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Industry Application

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5mm Full Depth Curing!ELAPLUS UV1020: Redefining the Performance Peak of White UV Dynamic Balancing Adhesives

2026-05-07

UV-curing adhesives have long been a key tool for improving production line efficiency in precision rotating component manufacturing, motor rotor dynamic balancing, and sensor packaging, thanks to their second-level curing speed. However, the industry has long faced a tough technical pain point: the “incomplete curing” issue of white/thick-layer UV adhesives. When the adhesive layer exceeds 3mm, traditional white UV adhesives often suffer from surface hardening but residual soft adhesive at the bottom. This not only causes a sharp drop in bonding strength but also hides quality risks such as falling off and imbalance for long-term product operation. Today, ELAPLUS officially launches UV1020 UV curable acrylic dynamic balancing adhesive. With its breakthrough deep-layer curing technology, it completely breaks the performance bottleneck of thick-layer white UV adhesives, becoming a veritable “top-tier” product in industrial applications. I. Core Pain Point: Why Do Thick-Layer White UV Adhesives Cure Incompletely? In the field of UV curing, curing depth depends on energy density and optical transmittance. To achieve visual opacity, traditional white UV adhesives are usually formulated with high-concentration light-shielding fillers (such as titanium dioxide). These fillers block visible light, while also strongly scattering and absorbing UV light. As a result, UV light cannot penetrate deeper than 3mm, failing to activate the photoinitiator at the bottom layer. For high-precision balanced motor rotors or thick-layer packaged sensors, this incomplete curing directly leads to bonding failure. II. Technical Breakthrough: 20000mJ/cm² Energy Input, Unlocking the 5mm Curing Limit The success of ELAPLUS UV1020 stems from in-depth insights into “energy for depth” and “optical system reconstruction”: High-Energy Curing SystemUV1020 recommends a curing energy of 20000mJ/cm² (based on 365nm LED light source), which is 2-4 times that of ordinary UV adhesives. Coupled with an optimized photoinitiator formula, it ensures thorough free radical reaction at the bottom layer even at a thickness…

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Repairable Silicone Gel for Cable Junction Box Potting: In-depth Analysis of SIGEL 1805 & SIGEL 3078

2026-05-06

In power transmission, communication infrastructure and industrial automation industries, cable junction boxes are core components for connecting and protecting cable joints. Their waterproof, moisture-proof and weather resistance directly determine the operational reliability of the entire system. Traditional potting materials have obvious application drawbacks: non-repairable after curing, failure prone to moisture, narrow temperature resistance range, etc. These issues raise maintenance costs and bring potential safety risks. ELAPLUS launches two repairable silicone gels, SIGEL 1805 and SIGEL 3078. Featuring premium performance and easy repairability, they deliver an innovative technical solution for cable junction box potting. Ⅰ. Industry Pain Points of Traditional Potting Materials 1. Core Requirements for Cable Junction Box Potting Core Demand Specific Requirement Performance Index Waterproof & Moisture-proof Block moisture intrusion and protect electrical connections Low oil bleeding, high dielectric strength Electrical Insulation Stable operation under high voltage Dielectric strength ≥25kV/mm Weather Resistance Long-term outdoor anti-aging Operating temperature: -60~200℃ Stress Buffering Relieve thermal stress and mechanical vibration High elasticity, low hardness Repairability Convenient later maintenance & cost saving Easy-to-remove gel state 2. Drawbacks of Traditional Materials Drawbacks Specific Performance Resulting Problems Non-repairable curing Rigid materials like epoxy resin cannot be removed without damaging components leading to high maintenance costs.  Oil bleeding & contamination Severe oil bleeding pollutes terminal blocks increases contact resistance and impairs electrical performance. Narrow temperature resistance Softens at high temperature and cracks at low temperature failing in extreme outdoor conditions Overly strong adhesion Firm bonding with substrates causes component damage during repair 3. Advantages of Silicone Gel    ※Soft gel state after curing to eliminate mechanical stress ※Repairable design for easy removal without component damage ※Ultra-low oil bleeding to avoid metal contact contamination ※Wide temperature tolerance: -60℃ ~ 200℃ for harsh environments ※Superior dielectric strength for reliable high-voltage protection Ⅱ. Product Introduction 1. SIGEL 1805 Two-component Silicone Gel Product Positioning SIGEL 1805 is a…

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AI-Driven Computing Leap: How ELAPLUS Solves 1.6T Optical Module Thermal Challenges with High-Performance TIM Solutions

