Adhesives for BMS and battery integrated busbars shall be selected according to circuit board moisture resistance, FPC & PI bonding, solder joint reinforcement, UV curing speed and shadow-area curing requirements.
For fast conformal coating of BMS circuit boards, Elaplus UV Coating 9060M is available for evaluation; UV 1013 is suitable for integrated busbar and solder joint reinforcement; UV 1034 is the choice for FPC-to-PI bonding; UV SI 3301 delivers wide-temperature-range performance, flexible protection and supplementary curing in shadow areas.
The BMS undertakes collection of cell voltage, temperature and current data. Once circuit corrosion, loose solder joints or reduced insulation occur, judgment of battery status may be adversely affected.
Common risks for BMS and integrated busbars include:
Therefore, BMS protection is not merely applying a layer of conformal coating. It also covers FPC fixation, integrated busbar reinforcement and stress buffering for solder joints.

UV Coating 9060M is a low-viscosity UV & moisture dual-cure material. Its viscosity specified in the datasheet is approximately 190 cps, with operating temperature ranging from -65℃ to 125℃.
Suitable applications:
Exposed areas achieve fast UV curing; component bottoms and shaded regions complete secondary curing via moisture.

UV 1013 is a one-component UV curable adhesive with viscosity around 20,000 cP. Typical curing time under 365 nm UV light is approx. 10 seconds as specified in the datasheet.
Recommended applications:
UV 1034 is a UV curable adhesive featuring good adhesion compatibility with FPC and PI substrates.

Recommended applications:

UV SI 3301 is a low-viscosity UV & moisture dual-cure silicone elastomer. Its viscosity listed in the datasheet is roughly 800 cP, with operating temperature from -55℃ to 200℃.
Suitable applications:
Note: On other PCB-related pages of the datasheet, the similar grade is written as UV SIPC 3301. Please confirm the full model name against the latest TDS before official release and quotation.
Elaplus battery solutions adopt UV Coating 9060M, UV 1013, UV 1034 and UV SI 3301 respectively for BMS conformal coating, integrated busbar reinforcement, FPC/PI bonding and wide-temperature silicone protection.
| Application Location | Recommended Grade | Core Characteristics |
|---|---|---|
| BMS Circuit Board Conformal Coating | UV Coating 9060M | Low viscosity, UV & moisture dual cure |
| Integrated Busbar Reinforcement | UV 1013 | Fast curing under 365 nm UV light |
| FPC & PI Bonding | UV 1034 | Excellent adhesion to flexible board substrates |
| Wide-Temperature Flexible Conformal Coating | UV SI 3301 | Silicone system, -55℃ ~ 200℃ operating range |
UV Coating 9060M is recommended for high-takt production lines and circuit boards with complex structures. UV 1013 can be evaluated for rapid reinforcement of integrated busbars and solder joints. UV 1034 is selected for bonding FPC and PI materials. UV SI 3301 is the preferred option when wider temperature range and flexible coating films are required.
Conformal coatings mainly provide thin-film surface protection. Partial or full potting may still be required if overall waterproofing, structural fixation or high-voltage insulation is needed.
Pure UV adhesives may suffer insufficient curing in shaded areas. For complex structures, UV & moisture dual-cure systems are recommended.
Large-area coverage of main bending zones is not advised. Focus reinforcement on solder joints, terminals and rigid-flex transition areas.
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