 (30#) is designed for charging pile inductor potting with thermal conductivity of approximately 3.0 W/m·K. Additional variants such as SIPA 1850 (20#) offer thermal conductivity around 2.0 W/m·K as specified in the full product datasheet.Different thermal conductivity grades can be selected according to inductor heat generation, encapsulant thickness and thermal design requirements. Potting Adhesives for OBC Modules Recommended options:PUR 1680A/B Two-Component Polyurethane Potting Compound100:16 thermally conductive polyurethane encapsulant, medium hardness and high elasticity; thermal conductivity: 0.8~1.2 W/m·K. SIPA 1850A/B Two-Component Silicone Thermally Conductive Potting Compound1:1 addition-cure silicone…

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How to Select Potting Compounds for Three-Phase Copper Busbars?Comparison Between High-Tg Low-CTE and Flexible Epoxy Grades

2026-08-17

Key performance indicators for three-phase copper busbar potting compounds include insulation, oil resistance, thermal cycling resistance, CTE and crack resistance. Elaplus offers three material solutions for three-phase copper busbars: EP 1716, EP 1721-1 and SIPA 3005. EP 1716 features high Tg and low CTE; EP 1721-1 adopts a flexible epoxy system; SIPA 3005 is a one-component heat-curable self-leveling silicone. Why Do Three-Phase Copper Busbars Require Potting? Three-phase copper busbars are widely applied in: They are responsible for high-current transmission and electrical connections. Adhesives used here mainly serve insulation protection, thermal management, shock-resistant fixing and anti-corrosion. High-Tg & Low-CTE Option: EP 1716 EP 1716 Two-Component Epoxy Potting Compound EP 1716 is a 100:5 epoxy potting compound with high Tg and low CTE. Recommended applications: Copper and resin feature different coefficients of thermal expansion. Reducing CTE helps minimize interfacial stress generated during temperature cycling. Need Flexible & Crack-Resistant Material? EP 1721-1 Two-Component Flexible Potting Compound EP 1721-1 is a 3:1 flexible epoxy potting compound with low stress, excellent crack resistance and thermal stability. Suitable for structures demanding strong buffering against thermal displacement and mechanical stress. One-Component Self-Leveling Solution SIPA 3005 One-Component Addition-Cure Sealant SIPA 3005 is a one-component heat-curable, self-leveling silicone. Designed for specific copper busbar sealing and insulation scenarios requiring one-component processing and self-leveling technology. Three-Phase Copper Busbar Material Selection Comparison Grade Material Type Core Advantages EP 1716 Epoxy High Tg, Low CTE EP 1721-1 Flexible Epoxy Low stress, Crack resistance SIPA 3005 Silicone One-component, Heat-curable, Self-leveling FAQ – Common Questions on Busbar Potting Why is CTE particularly critical for busbar potting? Copper busbars and resins expand to different extents under temperature variation. Improper CTE matching may lead to interfacial stress and cracking. Does flexible epoxy have lower strength? Reliability cannot be judged merely by the term “flexible”. Validation should be…

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How to Select Potting Compounds for Industrial Sensors? Recommended Grades for Pressure, Torque and Temperature Sensors