2026-04-27

Driven by the AI and large language model revolution, global data centers are experiencing an unprecedented computing power arms race. As the “capillaries” supporting massive data transmission, high-speed optical communication modules are evolving at an unprecedented pace. As transmission rates advance from 100G to 800G/1.6T, optical module power consumption has surged from 3W to over 15W. With exponentially increasing heat density per unit volume, thermal design is no longer a simple auxiliary feature but a critical technical bottleneck determining module performance, stability and reliability. 01 What Causes Thermal Failure? The “heart” of an optical module is its internal TOSA (Transmitter Optical Sub-Assembly) and ROSA (Receiver Optical Sub-Assembly) components. Chip power consumption grows exponentially with transmission rates: a typical 100G module consumes about 3W, while 800G modules have reached 12-15W, and 1.6T modules are heading toward over 20W. 800G Optical Module Power Consumption: 12~15W 4-5 times that of the 100G era · Thermal management solutions must evolve in tandem In practical applications, thermal failure stems from multiple dimensions. 02 ELAPLUS Thermal Management Solutions Product Categories Model Feature Thermal Gel One-component curable 3100# 250um BLT, 10.2W/m-K，Low Volatility 3380# 250um BLT,8.4W/m-K，Low Volatility 3365# 100um BLT, 6.2W/m-K，Low Volatility 3335# 60um BLT, 3.5W/m-K One-component pre-cured TCMP 80#\100# 250um BLT, 8.5/10.0W/m-K，Low Volatility Two-component curable TCMP 1980# 200um BLT8.5W/m-K, shore 00 30 Thermal Pad GP 60 SF 6.0W/m-K, shore 00 55，Non-silicone Thermal Pad TCMP 130# 13W/m-K, Silicone Thermal Pad In the AI era where computing power defines competitiveness, every iteration of optical communication technology pushes the boundaries of physics. ELAPLUS upholds the brand spirit of “keeping chasing forever,” providing not just materials but comprehensive thermal management system solutions tailored to real-world scenarios for global ICT enterprises. Through continuous materials science innovation, ELAPLUS is empowering partners to break through thermal bottlenecks, enabling every beam of light to connect the future of the intelligent world at lower temperatures and higher efficiency.

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SIPA 1850 Thermal Potting Compound: An Ideal Heat Dissipation Solution for High-Power Fast Charging Era

2026-04-24

With the widespread adoption of fast charging technology, chargers have evolved into compact, high-precision power conversion units. However, higher power density brings severe challenges: poor heat dissipation, moisture ingress and drop damage — three core factors that shorten the service life of chargers. How to ensure long-term stable operation of electronic components in limited space? ELAPLUS presents the optimal solution: SIPA 1850 Thermally Conductive Potting Compound. Hidden Pain Points in the Charger Industry Hardware failures account for a major proportion of after-sales costs for electronic manufacturers. The key industry pain points of chargers are as follows: ※Excessive heat accumulation: Rising PD fast charging power leads to surging heat generation of internal components. Unremoved heat will cause power reduction and accelerate aging of electrolytic capacitors and other parts. ※Environmental corrosion: Chargers are often used in humid scenarios such as kitchens, bathrooms and high-humidity areas. Moisture penetration easily causes internal circuit short circuits. ※Mechanical damage: Frequent dropping and vibration loosen welding points and damage fragile internal components. SIPA 1850: All-Round Protection for Core Components Developed by ELAPLUS, SIPA 1850 is a two-component silicone thermally conductive potting compound with balanced performance and comprehensive protection. Efficient Heat Dissipation Featuring high thermal conductivity, SIPA 1850 rapidly transfers heat from components to the housing. It effectively reduces the core temperature rise of high-power chargers, ensuring stable output under long-term high-load operation. Superior Waterproof & Moistureproof Performance Fully potted PCBs form a dense protective layer after curing. The compound maintains excellent insulation under extreme humidity, greatly improving product safety and reliability. Shock & Vibration Resistance Cured silicone rubber retains unique elasticity to absorb external impact and vibration energy. It provides effective cushioning for SMD components and stabilizes internal structures against drops and shocks. Wide Application Scenarios Beyond chargers, SIPA 1850 serves as a reliable protective material for multiple…

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Efficiency Meets Security: PUR 1603 A/B Two-Component Adhesive for PCB IC Encapsulation

