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How to Select Potting Compounds for Motors, Connectors and Temperature Sensors? ELAPLUS EP 1796 Heat-Curable Epoxy Potting Compound Solution

2026-05-26

For applications including motor stators, connectors, temperature sensors, pressure sensors, power modules, industrial control modules and reactors, potting compounds not only serve as filling and protection materials, but also directly determine electrical insulation reliability, high-low temperature resistance stability, crack resistance and long-term service life of finished products. Especially in scenarios with severe high-low temperature cycling, long-term high-temperature exposure, strict electrical insulation requirements and high dimensional stability, conventional potting materials tend to suffer from cracking, shrinkage, debonding, insulation degradation and bubble residue. To meet such high-reliability potting demands, ELAPLUS recommends EP 1796 A/B heat-curable potting compound. It is a two-component solvent-free heat-curable epoxy potting material featuring excellent processability and adjustable mixing ratio. With superior high-low temperature aging resistance, it is suitable for potting reactors, connectors, pressure sensors, temperature sensors, industrial control modules and motor stators. I. Why High–Reliability Potting Compounds Are Required for These Applications 1. Motor Stator Potting: Simultaneous Exposure to High Temperature, Vibration and Thermal Stress Motor stators continuously generate heat during operation, while windings, iron cores and housings feature different thermal expansion behaviors. Excessively high linear thermal expansion coefficient or large curing shrinkage of potting compounds may cause cracking, coil loosening and insulation degradation. Therefore, motor potting compounds shall have: ■ High-low temperature shock resistance ■ Low linear thermal expansion coefficient ■ Excellent electrical insulation ■ High hardness and good toughness ■ Long-term heat resistance EP 1796 features low linear thermal expansion coefficient, low curing shrinkage, high hardness and good toughness, making it ideal for potting protection of motor stators, coils and high-temperature electrical structures. 2. Connector Potting: Insulation, Moisture Resistance and Dimensional Stability Are Critical Connectors operate under continuous electrical connection, with internal pins, terminals, solder joints and wire harness joints requiring strict insulation and sealing. Large shrinkage of potting compounds may cause stress concentration around terminals; insufficient temperature resistance may lead…

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How to Select Motor Potting Compound?EP 1716 High-Thermal-Conductivity Epoxy Potting Compound Delivers One-Stop Thermal Dissipation & Reliability for Motors

2026-05-26

A palm-sized stator winding carries hundreds of amperes of electric current; a drive motor generates continuous heat at rotational speeds of tens of thousands of revolutions per minute. Potting compound serves as the final safeguard securing motor operational safety. If motors are the “hearts” of new-energy vehicles and industrial automation, motor potting compounds are the “pericardia” protecting these hearts. They must deliver efficient heat conduction and dissipation, reliable electrical insulation, and resistance to extreme temperature shocks ranging from -50°C to 180°C. Should the wrong compound be chosen for this triple-mission task, the consequence could be full-product recalls. Cutting straight to the point, today we introduce ELAPLUS EP 1716, a high-thermal-conductivity epoxy potting compound that excels specifically in motor stator potting applications. We back our claims with solid performance parameters. I. Why Is Motor Potting Becoming Increasingly Demanding? Latest data shows the global potting compound market reached approximately USD 3.9 billion in 2025, among which automotive thermal‑conductive potting compounds alone exceeded USD 1.2 billion, projected to surge to USD 2.5 billion by 2034. This growth is primarily driven by the booming new-energy vehicle, industrial servo motor and 5G electronic packaging sectors. Take new-energy vehicles as an example. The power density of mainstream drive motors has risen from the early 2-3 kW/kg to 5-7 kW/kg or higher today. Doubled power density means nearly doubled heat generation per unit volume of windings. Meanwhile, the rapid rollout of 800 V high-voltage platforms has raised requirements for motor insulation systems from “basic sufficiency” to “absolute reliability”. In traditional processes, motor stator windings are fixed and protected mainly by impregnating varnish. Yet such varnishes typically feature a thermal conductivity of only 0.2–0.3 W/m·K with insufficient filling capacity, leaving massive air gaps between coils and iron cores. Air, with a thermal conductivity of merely 0.026 W/m·K, acts as a natural thermal barrier….