2026-08-13

The core principle for adhesive selection on industrial sensors is not “the firmer the potting, the better”. Materials shall be selected separately according to sensitive elements, housing materials, medium environment, stress requirements and waterproof specifications. Elaplus recommends SIPC 2121 for torque sensors; SIPC 1816 for temperature & pressure sensor cores; SIPC 1810 LV can be evaluated for sealing between aluminum housings and plastics; EP 1788 applies to pressure transmitters; SIGEL 1876 or EP 1708-7# are suitable for the display areas of electromagnetic flowmeters. Adhesive for Torque Sensors SIPC 2121 Flowable One-Component Silicone Adhesive & Sealant SIPC 2121 is adopted for torque sensors. This one-component silicone material features outstanding softness and elasticity.A torque sensor is designed to detect tiny mechanical variations, so the adhesive must not impose excessive constraint on sensitive structures. Adhesive for Temperature & Pressure Sensor Cores SIPC 1816 SIPC 1816 is used for temperature and pressure sensor cores. It adopts a 10:1 mixing system with curing time of 1~2 hours. Key considerations for sensor core adhesives: Recommended Grade for Sealing Between Aluminum Housing and Plastics SIPC 1810 LV SIPC 1810 LV serves for sealing and bonding between aluminum housings and plastic components of temperature & pressure sensors.Dissimilar materials have obvious differences in thermal expansion, hence the sealing material needs to accommodate interfacial displacement. EP 1788 for Pressure Transmitters EP 1788 is an epoxy potting compound for mechanical bonding, sealing and waterproofing of pressure transmitters. Adhesives for Electromagnetic Flowmeters Elaplus provides two options: They are mainly used to protect display sections, preventing water ingress and ensuring stable display performance. Industrial Sensor Adhesive Selection Table Application Recommended Grade Torque Sensor SIPC 2121 Temperature & Pressure Sensor Core SIPC 1816 Sealing: Aluminum Housing / Plastic SIPC 1810 LV Pressure Transmitter EP 1788 Electromagnetic Flowmeter Display Area SIGEL 1876 / EP 1708-7#…

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How to Select Potting Compounds for Automotive Start-Stop Power Supplies? Recommended Grades for Inductors, Current Sensors and EMC Cores

2026-08-13

Different components inside automotive start-stop power supplies have different potting requirements. SIPA 1850 (15#) can be selected for low-stress thermally conductive potting of inductors; PUR 1680 is available for evaluation on current sensors; EP 1788 is suitable for EMC magnetic core potting. Covering silicone, polyurethane and epoxy systems respectively, the three materials balance thermal conductivity, flexibility and structural support. Why Cannot a Single Potting Compound Be Used Uniformly for Start-Stop Power Supplies? Automotive start-stop power supplies contain: These components vary greatly in sensitivity to material hardness, mechanical stress and thermal conduction.For instance, current sensors demand precise control of mechanical stress; magnetic cores generally require stronger structural fixation; inductors need to achieve heat dissipation at the same time. Inductor Potting: SIPA 1850 (15#) SIPA 1850 (15#) is recommended for inductor potting. It is a 1:1 two-component thermally conductive silicone potting compound. As specified in the datasheet, it delivers Shore A 20 hardness, low stress and thermal conductivity of around 1.5 W/m·K. This solution fits inductors requiring a combination of:Thermal conduction + insulation + buffering + potting protection. Current Sensor Potting: PUR 1680 PUR 1680 is a 100:16 two-component thermally conductive polyurethane potting compound. According to datasheet, it features medium hardness and high elasticity, with thermal conductivity ranging from 0.8~1.2 W/m·K for current sensor encapsulation. Compared with high-hardness epoxy, elastic polyurethane helps buffer structural stress effectively. EMC Magnetic Core Potting: EP 1788 EP 1788 is a 100:15 two-component epoxy potting compound designated for EMC magnetic core potting. It boasts stable thermal cycling performance and thermal conductivity of approximately 0.7 W/m·K. It is ideal for magnetic components requiring robust mechanical fixation and integral encapsulation. Grade Comparison for Start-Stop Power Supplies Component Recommended Grade Selection Focus Inductor SIPA 1850 (15#) Low stress & thermal conduction Current Sensor PUR 1680 Elasticity, thermal conduction & stress…

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Adhesive Selection for Electronic Water & Oil Pumps | PCB Potting, Power Module Thermal & Control Board Fixing Solutions

