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Industry Application

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What Adhesive for Temporary Masking Prior to PCB Plating? Removable Protection Solution with UV 1036

2026-11-12

For temporary masking of selected local pads, metallic contact areas or other designated surfaces prior to plating, pickling and surface finishing of PCBs, ELAPLUS UV 1036 peelable UV-curable acrylic adhesive may be evaluated. Key validation shall cover coating resistance to process media, edge protection integrity, curing state and peel residue after treatment. In precision electronics manufacturing, temporary masking materials serve to shield regions excluded from processing and shall be removed as required upon process completion; they are not intended for long‑term structural bonding or permanent insulation. Plating, pickling, sandblasting, spraying and other surface treatment steps in electronic manufacturing often demand selective protection of partial areas. Conventional options include masking tapes, films, fixtures and other dedicated protective materials, yet conforming around intricate geometries and irregular components can prove challenging. Peelable UV adhesives form temporary protective layers via dispensed deposition and cure under specified ultraviolet irradiation. They offer a candidate process for small, irregularly shaped zones or applications requiring automated dispensing. 1. Why Peelability Alone Is Insufficient for Temporary Masking A qualified temporary masking solution must satisfy requirements across three phases: protection, processing and removal. Loss of coating integrity during surface treatment may lead to unintended etching or deposition on protected regions. Insufficient adhesion of the cured coating may trigger premature delamination under liquid flushing or mechanical handling. Conversely, overly strong bonding or locally thin coatings can cause tearing, residue or substrate damage during final peeling. Accordingly, material selection for temporary masking cannot rely merely on initial tack or cure speed. Process chemistry, coating geometry and peeling method must all be incorporated into the design. 2. Key Requirements for Different Surface Treatment Processes Process Scenario Primary Risks Core Masking Requirements Validation Focus Selective Plating Penetration of plating solution, edge deposition Continuous edge profile, chemical compatibility Mask boundary and peel performance Pickling Attack…

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Potting Adhesives for Stator Coils of AC Cooling Fans: SIPA 1850 (30#) Selection Solution

2026-11-12

When insulation protection, winding retention, vibration resistance and thermal cycling tolerance are required for stator coils of AC fans, ELAPLUS SIPA 1850 (30#) silicone potting compound may be prioritised for evaluation. Key verification shall cover coil filling range, post-cure mechanical restraint, operating temperature rise and electrical performance of the fan. For industrial cooling fans, equipment ventilation blowers and continuously running AC motors, potting materials shall be matched to the stator structure and heat dissipation path; full filling of the entire motor cavity is not recommended as a default practice. An AC fan generally consists of a stator core, windings, rotor, bearings, housing and associated electrical connections. During operation, stator coils are subjected to electrical stress, temperature fluctuation and mechanical vibration. Proper potting protection helps improve insulation and fixation within designated zones. Nevertheless, potting modifies the mechanical and thermal boundaries surrounding the windings. For fans of different power ratings, rotational speeds and thermal designs, the potting scope, adhesive bead height and curing process shall be separately confirmed to avoid interference with rotor movement, bearings and original cooling arrangements. 1. Why Stator Coils of AC Fans Require Potting Protection AC fans deployed in industrial equipment, power cabinets, control systems and ventilation units often run for extended periods. Long-term exposure to electromagnetic excitation, temperature swings and equipment vibration affects insulation integrity and mechanical retention of windings, which in turn determines motor reliability. For stator assemblies adopting partial potting design, the compound forms an insulating layer within applicable areas and provides mechanical restraint for selected winding ends and connection points. Potting, however, cannot replace the original enameled wire insulation, varnish impregnation process or motor safety design for windings. Stator architectures vary widely among AC fans: some feature open heat dissipation, while others use partially encapsulated or fully enclosed motor structures. It is therefore essential…

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Adhesives for PCB of PV Rapid Shutdown Devices: Zoned Protection Solution with COATING 9062 and SIPA 3015

