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Industry Application

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How to Select Thermal Interface Materials for MOSFETs in Robot Drives? Start With Gap Size, Then Thermal Conductivity

2026-08-31

Thermal‑Management Materials for MOSFETs in Robot Joint Drives: confirm the actual gap between components and heat sink, permissible compression, component pressure‑bearing capacity and dispensing process prior to selecting thermal gels, thermal greases or thermal pads. For robot drive boards with height tolerances and irregular interfaces, TCMP‑series thermal gels are highly recommended. TCMP 3380 is designed for gap filling and thermal management of electronic components. Thermal Interface Materials for Drive MOSFETs Why Do MOSFET Hot‑Spots Frequently Occur in Robot Joints? The smaller the joint volume, the closer the drive is to the motor. Heat generated by MOSFETs must travel a very short path: MOSFET → TIM → heat sink / joint metal housing. Air trapped within the TIM layer will cause rapid local temperature rise. What Is the Value of Thermal Gel? It does not dissipate heat by itself. It replaces air gaps with thermally conductive material. Especially when MOSFETs have inconsistent heights, thermal gel accommodates assembly tolerances effectively. Why Thermal Conductivity Values such as 6 W or 8 W Are Not Everything? Actual interfacial thermal resistance is affected by: ‑ bond‑line thickness ‑ contact area ‑ compression ‑ interfacial voids ‑ long‑term stability A material with high thermal conductivity applied in a thick bond‑line may underperform a moderately conductive material with a thinner BLT. Industry Pitfalls | Top 3 Common Mistakes in Thermal‑Material Procurement Suitable Application Scenarios for TCMP Series TCMP thermal gels are preferred where: ‑ height variation exists among MOSFET devices ‑ gap ranges from tenths of a millimeter to several millimeters ‑ automatic dispensing is required ‑ fixed‑thickness pads are not feasible ‑ low‑stress gap filling is demanded If mating surfaces fit tightly with very thin BLT, re‑evaluate alternatives such as thermal grease. FAQ on Thermal Gels for Robot MOSFETs Can thermal gel hold the heat sink in place?…

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What Adhesives Are Required for Humanoid Robot Joint Motors? A Complete Guide from Stators and Magnets to Sensors

2026-08-27

There is no single‑fits‑all adhesive for humanoid robot joint motors. Potting compounds, structural adhesives, thermal interface materials, silicone gels, conformal coatings and sealants shall be selected respectively for stator windings, rotor magnets, power MOSFETs, torque sensors, control PCBs and wire harness exits. For highly‑integrated robot joints, the effective material selection approach is not to search for one universal grade. Instead, break down thermal, mechanical, electrical and environmental requirements for each position, then match suitable materials accordingly. Framed torque motors feature compact construction and high torque density. Hence heat generation, vibration, mechanical stress and space constraints are concentrated inside a tiny joint cavity. Stator windings require thermally‑conductive potting; magnets demand long‑term structural fixation; driving MOSFETs need low‑thermal‑resistance heat transfer paths; meanwhile sensors must not be rigidly locked by high‑modulus materials. This is the key characteristic of adhesives for robot joints: Within one single joint, some areas require firm fixation, while others call for soft‑type protection. Six Typical Adhesive Application Points for Robot Joints Recommended candidate: ELAPLUS EP 1715 (2#) Two‑Component High‑Thermal‑Conductivity Epoxy Potting Compound Potting for robot joint motors It is a two‑part thermally‑conductive epoxy potting material. Available data shows its thermal conductivity is around 1.5 W/m·K, Tg ranges from 95‑105 ℃, and CTE below Tg is approximately 25 μm/m·℃. It supports room‑temperature or medium‑low‑temperature curing. Recommended candidate: EP 1769 Two‑Component Epoxy Potting Compound Motor magnet bonding adhesive Serving as structural adhesive for robot joint motor magnet bonding, it focuses on high bonding strength, fatigue resistance and anti‑vibration performance, rather than merely comparing initial room‑temperature shear strength. Heat Conduction of Driver MOS For instance, TCMP 3380 is designed for gap filling and thermal management of electronic components. The exact grade shall be determined according to actual gap dimension and compression requirement. Solutions such as FSGEL 3200 fluorosilicone gel can be evaluated for flexible protection…