2026-04-23

In the modern electronics manufacturing industry, integrated circuits (ICs), serving as the “core brain” of devices, are critical to operational stability and design security. As electronic components evolve toward miniaturization and high integration, IC chips on printed circuit boards (PCBs) are exposed not only to complex mechanical stress,moisture corrosion and chemical erosion, but also to the risk of technology leakage. Traditional encapsulation materials often struggle to balance curing speed, stress relief and cost control. For this reason, PUR 1603 A/B two-component solvent-free room-temperature curing adhesive has become an ideal choice for IC encapsulation on printed circuit boards, thanks to its excellent physical properties and process adaptability. I. Core Technology: Resolving the Conflict Between High Efficiency & Low Stress IC encapsulation on printed circuit boards (COB process or partial potting) imposes stringent requirements on adhesives. Featuring precisely engineered molecular structure, PUR 1603 A/B delivers essential protection while addressing key industry pain points: · Fast Curing at Room Temperature: 30-Minute Cycle for Boosted Productivity Curing time directly determines production efficiency in high-speed electronics manufacturing. PUR 1603 A/B uses a high-efficiency catalytic system and achieves full curing within 30 minutes at room temperature.Unlike conventional one-component heat-curing adhesives, it requires no expensive tunnel ovens or high-energy heat treatment, greatly reducing energy consumption and eliminating thermal damage to precision components. · Low-Modulus Flexibility: Reliable Protection Against Thermal Shock Differences in coefficient of thermal expansion (CTE) among PCB substrates, IC chips and encapsulants often cause internal stress, leading to solder joint cracking or chip failure.Cured PUR 1603 A/B offers excellent low modulus and high flexibility. Its elastic nature effectively absorbs stress during thermal cycling, providing long-term cushioning for delicate pins and precision components. · Superior Confidentiality: Safeguarding Core Intellectual Property Anti-reverse engineering is critical for high-performance circuits and proprietary designs. PUR 1603 A/B provides outstanding opacity, forming…

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Application of Elaplus UV Moisture Organic Silicone Adhesive in New Energy Vehicles

2026-03-18

1、 The current situation of the electronic adhesive market for new energy vehiclesNew energy vehicles are reshaping the global automotive industry at an unprecedented pace. According to industry forecasts, global sales of new energy vehicles will exceed 20 million units by 2025, and the penetration rate of the Chinese market will reach over 50%. In this grand context, the electrification rate of automobiles continues to increase – the number of electronic components used in a mid to high end new energy vehicle has grown from hundreds of traditional fuel vehicles to thousands. Lithium battery encapsulationAlong with the explosive growth in the number of electronic components, the demand for reliability is also constantly increasing. The working environment of new energy vehicles is much more demanding than traditional vehicles: high temperatures generated by the electric drive system, strong electromagnetic interference near the power battery, vibration and impact caused by complex road conditions, and high and low temperature cycles caused by extreme weather… These factors all place higher demands on the protection capabilities of automotive electronics. 20 million+ Global Sales Forecast for 2025 50%+ Penetration rate in the Chinese market 3-5kg Usage of adhesive for bicycles 10 billion+ Global market size by 2025 Adhesive, as a key material in electronic component manufacturing, undertakes multiple functions such as bonding, sealing, protection, and thermal conductivity. In the field of new energy vehicle electronics, the demand for high reliability adhesives is rapidly increasing. It is estimated that the usage of various adhesives for a single new energy vehicle is about 3 to 5 kilograms, and the global market size will exceed 10 billion yuan by 2025. 2、 Elaplus’s productsSince its establishment, Elaplus Functional Materials (Shanghai) Co., Ltd. has always focused on the research and manufacturing of functional silicone materials. The company’s product line covers multiple series…

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Why does the electrode controller need to be sealed? A high thermal conductivity silicone sealant solves the problems of heat dissipation and protection

2026-03-18

In new energy vehicles, energy storage systems, and industrial control equipment, electrode controllers play an important role in current control and signal processing.Due to its internal integration of power devices, control chips, electrode interfaces, and drive circuits, it will face complex environments such as high temperature, humidity, vibration, and electrical shock during long-term operation. Thermal conductive sealant for industrial controllersThermal conductive sealant for industrial controllersIf there is a lack of reliable packaging protection, it is easy to: Moisture in components can cause short circuits or failuresHigh power devices generate heat, resulting in excessive temperature riseFatigue of solder joints or loosening of components under vibration environmentDust or corrosive gases entering, causing a decrease in electrical performanceTherefore, in the fields of industrial electronics and automotive electronics, potting has become a key link in the reliability design of electrode controllers. Why does the electrode controller need encapsulation protection?Electrode controllers are typically used for: New energy vehicle systemElectric vehicle charging equipmentEnergy storage battery management systemIndustrial control equipmentInverter power moduleThese application environments generally have the following characteristics: 3 Mechanical vibration and impactNew energy vehicles and industrial equipment experience significant vibrations during operation, requiring colloids to provide buffering and fixing effects. 4. High electrical insulation requirements The internal circuit of the electrode controller is dense and requires good electrical insulation protection to prevent leakage and breakdown. Therefore, an excellent potting material needs to possess both: Thermal conductivityelectrical insulation performanceWaterproof and moisture-proof performanceLow stress protectionAbility to withstand high and low temperaturesRecommended solution: SIPA 1850-15 silicone thermal conductive sealantFor the packaging requirements of electrode controllers, it is recommended to use SIPA 1850-15 two-component thermal conductive silicone sealant. This product belongs to two-component addition molded silicone rubber material, which has good flowability and stable curing performance after mixing, and can achieve deep encapsulation protection for complex electronic structures. Its…