2026-11-12

For moisture-proof and insulation protection of the control PCB in module-level PV rapid shutdown devices, ELAPLUS COATING 9062 silicone conformal coating may be prioritised for evaluation. For enclosed fixed electronic cavities requiring deep filling, SIPA 3015 A/B two-part silicone potting compound can be further compared. These two materials are intended for thin-film circuit protection and designated cavity potting respectively. They are not direct substitutes for one another and must not impair the switching action, insulation structure or safety shutdown function of rapid shutdown devices. PV rapid shutdown devices are generally mounted near PV modules to achieve rapid disconnection of specified DC circuits in compliance with system control requirements. Internally they may house control PCBs, power switches, detection circuits, communication units and connection terminals; circuit architectures and shutdown mechanisms vary among product designs. Compared with indoor electronic control boards, module-level rapid shutdown devices are subject to wide ambient temperature swings, long-term outdoor operation and field maintenance constraints. Therefore, adhesive selection shall begin with clarification of electrical functions, component placement and structural boundaries before a conformal coating or local potting scheme is finalised. 1. Why PCB Protection Is Required for PV Rapid Shutdown Devices Module-level rapid shutdown devices reside for extended periods on or near the rear side of PV modules. Their operating environment exposes them to moisture, dust, thermal cycling and other contaminants. Contamination or insulation degradation on electronic traces may compromise control signals, sensing circuits and other electronic functions. A rapid shutdown device is far more than an ordinary low-voltage control module. Its DC side may sustain high voltages, while power components and connection terminals must satisfy relevant requirements for electrical clearance, insulation and temperature rise. Accordingly, PCB protective materials form only one component of a complete electrical and environmental reliability design. Even with excellent insulating properties, a coating cannot…

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Zero Point Failure to Return After Load Removal of Load Cells? Check Strain Gauge Adhesive Layer and Elastic Body Creep First

2026-11-12

When a load cell fails to restore its zero point after unloading, priority should be given to checking residual deformation of the elastic body, strain transmission through the strain gauge bonding layer, mechanical restraint imposed by protective adhesive, and temperature compensation, rather than directly concluding that the internal circuitry of the sensor is damaged. For industrial weighing modules, automated metering equipment and high-precision force measurement systems, ELAPLUS SIPC 2121 silicone sealant may be considered for strain gauge protection, provided that the protective layer does not alter the stress state of sensitive zones. Face Adhesive for Load Cells A resistive strain gauge load cell generally consists of a metallic elastic body, strain gauges, bonding adhesive layers, a Wheatstone bridge, lead wires and external protective structures. When an external force acts on the elastic body, the strain gauges deform accordingly and output corresponding electrical signals via resistance variation. Ideally, once the load is removed, the elastic body and strain gauges shall return to a state close to their initial condition as designed. In practical measurement, however, material creep, viscoelasticity of the bonding layer, temperature fluctuation and mechanical mounting conditions may all impair zero-point recovery performance. 1. Why Residual Zero Point Occurs After Load Cell Unloading Abnormal zero-point recovery refers to the failure of the output signal to revert to the permitted initial range within the specified time and under defined conditions after loading and subsequent unloading. This phenomenon must be distinguished from creep under sustained load, hysteresis generated by different loading directions and long-term zero drift. Metallic elastic bodies may exhibit time-dependent deformation under load. If the load is heavy, sustained for an extended period, or the elastic body is subjected to mechanical stress beyond its design limit, recovery may be delayed after unloading; in severe cases, irreversible deformation may arise. The…

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Excessive Unbalance after Motor Magnet Bonding? Check Adhesive Distribution and Runout First

2026-11-02

When excessive unbalance, rising vibration or abnormal noise occurs on motor rotors after magnet bonding, priority shall be given to checking magnet mass distribution, bond-line thickness, circumferential squeeze-out, rotor concentricity and cured assembly position, instead of immediately concluding insufficient structural bond strength. For robot joint motors, industrial servo motors and high-speed brushless motors, magnet bonding must deliver structural reliability while preventing mass distribution changes caused by inconsistent adhesive dosage and assembly deviation. Permanent magnet motor rotors generally consist of rotor core, magnets, shaft and required retention features. Once magnets are installed with adhesives or hybrid fastening methods, bond-line thickness and magnet placement affect rotor geometry, and local adhesive variation alters rotating mass distribution. Therefore, acceptable bonding and acceptable dynamic balance are two separate engineering judgements. Bond strength tests evaluate joint reliability, but cannot replace rotor runout, mass distribution and dynamic balance tests. 1. Why Does Unbalance Occur after Magnet Bonding? Under high-speed rotation, uneven mass distribution generates periodic centrifugal excitation. Deviations in magnet installation position, bond-line thickness or rotor geometry may shift the centre of mass away from the rotational axis and worsen vibration. During magnet assembly, inconsistent adhesive volume under individual magnets or excess adhesive squeezed and accumulated at a certain circumferential position changes cured mass distribution. For precision motors with small rotor diameter and high rated speed, even minor local mass variation must be assessed against dynamic balance requirements. Unbalance is not necessarily caused by the adhesive itself. Magnet mass tolerance, shaft eccentricity, core dimensional deviation, fixture error and bearing condition all affect test results. Phased inspection is required to locate the root cause. 2. How to Distinguish Issues from Adhesive Volume, Magnet Assembly and Rotor Geometry? It is recommended to record the baseline geometry of the rotor core before magnet mounting, inspect position and clearance after magnet…