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How to Select Potting Compounds for Automotive Controllers?ELAPLUS SIPA 1850 High-Thermal-Conductivity & Flame-Retardant Potting Solution

2026-05-25

I. Why Do Automotive Controllers Require Potting? Automotive controllers generally consist of PCBs, capacitors, inductors, chips, connectors, power devices, sensing units and other components. They are widely applied in electronic modules including: motor controllers, body controllers, water pump controllers, battery management system (BMS) control modules, thermal management controllers, fan controllers, etc. During operation, these modules are exposed to multiple environmental factors: ■  Continuous heat generation from high‑power devices ■  Vibration and impact caused by vehicle movement ■  Intrusion of moisture, water vapor and dust ■  Material stress changes induced by thermal cycling ■  Insulation risks under high‑voltage electrical conditions ■  Complex internal controller structures with limited heat-dissipation space Without reliable potting protection, controllers may suffer performance degradation or even failure during long-term operation. Core functions of potting automotive controllers include: ■  Thermal conduction and heat dissipation ■  Electrical insulation protection ■  Moisture-proof and waterproof performance ■  Anti-vibration and shock buffering ■  Fixation of electronic components ■  Improved flame-retardant safety ■  Reduced thermal and structural stress impacts ■  Enhanced long-term reliability of controllers II. Challenges in Selecting Potting Compounds for Automotive Controllers Not all potting compounds that can be poured into modules are suitable for automotive electronics. Controllers in particular demand comprehensive high-performance materials. Power devices, inductors, capacitors, chips and other components inside controllers generate heat during operation. Insufficient thermal conductivity of potting materials traps heat, leading to excessive local temperature rise and shortened service life of electronic components. Therefore, potting compounds for automotive controllers must feature excellent thermal conductivity. Controllers have complex internal structures with numerous gaps and dead zones between components. Poor flowability of potting compounds causes incomplete filling, residual bubbles and voids under components. Well-flowing potting compounds penetrate component gaps better, improving encapsulation integrity and consistency. Excessive shrinkage during curing exerts stress on components, solder joints and PCBs, even causing solder joint cracking, component deformation or bonding interface failure. Low curing shrinkage reduces…

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Which Epoxy Resin to Use for Servo Motor Stator Potting?EP 1716 Is Engineers’ Top Choice Thanks to Four Key Performance Metrics

2026-05-23

Every servo motor engineer knows that stator potting may seem straightforward, yet it is full of hidden pitfalls in real-world production. Heat generation, cracking, thermal expansion, and temperature resistance — any one of these issues can lead to scrapped batches of products. To make matters worse, countless potting adhesive brands flood the market with overwhelming technical datasheets. A wrong adhesive selection can even halt your production line. Today we cut to the chase and introduce a high-performance product tailored for servo motor stator potting: ELAPLUS EP 1716 thermally conductive two-part epoxy potting compound. Why this product? We break down its advantages against the four core requirements for servo motor stator potting one by one. 1. High Heat Generation? Thermal Conductivity Must Be Up to Standard Under high-speed and high-torque operating conditions, stator windings of servo motors generate massive heat. If the thermal conductivity of potting adhesive cannot keep up, heat accumulates inside the stator, reducing motor efficiency at best and burning out windings at worst. This is why thermal conductivity is the primary screening criterion for adhesive selection. Comparison of three products: ■ EP 1715: Thermal conductivity 0.6 W/mK ■ EP 1715(3#): Thermal conductivity 1.0 W/mK ■ EP 1716: Thermal conductivity 1.5 W/mK EP 1716 features 2.5-fold higher thermal conductivity than EP 1715 and 50% higher than EP 1715(3#). In practical applications, this means internal stator heat dissipates faster to the housing, lowering motor temperature rise and greatly improving reliability during continuous operation. For high-power-density servo motors, a thermal conductivity of 1.5 W/mK delivers tangible competitive edge. 2. Cracking Under High–Low Temperature Cycling? Aging Test Data Speaks for Itself Servo motors operate in far harsher environments than laboratory conditions. From cold storage with temperatures dropping to tens of degrees below zero in northern China, to hot‑humid workshops in southern China, or sharp temperature fluctuations caused by frequent…

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Sealing for E-Drive Copper Busbar Connectors in NEVs：Why All Traditional Solutions Failed — and How Elaplus Flexible Epoxy EP 1721-1 Succeeded

2026-05-20

I. Industry Background: Why Copper Busbar Connector Sealing Became an “Impossible Trinity” Driven by the integration trend of “multi-in-one” electric drive systems in new energy vehicles (NEVs), the reducer, motor, and electronic control units share a common housing. This compact structure leaves minimal room for sealing design. More critically, gear oil (e.g., BOT805) inside the reducer coexists with high-voltage electrical systems — seal failure can lead to minor issues like grease-contaminated electrical connections, or major hazards such as short circuits. As the core node for three-phase power transmission, copper busbar connector sealing must simultaneously meet three conflicting requirements — the “Impossible Trinity”: 1.Flexibility: Resist cracking under thermal cycling from -40°C to +155°C 2. Oil Resistance: No swelling or softening under long-term gear oil immersion 3.Adhesion: Reliably bond to both PPS plastic and copper metal heterogeneous interfaces II. Why All Traditional Solutions Failed Before EP 1721-1, the industry relied on four main types of sealing materials, each with fundamental flaws: Material Type Flexibility Oil Resistance High-Temp (150°C) Heterogeneous Adhesion Overall Verdict Rigid Epoxy ✗ High modulus ✓ Solvent-resistant ✓ Good heat resistance ✓ Good metal adhesion Cracks inevitably during thermal cycling Silicone ✓ Flexible F80000 ✓ Wide temperature range ✗ Weak adhesion Eroded by oil Polyurethane (PU) ✓ Flexible ✗ Hydrolysis/oil degradation ✗ Insufficient heat resistance ✓ Good adhesion Fails at high temperatures Acrylic ✓ Flexible ✗ Solvent-sensitive ✗ Low Tg ✓ Good adhesion Poor long-term durability EP 1721-1 ✓✓ ✓✓ ✓✓ ✓✓ ✓✓ Meets all requirements comprehensively The core contradiction: In traditional material systems, flexibility and oil resistance are inversely related — the softer the resin, the looser its molecular chains, making it easier for oil molecules to penetrate. This fundamental law of materials science was the insurmountable barrier for all conventional solutions. III. Three Core Technological Breakthroughs of EP 1721-1…

