Multiple single‑material solutions shall be avoided for adhesives used in new‑energy‑vehicle PTC heaters. Material selection shall be carried out respectively for housing sealing, power‑module heat dissipation and local connector potting. For PTC heater applications, Elaplus recommends SIPA 1865‑2K for housing sealing, TCMP 1960‑2K for power‑module heat dissipation, and SIPA 3015‑2K for connector‑section potting, delivering a combined solution of “sealing + thermal conduction + insulation protection”.
Adhesive Solution for PTC Heaters
Why Multiple Types of Adhesives Are Required for PTC Heaters
A new‑energy‑vehicle PTC heater integrates heating elements, power devices, control circuits, connectors and metal housings.
Different positions face distinct challenges:
- Housing joints focus on sealing performance
- Power modules prioritize heat dissipation
- Connectors and electrical connection areas require insulation, moisture resistance and fixation
- The whole unit must withstand long‑term high‑temperature exposure and thermal cycling
Therefore, adopting one single high‑thermal‑conductivity adhesive or one single sealing adhesive for all positions hardly meets all functional requirements simultaneously.
Recommended Grade for PTC Housing Sealing
Elaplus SIPA 1865‑2K
Within Elaplus PTC application solutions, SIPA 1865‑2K is mainly applied for housing sealing.
Housing Sealing
Main functions:
- Sealing of PTC metal housings
- Waterproofing of joints
- Prevention of moisture ingress
- Sealing reliability under high‑low temperature variation
For PTC housing‑sealing materials, initial bonding strength is not the only indicator. Interface delamination and sealing failure after thermal cycling shall be verified as key evaluation items.
Recommended Grade for PTC Power‑Module Heat Dissipation
Elaplus TCMP 1960‑2K
Thermal Gel
TCMP 1960‑2K is designated for heat dissipation of PTC power modules.
Its core function is not rigidly bonding the power module in place, but filling the interface between power devices and heat‑dissipation structures to transfer heat efficiently to the metal housing.
Key selection criteria:
‑ Thermal conductivity
‑ Interface gap‑filling capability
‑ Material hardness
‑ Assembly tolerance
‑ Thermal‑cycling stability
For power devices in particular, excessively hard thermal‑interface materials that introduce high assembly stress onto components shall be avoided.
Recommended Grade for PTC Connector‑Section Potting
Elaplus SIPA 3015‑2K
SIPA 3015‑2K is used for potting of internal PTC connectors to provide local insulation, moisture resistance and fixation.
Suitable for protection of:
‑ Connector roots
‑ Peripheral terminals
‑ Local circuits
‑ Electrical connection points
PTC Heater Adhesive Selection Table
| Application Location | Elaplus Recommended Grade | Main Functions |
|---|---|---|
| Housing Joints | SIPA 1865‑2K | Sealing & waterproofing |
| Power Modules | TCMP 1960‑2K | Thermal conduction & interface gap filling |
| Connector Zones | SIPA 3015‑2K | Local potting & insulation protection |
FAQ for PTC Heater Adhesives
Can thermal potting compound be used for the entire PTC heater?
The “one‑adhesive‑for‑all” approach is not recommended. Sealing, thermal conduction and electrical‑protection requirements vary by location, and materials shall be matched accordingly.
Is higher thermal conductivity always better for PTC thermal‑interface materials?
Interface thickness, gap‑filling performance, device compressive stress and interface stability after thermal cycling shall also be taken into comprehensive consideration.
Elaplus Functional Materials (Shanghai) Co., Ltd.
Technical support & free sample request: +86‑21‑67227200
E‑mail: info@elaplus.cc
Website: www.elaplus.cc
Address: No.555 Jiugong Road, Jinshan Industrial Zone, Shanghai, China