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Adhesive for Resolver Terminals? SIPC 1822 Silicone Protection Solution

2026-11-02

ELAPLUS SIPC 1822 one-component silicone adhesive sealant can be used for partial encapsulation protection of resolver terminals and lead connection zones. It is formulated to meet requirements for electrical insulation, moisture-proof sealing, lead retention and mechanical stress buffering. For resolvers used in servo motors, robot joint motors and new energy vehicle motors, the dispensing range, bond thickness and curing conditions shall be properly controlled to prevent adhesive creep into the air gap between stator and rotor or interference with precision assembly. A resolver is a critical component of motor position feedback systems, generally consisting of stator, rotor, windings, insulation bobbin and terminal connections. Stator winding leads are electrically joined to external circuits by soldering or other methods. The terminal region must maintain stable electrical performance under motor vibration, temperature cycling and long-duration operation. For resolver terminals confined in tight spaces, the adhesive shall protect joints while avoiding excessive local stiffness. Partial fixation and encapsulation with flexible silicone is a viable candidate protection approach. 1. Why Do Resolver Terminals Require Dispensed Adhesive Protection? Resolver terminals are usually connected to fine winding leads. Some assemblies also include metal solder tabs, plastic bobbins and harness junctions. During continuous motor operation, mechanical vibration and harness pull loads transfer to the root of terminals, subjecting solder joints to cyclic stress. In addition, ambient moisture and contaminants may compromise insulation around metal terminals and long-term joint stability. For eligible connection structures, silicone forms a local protective layer that reduces direct exposure of joints to environmental factors. Adhesive dispensing cannot replace qualified soldering or mechanical terminal retention. Improper lead routing, defective solder joints or inadequate mechanical fixation cannot be fundamentally resolved simply by applying more adhesive. 2. How to Diagnose Common Defects after Dispensing on Resolver Terminals Common failures include loose lead roots, incomplete terminal coverage, edge…

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Adhesive for Mounting Glass to Stainless Steel? EP 2025 Epoxy Bonding Solution

2026-11-02

ELAPLUS EP 2025 epoxy adhesive can be evaluated for bonding glass to stainless steel. Key control items include the thermal expansion mismatch between glass and metal, bond line thickness, bond area and residual stress generated during curing. For instrument viewing windows, equipment glass panels, sensor protective covers and metal frame assemblies, the adhesive must not only form stable interfacial bonds but also prevent local stress concentration that leads to glass cracking, edge delamination or seal failure. Glass is rigid yet sensitive to local tensile stress and edge defects. Stainless steel delivers good mechanical strength and machinability, but its thermal expansion behaviour differs from glass. Once joined by an adhesive layer, temperature fluctuation, assembly tolerance and external loads may translate into shear stress and peel stress at the bond interface. Therefore, bonding glass to stainless steel cannot be judged merely by initial bond strength. Comprehensive evaluation must consider structural design, material properties and long-term service conditions. 1. Why Do Glass-to-Stainless Steel Bonds Fail Easily? In industrial equipment, glass and stainless steel are commonly assembled via face bonding, perimeter frame bonding or inset mounting. Due to differing coefficients of thermal expansion, the two substrates expand and contract unequally when subjected to heating, cooling or thermal cycling. For ordinary soda-lime glass and common austenitic stainless steel, stainless steel generally has a higher linear expansion coefficient. Under temperature variation, an overly thin bond line, excessively large bonded area or rigid structural restraint may subject the interface to high shear and peel loads. The exact discrepancy depends on glass type, stainless steel grade and operating temperature range. In addition, tiny nicks on glass edges, oil contamination on stainless steel, uneven bond-line thickness and over-clamping during assembly can all trigger premature failure. Some joints appear strong at room temperature but delaminate after thermal cycling or prolonged…