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How to Select Insulating Adhesives for 800V High‑Voltage Systems? Adhesive Guide for Three‑Phase Copper Busbars, Terminals and High‑Voltage Accessories

2026-08-27

Adhesives for 800V new‑energy‑vehicle high‑voltage systems shall focus on high‑voltage insulation, heat resistance, oil resistance, thermal‑cycling stress, terminal sealing and vibration resistance. For three‑phase copper busbars in oil‑cooled 3‑in‑1 electric drives, ELAPLUS EP 1721‑1 flexible epoxy potting compound is a key candidate. For structures requiring high Tg and low CTE, epoxy systems with high dimensional stability can be further evaluated. Three‑phase copper busbar sealing Three‑Phase Copper Busbar Sealing Why Adhesive Selection for Copper Busbars Becomes More Challenging Under 800V Systems Voltage upgrade is not the only variable. Other concurrent changes include: ■ Higher power output ■ Increased current density ■ 3‑in‑1 integrated design ■ Reduced available space ■ Adoption of oil‑cooled systems ■ Elevated operating temperature ■ Larger copper busbar dimensions Accordingly, adhesives for copper busbars need to deliver multiple functions simultaneously: insulation, fixation, sealing and stress buffering. Why Rigid Epoxies Are Not Always Suitable for All Copper Busbar Applications The thermal expansion coefficient of copper mismatches that of epoxy resins. Large‑size copper busbars generate greater absolute displacement upon temperature rise. High‑modulus materials that cannot accommodate such displacement may lead to stress concentration at: ■ Copper busbar root sections ■ Edges of potting layers ■ Terminal zones ■ Housing corners The failure sequence proceeds as follows: stress concentration → micro‑cracks → crack propagation → medium ingress → insulation risks. Therefore, flexibility has become an increasingly critical indicator for 800V copper busbar materials. Why EP 1721‑1 Is Suitable for Flexible Copper Busbar Potting ELAPLUS EP 1721‑1 is a flexible‑formula epoxy potting compound. Copper busbar sealing Primary application scenarios: ■ Three‑phase copper busbars ■ High‑voltage connectors ■ Oil‑cooled electric drives ■ Fixation at copper busbar roots ■ Protection around terminals Its core design concept: firmly secure copper busbars while reserving buffer allowance for thermal expansion and contraction. Why Oil Exposure Environment Must…

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Why Do Automotive Inductor Potting Compounds Crack? How to Select Thermal Conductivity, Hardness and CTE?

2026-08-27

Cracking of automotive inductor potting compounds seldom stems from one single cause. It arises from combined effects of material hardness, coefficient of thermal expansion (CTE), potting thickness, cure shrinkage, heat generation from coils and repeated thermal cycling. For inductors requiring low‑stress thermal conduction, ELAPLUS SIPA 1850‑series thermally‑conductive silicones are prime candidates. For magnetic components demanding enhanced structural support, suitable epoxy systems shall be further evaluated. Inductor potting Why Are Inductors Prone to Potting Cracks? An inductor assembly comprises copper windings, magnetic cores, bobbins, PCBs, metal housings and potting resin. All these components feature mismatched CTE values. During operation, copper windings generate heat; each material expands to varying degrees upon heating and contracts while cooling. This creates cyclic deformation: expansion → contraction → expansion → contraction. When a high‑hardness potting material is applied, mechanical stress tends to concentrate at: ‑ Magnetic core edges ‑ Housing corner sections ‑ Coating‑to‑coil interfaces ‑ Thick resin cross‑sections Cracks may eventually initiate at these stress‑concentration zones. Why Thermal Conductivity Should Not Be the Sole Selection Metric for Inductor Potting Compounds High thermal conductivity is achieved by loading substantial thermally‑conductive fillers. Increased filler content generally exerts side‑effects on: ‑ Viscosity ‑ Density ‑ Flow property ‑ Post‑cure mechanical performance Even when thermal conductivity is raised from 1.5 W/m·K up to 3 W/m·K or higher, it is critical to verify whether the resin can fully penetrate fine coil gaps. Trapped voids inside windings will render high intrinsic thermal conductivity ineffective. Why SIPA 1850 Is Suitable for Low‑Stress Inductor Potting OBC inductor potting SIPA 1850 is a thermally‑conductive silicone potting system. It serves applications including: OBC inductors 、Motor control units 、Power supply modules 、Energy‑storage inductors 、High‑power magnetic components Multiple thermal‑conductivity grades are available for different thermal‑design targets. Cured silicone retains elastomeric properties, making it well‑suited for magnetic components exposed to severe thermal cycling….