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SIPA 1820-1K One-Component Heat-Curable Silicone Adhesive | Ideal Solution for Enclosure CIPG Sealing

2026-05-19

In applications such as automotive electronics, new energy vehicles, industrial controls, motor control boxes, electric vehicle water pumps and heating components, reliable enclosure sealing is critical to long-term stable product operation. Given the demands for wide temperature resistance, moisture proofing, vibration resistance, structural stress relief and automated production, traditional sealing methods are gradually being replaced by Cured-In-Place Gasket (CIPG) in-situ sealing technology. ELAPLUS SIPA 1820-1K is a one-component heat-curable silicone adhesive developed for enclosure CIPG sealing, providing customers with stable, reliable and high-efficiency solutions for housing sealing and bonding. Product Overview ELAPLUS SIPA 1820-1K is a thixotropic paste-type one-component silicone adhesive cured by heating. It is eco-friendly, non-toxic and easy to use. After curing, it forms flexible silicone elastomer featuring excellent wide temperature resistance, weather resistance, electrical insulation, waterproofing, vibration resistance and thermal expansion & contraction buffering capacity. Formulated for long-term thermally stable bonding, it adheres well to metals, glass, silicone rubber, plastics, mica sheets, ceramics, stainless steel and other substrates. Core Features ■  One-component Thixotropic Paste No mixing required, easy to apply, perfectly suitable for automatic dispensing and mass production. ■  Fast Heat Curing Achieve stable curing under heating conditions to shorten production cycle and boost line efficiency. ■  Excellent Adhesion to Multiple Substrates without Primer Great compatibility with stainless steel, glass, ceramics and more materials. ■  Superior Flexibility & Tear Resistance Cured elastomer effectively withstands structural stress and vibration impact. ■  Addition Cure System No curing by-products, ideal for applications requiring high material stability. ■  RoHS & REACH Compliant Fully in line with international environmental regulations. ■  Ultra-wide Temperature Stability Maintains stable elasticity within the range of -60℃ to +280℃. Why It Is Perfect for Enclosure CIPG Sealing Enclosure CIPG sealing imposes strict requirements on bead forming performance, compression resilience, environmental resistance and process adaptability. SIPA 1820-1K owns outstanding strengths as below: ■  Compression set ＜…

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How to Select Potting Compound for Solenoid Valves: ELAPLUS EP 2025FR: UL 94 V-0 Flame-Retardant Solution with High Bonding Reliability

2026-05-18

In the field of modern precision electronics manufacturing, the stability of solenoid valves, motors, and automotive electronic components directly determines the service life of end products. However, equipment often operates under harsh conditions including high temperatures, vibration, moisture, and chemical corrosion. How to achieve high‑level insulation protection, prevent encapsulation cracking, and ensure strong adhesion to multi‑substrate assemblies? As a professional manufacturer focused on functional materials, ELAPLUS (Shanghai) Co., Ltd. has launched the high‑performance epoxy potting system — EP 2025FR to address industry pain points. This article analyzes the application advantages of this product in solenoid valves and complex electronic components, and explains how it solves industry challenges through technological innovation. Industry Pain Points: Why Do Solenoid & Motor Potting Failures Occur? Engineers often face three core challenges in potting solenoid valves and motors: 1. Adhesion Failure Solenoid valves contain diverse substrates: magnet wires, iron cores, plastic bobbins, and metal housings. Conventional potting compounds fail to deliver strong, consistent bonding to all these materials. Once interfacial delamination occurs, moisture penetrates and causes insulation failure. 2. Thermal Stress Cracking Electronic devices undergo thermal cycling during operation. If the coefficient of thermal expansion (CTE) of the potting gel is too high, large internal stress from shrinkage mismatch can crack the gel or damage delicate internal components. 3. Flame Retardancy & Environmental Compliance With stricter global regulations (UL, RoHS), high‑performance potting compounds must meet UL 94 V‑0 flame‑retardant standards while being solvent‑free. Solution: Technical Features of ELAPLUS EP 2025FR EP 2025FR is a two‑component, solvent‑free, room‑temperature curable epoxy potting compound. Its specially optimized formula provides superior protection and process compatibility. 1.Excellent Multi‑Substrate Adhesion EP 2025FR delivers enhanced adhesion to magnet wires, iron, most plastics, and metals. This universal bonding creates a fully sealed structure inside potted solenoid valves, greatly improving water resistance, moisture resistance,…