2026-08-12

Adhesive selection for electronic water pumps and electronic oil pumps in new energy vehicles focuses on PCB potting, power module heat dissipation and control board fixation. Elaplus recommends SIPA 1850 for PCB potting, TCMP 1941 for power module heat dissipation, and EP 2012 for control board fixation, to address electronic protection, thermal management and structural reliability challenges respectively. Why Adhesive Requirements for Electronic Water & Oil Pumps Are More Complex An electronic pump integrates motors, power devices, PCBs and fluid systems. Compared with conventional electronic control boards, electronic pumps are continuously exposed to: Key application demands for electronic pumps can be summarized as housing sealing, structural bonding and resistance to medium corrosion. Recommended Grade for Electronic Pump PCB Potting SIPA 1850 Two‑Component Thermally Conductive Silicone Potting CompoundWithin electronic water pump / oil pump solutions, SIPA 1850 is designated for PCB potting. Potting mainly delivers the following functions: Since electronic pumps contain components of varying heights, adequate flowability and air bubble evacuation shall be prioritized during potting process design. Recommended Grade for Power Module Thermal Dissipation TCMP 1941 Two‑Component Thermal Gel TCMP 1941 is used for heat dissipation of internal power modules inside electronic pumps. Heat‑generating components such as power MOSFETs and driver devices require efficient heat transfer to the pump body or metal housing, which makes intact thermal interfaces critical. Key evaluation criteria during material selection:‑ Thermal conductivity‑ Interface conformability‑ Hardness‑ Long‑term thermal cycling performance‑ Material stability Recommended Grade for Control Board Fixation EP 2012 Two‑Component Epoxy Structural Adhesive EP 2012 is applied for control board fixation. For electronic pumps subject to persistent vibration, control boards cannot rely solely on screws, fasteners or solder joints. Proper structural adhesives help share mechanical loads. Adhesive Selection Table for Electronic Water / Oil Pumps Application Location Recommended Grade Core Functions PCB SIPA 1850…

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EP 1721-1 Flexible Epoxy Potting Compound | Structural-Grade Solution for Three-Phase Busbar Sealing and Potting

2026-08-11

With accelerated adoption of 800V high‑voltage platforms and 3‑in‑1 e‑Axle drive systems, operating conditions for internal three‑phase busbars within electric drives have become significantly more demanding. For three‑phase busbars, connection terminals and high‑voltage connectors, potting materials are required not only to deliver insulation and sealing, but also to withstand hundreds of amperes of high current, high‑temperature oil media, long‑term vibration and shock, as well as thermal expansion mismatch between busbars and housing structures. Accordingly, selecting potting compounds for three‑phase busbars in 800V electric drives should focus not merely on hardness and bonding strength, but on the balanced combination of material modulus, flexibility, resistance to high‑temperature oil aging, interfacial adhesion and long‑term mechanical reliability. To address structural fixation and sealing requirements of three‑phase busbars and connection terminals in electric drives, ELAPLUS has developed EP 1721‑1 Flexible Epoxy Potting Compound. By balancing low modulus, high elongation and the adhesive performance of epoxy systems, it mitigates risks of stress concentration at busbar roots under thermal cycling and vibration. 01 Why 800V Electric Drive Three‑Phase Busbars Impose Higher Requirements on Potting Compounds Busbars in traditional electrical systems primarily function for current transmission and connection fixation. In the era of 800V electric drives, three‑phase busbars have evolved from simple wiring components into critical connection structures operating within complex environments. Especially within 3‑in‑1 e‑Axle assemblies, reduction gearboxes and oil‑cooled motor structures, busbars and their connection points are continuously exposed to: If potting materials with excessively high modulus and rigid properties are adopted, asynchronous thermal expansion and contraction between busbars and housings will concentrate stress at busbar roots or adhesive interfaces. After prolonged cycling, the following failures may occur:Adhesive cracking|Interfacial delamination|Busbar loosening|Degraded sealing|Reduced insulation reliability This explains why potting for electric drive busbars cannot simply follow the idea of “harder means stronger”. 02 EP 1721‑1: Relieve Interfacial…

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How to Select Adhesives for PTC Heaters? Recommended Grades for Housing Sealing, Power‑Module Thermal Conduction and Connector Potting