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How to Select Potting Compounds for New‑Energy‑Vehicle ECUs? How to Balance Waterproofing, Vibration Resistance and Thermal Conductivity?

2026-08-27

Material selection for new‑energy‑vehicle ECUs shall first determine whether full potting, partial potting, thermal gap filling or conformal coating is required based on ECU mechanical construction. For controllers requiring low‑stress full‑module protection, Elaplus SIPA 1850 thermally‑conductive silicone potting system may be evaluated. PUR‑series formulations are an option for structures demanding flexible protection. For gap‑type heat dissipation between ECU power devices and housings, TCMP 1935 thermal conductive gels can be deployed. ECU Potting for Automotive Electronics Why “Fully‑filled Potting” Does Not Equal Reliable ECU Protection An ECU typically integrates multiple components: ‑ MCU chips ‑ MOS power devices ‑ PCBs ‑ Capacitors ‑ Electrical connectors ‑ Copper busbars ‑ Aluminum housings Different zones face distinct failure risks. For instance, PCBs mainly require moisture‑proofing and vibration resistance; MOSFETs call for effective heat dissipation; connector root sections need waterproof protection; housings rely on reliable sealing. Accordingly, a single ECU may adopt a combined material solution: potting compounds + thermal conductive gels + sealants + conformal coatings, rather than depending on one single adhesive to cover all requirements. Why Low‑stress Formulations Are Preferred for Full ECU Potting Numerous solder joints are populated on PCBs. When high‑hardness resin is applied for large‑volume encapsulation, stress generated by cure shrinkage and thermal cycling can transfer onto: ‑ BGA packages ‑ Solder joints ‑ Capacitors ‑ Semiconductor chips ‑ Connector root terminals Low‑stress performance therefore becomes a critical selection criterion for assemblies populated with stress‑sensitive electronics. Elaplus SIPA 1850 Two‑Component Thermally‑Conductive Silicone Potting Compound Recommended for applications where both thermal performance and low‑stress encapsulation are required. Thermal‑dissipation Solutions for ECU Power Devices If heat bottlenecks occur exclusively at the interface between MOSFETs and metal housings, massive full‑volume potting is unnecessary to resolve a localized thermal issue. Instead, TCMP 1935 two‑component liquid thermal conductive gel fills gaps between power components and heat‑dissipation…

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How to Select Thermal Interface Adhesives for IGBT and SiC Power Modules? Why High Thermal Conductivity Does Not Equal Low Thermal Resistance?