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How to Choose Electronic Potting Compounds? ELAPLUS – A 10,000-Ton-Class Electronic Adhesive Manufacturer Providing One-Stop Solutions

2026-05-13

Against the backdrop of rapid development in new energy vehicles, photovoltaic energy storage, and 5G communications, electronic potting compounds, as critical materials that protect electronic components from moisture, vibration, and chemical corrosion, are embracing unprecedented industrial opportunities. Industry data shows that the global electronic potting and encapsulation market size is expected to reach USD 2.82 billion in 2026 and exceed USD 6.4 billion by 2035, with a compound annual growth rate (CAGR) of up to 9.6%. In this track, ELAPLUS® (Elaplus Functional Materials (Shanghai) Co., Ltd.), adhering to the brand philosophy of “Bonding Everything, Adhering to the Future”, has long been engaged in the electronic adhesive field and provides global customers with full-scenario solutions ranging from motor potting compounds, sensor potting compounds, and power supply potting compounds to thermal interface materials. Three Major Trends in the Electronic Potting Compound Industry Forcing Supply Chain Upgrades Currently, the electronic potting compound industry is undergoing three transformations: First, the accelerated penetration of 800V high-voltage platforms in new energy vehicles has raised higher requirements for the insulation strength and thermal conductivity of potting materials. It is estimated that from 2024 to 2026, the CAGR of vehicle-grade thermal conductive potting compound demand will reach 28.5%. Second, domestic substitution is accelerating in an all-round way. Under the considerations of tariff restructuring and supply chain security, the localization rate of electronic adhesives has rapidly climbed from 31% in 2024 to 44% in 2026. Chinese enterprises, leveraging their technological accumulation and production capacity advantages, are competing strongly with foreign-funded enterprises in the mid-to-high-end market. Third, the trend of multi-functional integration is obvious. Potting compounds with a single protective function can no longer meet demands, and composite materials with thermal conductivity, flame retardancy, low stress, fast curing, and other characteristics are becoming mainstream. It is at the intersection of these…

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ELAPLUS SIPC 2150: Industrial Wire Harness Silicone Reinforcement & Potting Fixing Solution

2026-05-12

In industrial wire harness processing, bonding and fixing of silicone wires have long been a technical challenge. Due to silicone’s low surface energy, ordinary adhesives fail to bond firmly. Meanwhile, wire harnesses endure tension, bending, high temperature and high humidity under harsh working conditions, placing high demands on adhesive reliability. To solve industry pain points such as insufficient bonding strength, yellowing at high temperature and failed tension tests, ELAPLUS SIPC 2150 is developed as a neutral alcohol-free bonding & sealing silicone adhesive. Two Core Criteria for Industrial Harness Fixing In wire harness potting and reinforcement processes, high-performance adhesives must meet two critical criteria. 1.Over 30N Tensile Resistance Formulated with a special titanate catalytic system, SIPC 2150 forms strong chemical bonding with silicone materials after curing. It easily passes tensile testing above 30N and prevents component detachment under frequent bending and pulling. 2. Dual 85 Aging Resistance After 500 hours aging under 85℃ & 85% RH environment, ordinary adhesives become brittle and yellow severely. SIPC 2150 remains highly transparent with no yellowing, ensuring long-term stable operation and safety. ELAPLUS SIPC 2150: Full-spectrum Performance All-rounder Beyond optimized formulation for silicone substrates, SIPC 2150 also delivers the following premium performance highlights: 1.Wide Compatibility Excellent adhesion to silicone, PC, PA engineering plastics, aluminum, stainless steel, EVA foam and wood. 2.Extreme Temperature Resistance Operating range: -60℃ ~ 260℃, stable performance for outdoor cold-region equipment and high-temperature cabin applications. 3.Insulation & Corrosion Protection Superior electrical insulation and anti-corona performance; resistant to engine oil, acid and alkali. Service life up to 20–30 years for permanent bonding and fixation. 4.Eco-friendly & Global Compliance Low odor, low volatility and no fogging. Compliant with UL HB flame retardant rating (File No. E547224), meeting international export standards. Application Scenarios ■Industrial automation: Sensor interface reinforcement & signal wire fixing ■New energy vehicles:…

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