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Waterproof Potting Compound for Industrial Foot Switches? Selection of SIPC 1835 A/B Silicone

2026-11-02

ELAPLUS SIPC 1835 A/B two-component silicone potting compound is recommended for evaluation when internal electronic zones of industrial foot switches require waterproofing, moisture proofing and electrical insulation protection. It features elastic properties after cure, low shrinkage and protection for electronic devices, making it a candidate material for permitted potting zones inside foot switches. For assemblies with mechanical contacts, return springs and movable pedals, the stationary electronic cavity must be separated from moving mechanisms. The entire switch shall not be fully filled with adhesive. Industrial foot switches are widely used in automation equipment, machining machinery, test jigs and industrial control systems. Operators control equipment start-stop, signal input and other functions via foot actuation, so the switch must maintain stable electrical connections and mechanical performance under repeated cycling. Some foot switches use mechanical microswitches, while others adopt magnetic sensing, Hall effect or other non-contact detection structures. Adhesive application positions differ significantly between designs, and waterproof potting solutions are not universally interchangeable. 1. Why Do Industrial Foot Switches Require Potting Protection? Foot switches are generally mounted under machinery or near workstations, where they may be exposed to dust, water droplets, cleaning fluids and mechanical vibration. For units with internal PCBs, sensors or electronic signal processing modules, properly designed potting provides insulation and environmental protection for designated electronic areas. Nevertheless, waterproofing of foot switches does not rely entirely on internal potting. Pedal shafts, housing seams, cable outlets and other moving interfaces can also serve as ingress paths. Potting only the PCB while neglecting sealing at the housing and cable entry points will still allow moisture to penetrate other areas. Conversely, overfilling adhesive into moving mechanical zones to achieve full coverage may impair pedal return and contact operation. Therefore, material selection for industrial foot switches must treat electronic protection, housing sealing and mechanical movement separately….

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Adhesive for Bonding TPU to TPU? ELAPLUS PUR 1602 Solution for Flexible Material Bonding

2026-11-02

ELAPLUS PUR 1602 adhesive can be evaluated for TPU-to-TPU bonding. Key verification items include flexibility matching between the bond line and TPU substrates, interfacial adhesion, and joint stability after repeated flexing. For flexible sleeves, elastic structural parts and industrial protective components, the adhesive shall not only form a reliable bond but also avoid overly rigid local bond lines that restrict product deformation. TPU is a thermoplastic polyurethane elastomer with good abrasion resistance and elasticity, widely used for cable jackets, industrial protectors and flexible structures. Different TPU grades vary in hardness, surface condition and processing method, so the performance of the same adhesive may differ across materials. 1. Why Flexibility Matters for TPU-to-TPU Bonding For TPU assemblies subject to repeated bending or stretching, mismatch in deformability between the bond line and substrate can concentrate stress at the bond edge and shorten joint service life. For TPU parts only for static positioning, selection focuses mainly on adhesion strength and dimensional stability. For dynamic flexible structures, reliability under repeated flexing, peeling and long-term deformation shall be further evaluated. 2. Material Selection with PUR 1602 for TPU Bonding ELAPLUS PUR 1602 is a candidate grade for TPU-to-TPU joints. Suitability shall be verified against material grade, cured adhesive properties and actual service conditions. Application Requirement Selection Focus Recommended Validation TPU flexible sleeve Bond line flexibility and adhesion Flex test and peel test TPU industrial protector Bond area and structural strength Tensile test and environmental ageing TPU sealing structure Continuity of the adhesive layer Seal test and deformation test TPU positioning component Dimensional stability and assembly accuracy Dimension check before and after cure 3. Process Control for TPU Bonding Before bonding, confirm that TPU surfaces are free of obvious grease, dust and processing residues. For different TPU grades or specially surface-treated TPU, compatibility tests shall be…

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