2026-08-27

The core performance metric for thermal‑interface materials of IGBT and SiC power modules is not standalone thermal‑conductivity value, but the actual interfacial thermal resistance. Real‑world heat‑dissipation performance is governed by thermal conductivity, bond‑line thickness (BLT), contact area, compression ratio, interfacial wet‑out property and long‑term pump‑out stability. For new‑energy‑vehicle inverters, MCUs and high‑power power supplies, Elaplus TIM grades such as TCMP 1935 and TCMP 3380 may be evaluated. Why SiC Devices Place Higher Demands on Thermal‑interface Materials One major advantage of SiC semiconductors lies in higher switching frequency and elevated power density. Meanwhile, system hardware becomes more compact. This leads to the following chain effect: Same footprint → higher power load → increased heat‑flux density per unit area → thermal interface performance becomes more critical. Poor TIM interface control will trigger rapid chip‑junction‑temperature rise. What Is Interfacial Thermal Resistance? Heat flows from semiconductor chips toward heat sinks via intermediate thermal‑interface materials. Thermal resistance is not determined solely by material thermal conductivity. Simple illustration: ‑ Material A: 8 W/m·K, bond‑line thickness 1.5 mm ‑ Material B: 5 W/m·K, bond‑line thickness 0.3 mm We cannot judge which one delivers lower thermal resistance merely by comparing 8 vs 5. Thicker bond‑line means longer heat‑transfer path. Well‑designed TIM selection must consider thermal conductivity together with bond‑line thickness (BLT). Why Thermal Conductive Gels Are Suitable for IGBT & SiC Power Modules Mismatches frequently occur between power modules and housing assemblies, including: ‑ Manufacturing tolerances ‑ PCB warpage ‑ Component height offset ‑ Heat‑sink flatness deviation Thermal conductive gels deform mechanically to fill these micro‑gaps. Elaplus TCMP 1935 Two‑Component Liquid Gap Filler It builds stable thermal interfaces for IGBT, SiC, MCU, ECU and general power‑electronic modules. Why Reworkability Gains Growing Importance During prototype development of new‑energy‑vehicle electronic assemblies, engineers repeatedly perform: Disassembly → failure analysis → re‑assembly → re‑validation testing. Non‑reworkable TIMs significantly raise…

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What Thermal Materials for Automotive Motor Controller (MCU)? How to Select Between Thermal Conductive Gel, Thermal Grease and Thermal Pads

2026-08-25

Thermal‑management materials for new‑energy‑vehicle Motor Control Units (MCU) shall be selected according to component‑to‑housing gap, compression rate, assembly tolerance, rework requirements and power density. For MOSFET, IGBT, SiC and other power devices within controllers, Elaplus TCMP‑series thermal interface materials such as TCMP 1935 and TCMP 3380 can be evaluated. Where assembly gaps feature considerable tolerances, thermal conductive gels generally outperform traditional thermal greases for filling large and irregular interfaces. Why MCUs Are Increasingly Dependent on Thermal Interface Materials Motor control units constitute a core segment of the three‑electric system for new‑energy vehicles. Driven by: ‑ Higher operating voltage ‑ Expanding adoption of SiC power devices ‑ Rising power density ‑ Miniaturized controller footprint Heat output per unit area keeps climbing. Heat must rapidly transfer along the path:semiconductor chip / power device → thermal interface material → cooling plate / metal housing. Trapped air gaps at interfaces will trigger substantial temperature rise. Why Thermal Conductive Gels Are Well‑Suited for MCU Applications One major advantage of thermal conductive gel is its tolerance for assembly tolerances. Perfect zero‑gap contact between power components and housing cannot be achieved in real‑world hardware. Gaps may measure 0.5 mm, 0.8 mm, 1.2 mm, or even vary across different locations. Thermal conductive gels deform under compression to fill uneven gaps. Elaplus TCMP 1935 Typical applications: ‑ ECU ‑ MCU ‑ IGBT modules ‑ SiC power devices ‑ Power electronic modules ‑ LED drivers ‑ Other high ‑heat ‑generating electronic assemblies Primarily designed for interface gap‑filling between power components and heat‑dissipation housings. Application Scenarios for TCMP 3380 TCMP 3380 is a thermal interface material optimized for thin bond‑lines, high‑compression contact and reworkability. Evaluate this grade when gaps are relatively narrow and the design targets: ‑ Low thermal resistance ‑ Intimate interfacial contact ‑Re‑assembly capability ‑ Mitigation of rigid mechanical stress on components Differences Between Thermal Conductive Gel,…

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How to Select Potting Compounds for DC-DC Converters? Balancing High-Voltage Insulation, Thermal Conductivity and Low-Stress Performance