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The secret of increasing the sealing efficiency of the shell by 5 times: CIPG process+UV 3306

2026-03-17

Why are more and more engineers giving up O-rings?If you have disassembled a car engine or electronic controller, you must have seen a large number of rubber O-rings and sealing gaskets. These seemingly inconspicuous small parts undertake important tasks: Prevent liquid leakage and maintain shell sealing. But as the structures of new energy vehicles and electronic devices become increasingly complex,Traditional seals are exposing more and more problems: ❌ Low assembly efficiency❌ Installation is prone to errors❌ Structural design is limited❌ Low degree of automation So, a new sealing process is rapidly becoming popular: CIPG (Cured In Place Gasket) in-situ molding sealing technology. What is CIPG sealing process?Simply put, there is no need to prefabricate seals, simply glue to form a sealing ring. CIPG in-situ forming sealing technologyPractical application of CIPG sealTraditional production process vs CIPG production process: ⚡ CIPG process: automatic dispensing of flange surface → assembly of shell → solidification to form sealing ring 🔧 Traditional process: purchase O-ring → install O-ring → lubricate → position → prevent distortion → assemble This method has significant advantages compared to traditional O-rings. The three major advantages of CIPG technology🎨High degree of design freedomGlue dispensing in any shape, irregular sealing structure, multi-layer sealing path, hollow sealing structure🤖High assembly efficiencyFully automatic dispensing assembly, assembly efficiency increased by 3-5 times🛡️Good sealing reliabilityLonger sealing path, more uniform contact surface, better surface adhesion ① Higher degree of freedom in sealing structure designO-rings are standard components and can only be used for simple structures. CIPG glue can be dispensed in any shape, and engineers can customize the best sealing solution according to the product structure, supporting complex designs such as irregular sealing structures, multi-layer sealing paths, and hollow sealing structures. ② Automated assembly has higher efficiencyTraditional assembly requires: installation of O-rings → lubrication → positioning → anti…

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Module semiconductor cooling solution | TCMP 3380 thermal conductive gel 8.4W/M · K high thermal conductivity

2026-03-12

With the rapid development of high-speed electronic products such as 5G communication, data centers, and optical modules, device power consumption and heat generation have sharply increased, and thermal management has become a key factor restricting product performance. Elion ELAPLUS launched TCMP 3380 high-performance heatable gel, which is specially designed for precision electronic devices such as optical modules and semiconductors, to help engineers easily solve the problem of heat dissipation in narrow spaces. ELAPLUS TCMP 3380One component heat curable silicone thermal conductive gel | Heavy engineering type Thermal conductivity, 8.4 W/m·KMinimum thickness, 250 μmTemperature resistance range, -40℃~+200℃Heavy Industry,Peel off without residueEight core advantages🔥Rapid heat conduction8.4W/m · K high thermal conductivity, fast heat conduction, effectively reducing device temperature🛡️Relieve stressAfter curing, an elastic gasket is formed to eliminate thermal stress and protect precision components🔊vibration and noise reductionElastic material properties effectively absorb vibrations and enhance product reliability💧Moisture resistant and weather resistantCan resist moisture and other harsh environments, without cracking or sagging💪High tensile strengthHigh tensile strength, good toughness, not easy to tear, convenient for construction and rework📏Ultra thin and compressibleCan be lowered to a thickness of 250um, perfectly filling narrow gaps and reducing thermal resistance🔄Heavy IndustryRework and peel off without residue, convenient for maintenance and replacement, reducing production costs🎯Flexible constructionVarious thicknesses and shapes can be formed through dispensing or screen printingProduct Details Thermal conductive gel Thermal conductive gel Typical application areasOptical module: 400G/800G QSFP-DD, OSFP optical module, DSP chip, TOSA/ROSA component heat dissipationSemiconductors: IGBT modules, power devices, integrated circuit heat dissipation5G Communication: Thermal Management of 5G Base Station Optical Modules and Front/Middle Transmission EquipmentData center: Heat dissipation of switches, routers, optical portsAutomotive Electronics: Vehicle mounted optical module, LiDAR, motor controllerIndustrial control: frequency converter, servo drive, PLC controllerWhy choose ELAPLUS?Core advantages of ELAPLUSProfessional R&D: ELAPLUS has a team of senior material engineers, focusing on innovative research…

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