2026-08-10

Multiple single‑material solutions shall be avoided for adhesives used in new‑energy‑vehicle PTC heaters. Material selection shall be carried out respectively for housing sealing, power‑module heat dissipation and local connector potting. For PTC heater applications, Elaplus recommends SIPA 1865‑2K for housing sealing, TCMP 1960‑2K for power‑module heat dissipation, and SIPA 3015‑2K for connector‑section potting, delivering a combined solution of “sealing + thermal conduction + insulation protection”. Adhesive Solution for PTC Heaters Why Multiple Types of Adhesives Are Required for PTC Heaters A new‑energy‑vehicle PTC heater integrates heating elements, power devices, control circuits, connectors and metal housings. Different positions face distinct challenges: Therefore, adopting one single high‑thermal‑conductivity adhesive or one single sealing adhesive for all positions hardly meets all functional requirements simultaneously. Recommended Grade for PTC Housing Sealing Elaplus SIPA 1865‑2K Within Elaplus PTC application solutions, SIPA 1865‑2K is mainly applied for housing sealing. Housing Sealing Main functions: For PTC housing‑sealing materials, initial bonding strength is not the only indicator. Interface delamination and sealing failure after thermal cycling shall be verified as key evaluation items. Recommended Grade for PTC Power‑Module Heat Dissipation Elaplus TCMP 1960‑2K Thermal Gel TCMP 1960‑2K is designated for heat dissipation of PTC power modules. Its core function is not rigidly bonding the power module in place, but filling the interface between power devices and heat‑dissipation structures to transfer heat efficiently to the metal housing. Key selection criteria:‑ Thermal conductivity‑ Interface gap‑filling capability‑ Material hardness‑ Assembly tolerance‑ Thermal‑cycling stability For power devices in particular, excessively hard thermal‑interface materials that introduce high assembly stress onto components shall be avoided. Recommended Grade for PTC Connector‑Section Potting Elaplus SIPA 3015‑2K SIPA 3015‑2K is used for potting of internal PTC connectors to provide local insulation, moisture resistance and fixation. Suitable for protection of:‑ Connector roots‑ Peripheral terminals‑ Local circuits‑ Electrical connection points PTC…

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Motor Lead‑Wire & Neck‑Section Adhesive Selection | High‑Temp, Oil‑Resistant & Anti‑Sagging Grade Recommendations

2026-08-10

Adhesives for motor lead‑wire fixing and neck‑section encapsulation shall be selected according to dispensing position, adhesive thixotropy, long‑term temperature resistance, oil resistance, lead‑wire material and curing process. For flexible fixation of heat‑shrinkable tubes and lead wires, evaluate Elaplus SIPC 1823. EP 1770‑1K is recommended for the neck‑section of brushless motors. EP 1770H‑1K can be applied for inter‑slot sealing of DC motor rotors. For motor housings or sealing positions exposed to oil media, evaluate SIPC 1887. Why Motor Lead‑Wires Require Fixation During motor operation, coil lead‑wires are subjected to continuous loads induced by vibration, electromagnetic force, thermal expansion‑contraction and high‑speed rotor motion. Without fixation at the lead‑wire root, the following failures may occur: Lead‑wire fixing adhesives shall maintain proper flexibility and shall not form rigid bending boundaries at lead‑wire roots. Recommended Grade for Brushless‑Motor Lead‑Wire Fixation SIPC 1823: One‑Component Silicone Lead‑Wire Fixing Adhesive SIPC 1823 is a one‑component silicone adhesive featuring fast tack‑free time and good bonding performance for heat‑shrinkable tubes. According to the datasheet, its viscosity is approx. 35 000 cps with service temperature ranging from ‑60 ℃ to 200 ℃. Suitable for: Note: The motor application schematic page of the datasheet marks SIPC 1822, whereas the parameter sheet lists SIPC 1823. Always confirm the final grade against the latest TDS for formal release, sampling and quotation. Recommended Grade for Brushless‑Motor Neck‑Section Encapsulation EP 1770‑1K: High‑Thixotropy Heat‑Curing Epoxy Adhesive EP 1770‑1K is a one‑component heat‑curing epoxy adhesive. It resists flow at ambient temperature and delivers moderate slight slump upon heating. Per datasheet, viscosity is approx. 150 000 cps; recommended curing profile: 120 ℃ for 60 minutes. Suitable for: Its rheological design of “no flow at room temperature, slight slump under heating” enables the adhesive to stay in place after dispensing, while achieving moderate wet‑out over coil surfaces during curing temperature rise. Recommended Grade for DC‑Motor Inter‑Slot Sealing…

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