2026-08-25

Potting compounds for DC‑DC converters shall mainly address high‑voltage insulation, heat dissipation of power components, PCB moisture resistance, vibration protection and thermal‑cycling stress. For new‑energy vehicle DC‑DC modules, Elaplus SIPA 1850 thermally conductive silicone, PUR 1680 thermally conductive polyurethane and EP 1710 epoxy potting compound can be evaluated according to respective structures. If heat‑dissipation filling between components and housing is required instead of full potting, TCMP‑series thermal conductive gels can be further adopted to build low‑thermal‑resistance interfaces. Why Are DC‑DC Converters Prone to Thermal‑management Challenges? DC‑DC modules perform power conversion between different voltage levels. Thermal Conductivity for Automotive DC‑DC Converters Heat is generated by MOSFETs, SiC devices, transformers, inductors and other components during operation. Meanwhile, DC‑DC converters are generally installed within highly confined spaces. Actual working conditions therefore feature high voltage, elevated temperature, vibration, high power density and compact footprint. These impose far higher requirements on adhesive materials compared with general consumer‑electronics applications. Why Is Low‑stress Performance Critical for Full DC‑DC Module Potting? A typical module consists of multiple materials: PCB, power devices, copper busbars, ceramics and aluminum housings. These materials exhibit different thermal expansion upon temperature rise.If the whole module is fully constrained by high‑modulus rigid materials, displacement induced by thermal cycling may eventually lead to: For large‑area DC‑DC potting, the SIPA 1850 thermally conductive silicone potting system is recommended for priority evaluation. Core selection criteria: thermal conductivity, elasticity, insulation property and thermal‑cycle buffering capacity. When to Choose PUR 1680? For applications requiring enhanced mechanical support compared with silicones, yet avoiding the extreme hardness of certain rigid epoxies, PUR 1680 is worth consideration. It is well suited to balance the following performance requirements: Why Epoxies Are Still Required for High‑temperature & High‑voltage Modules? Certain DC‑DC structures place high priority on: Under such circumstances, epoxy systems such as EP 1710…

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How to Select Potting Compounds for OBC? Thermally Conductive Potting Solutions for On‑Board Charger Inductors, PCBs and Power Modules

2026-08-21

Thermal conductivity is far from the sole criterion for selecting potting materials for new‑energy‑vehicle OBC systems. Inside an on‑board charger coexist power devices, inductors, transformers, PCBs and high‑voltage connection zones. Different locations impose divergent requirements for thermal conduction, electrical insulation, flame retardancy, stress performance and flowability. For OBC modules requiring low‑stress full potting, ELAPLUS SIPA 1850 series thermally‑conductive silicone potting compounds are recommended for evaluation. For constructions calling for a balance of flexibility and thermal performance, PUR 1680 thermally‑conductive polyurethane potting compound can be considered. For assemblies demanding high‑temperature performance and superior dimensional stability, EP 1710 epoxy potting system may be assessed according to design specifications. These represent the core principles for OBC electronic adhesive selection:First define heat sources and heat dissipation paths to determine the required thermal conductivity; identify stress‑sensitive components and structural constraints to specify the target hardness of the potting material. Why Do OBC Units Require Potting Compounds? An On‑Board Charger (OBC) converts alternating current into direct current for vehicle traction battery packs.As new‑energy‑vehicle high‑voltage platforms evolve and power density rises, OBC internal housings become increasingly compact, leading to concentrated heat buildup across power devices, inductors and high‑voltage circuits. Typical field challenges include:‑ Heat generation from inductors and transformers‑ PCBs enduring repeated thermal cycling‑ Vehicle‑borne vibration transmitted directly to solder joints‑ Moisture ingress risks within high‑voltage regions‑ Build‑up of internal stress in large‑volume potting sections‑ Interfacial thermal resistance between power components and metal housings OBC potting is therefore not a simple process of pouring resin into an enclosure.Its core objectives are multi‑fold: thermal dissipation, electrical insulation, vibration resistance, moisture protection and thermal‑stress buffering. Recommended Potting Compounds for Full‑Volume Thermally‑Conductive OBC Potting ELAPLUS SIPA 1850 Potting for Inductors For OBC assemblies needing low‑stress protection, the two‑component thermally‑conductive silicone potting compound SIPA 1850 series is a prime candidate.Upon cure, this silicone‑based material retains elastic…

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