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Industry Application

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How can a high hardness polyurethane sealant be water-resistant, heat-resistant, and durable help electronic sensors achieve high reliability?

2025-06-25

In the trend of intelligent, lightweight, and modular electronic components, the reliability of encapsulation materials is becoming a key design consideration. Today, Yilian brings a star material that has been validated in multiple terminal scenarios – Elaplus PUR 1680 (D70) two-component polyurethane sealant, and shares a case study with the application scenarios of sensor products.Filled PU Potting 1、 Customer background and pain pointsA first tier international automotive parts supplier mainly produces electronic sensors for vehicles, including temperature sensors, position sensors, pressure sensors, etc. Its products need to work in complex working conditions for a long time, such as high temperature, high humidity, and strong vibration environments. The previously used foreign brand epoxy sealant had the following issues:After solidification, the colloid is brittle and prone to cracking during thermal shock;Poor control of bubbles during the sealing process resulted in high electrical breakdown rates for some batches of products;The high water absorption rate of the material leads to signal drift after long-term wet heat testing;The customer is looking for an alternative material that can balance “stable electrical performance, reliable sealing, waterproof and heat-resistant, non-toxic and environmentally friendly”.2、 Recommended material: Elaplus PUR 1680 (D70) high hardness polyurethane sealantThe recommended sealing solution for it is Elaplus PUR 1680 (D70) A/B two-component polyurethane adhesive. This material is designed specifically for mid to high end electronic packaging and has excellent comprehensive performance. It has been widely used in communication equipment, power modules, controllers, vehicle sensors, industrial control board encapsulation, and other fields. The core advantages include:High hardness and toughness: Shore D65 ± 5 hardness after curing, balancing structural protection and stress buffering;Excellent electrical insulation performance: volume resistivity up to 5 × 10 ¹⁴Ω· cm, dielectric strength up to 20kV/mm;Extremely low water absorption rate: 24-hour water absorption rate<0.2%, outstanding moisture resistance;Stable thermal performance: operating temperature range of…

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High performance epoxy potting adhesive EP 1700 A/B application case sharing | Ideal choice for high-temperature resistant electronic packaging

2025-06-25

In the context of rapid development of modern electronic products, electronic devices have put forward higher requirements for the performance of potting adhesives – not only to have excellent electrical insulation performance, but also to withstand long-term tests in harsh environments such as high temperature, vibration, and humidity. Today, Elaplus will share an application case of the EP 1700 A/B two-component epoxy potting adhesive launched by ELAPLUS, focusing on its outstanding performance in high-temperature electronic component potting, providing a one-stop reliable packaging solution for the electronic manufacturing industry.Project Background: Packaging Challenges of High Temperature Resistant Electronic ComponentsA certain industrial control equipment manufacturer has long faced a thorny problem: its main control circuit board needs to operate stably in a long-term high temperature (working environment temperature is maintained above 130 ℃) and complex electromagnetic interference environment. Traditional single component epoxy or silicone sealing materials frequently experience cracking, decreased adhesion, and even surface carbonization during high-temperature aging testing, seriously affecting product stability and after-sales maintenance costs.High temperature resistant epoxy sealantAfter multiple rounds of scheme screening, the customer ultimately chose the EP 1700 A/B two-component heat cured epoxy potting adhesive launched by ELAPLUS for verification and achieved successful application. Product selection: Why EP 1700 A/B?EP 1700 A/B is a two-component epoxy resin sealant designed specifically for high reliability electronic devices, with the following core advantages:Excellent high-temperature stability: The glass transition temperature (Tg) of the cured material can reach 150 ℃, making it suitable for high-temperature conditions.Excellent mechanical performance: hardness ≥ 80 Shore-D, shear strength ≥ 8MPa, able to withstand mechanical impact and vibration after sealing.Strong electrical insulation performance: volume resistivity up to 1.0 × 10 ¹⁵Ω· cm, dielectric strength>15KV/mm, ensuring the safety of high-voltage devices.All round protection: It has strong resistance to damp and heat, moisture, dust, oil, acid and alkali, and aging.Application…

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EP 1702 white epoxy potting adhesive, easily meets the waterproof and insulation challenges of electronic components!

2025-06-25

In modern electronic manufacturing, more and more terminal equipment put forward higher requirements of “multi performance integration” for potting adhesive: not only must it be waterproof and moisture-proof, reliable insulation, strong anti-aging ability, but also must achieve low shrinkage, bright surface, and bubble free packaging effect. Today, we will share a real case of ELAPLUS star product – EP 1702 white epoxy potting adhesive in customer applications, taking you to understand how it easily meets the challenges of electronic component potting! Project background: The customer’s pain points are highlighted, and traditional adhesives are difficult to handleA customer specializing in industrial electronic module packaging has been searching for a sealing adhesive that combines easy operation, excellent insulation, and moisture resistance stability for their small relays, power modules, controllers, and other products. Although the adhesive used previously had decent apparent performance, there were several issues:Slow curing at room temperature, affecting the production line rhythm;During the sealing process, there are many bubbles that are difficult to eliminate;After curing, the surface is not smooth enough and the appearance is not good;It is prone to aging and shedding in humid and hot environments.So, the customer decided to introduce ELAPLUS recommended EP 1702 two-component ambient temperature epoxy potting adhesive and conduct a one week potting and environmental testing. Solution: EP 1702 white epoxy sealantEP 1702 is a white two-component ambient temperature curing epoxy potting adhesive designed specifically for electronic devices, with the following core advantages:Low exothermic reaction, with a shrinkage rate of less than 2% during the curing processStrong operability, the operable time after mixing can reach 40 minutes to 2 hoursAfter curing, the surface is shiny and does not bubbleWide temperature resistance range (-40~120 ℃), stable electrical performanceThe customer selected the standard EP 1702 white potting adhesive for testing according to their requirements, with an…

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SIPA 3052, lighter than glass and more transparent than glass, is specially designed for car headlight lenses and LED optical modules!

2025-06-25

In LED optical devices, intelligent car lights, and new display modules, transparent encapsulation adhesive is not only a protective material, but also determines light efficiency, durability, and reliability. Today we are introducing a truly optical grade transparent packaging solution from Elaplus. ——SIPA 3052 optical grade liquid silicone, make your optical module “transparent”!SIPA 3052 Optical Grade Liquid Silicone – High Transparency Packaging Material Specially Designed for LED Lens Modules. SIPA 3052 Optical Module Packaging AdhesiveSIPA 3052 is a two-component heat curing transparent silicone gel with excellent optical performance and long-term environmental stability. Specially developed for applications such as LED packaging, car headlight lenses, and optical waveguide modules.

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Internal sealing of liquid level sensor: How can EP 1712 epoxy adhesive overcome extreme environmental challenges?

2025-06-20

Industry pain point: Why does the sealing of liquid level sensors require extremely high adhesive?As a core component in the field of industrial automation, liquid level sensors require strict challenges in terms of internal sealing materials Extreme temperature difference impact: -40 ℃ low temperature condensation+85 ℃ high temperature cycling, which can easily cause traditional adhesives to crack and fail;Difficulty in metal bonding: The surface energy of stainless steel shells is low, and ordinary adhesives are prone to debonding and causing sealing leaks;Strict safety standards: UL94 V-0 flame retardant certification has become a market entry threshold.Solution: EP 1712 epoxy adhesive – designed specifically for harsh working conditionsAfter multiple rounds of testing, the customer ultimately chose EP 1712 universal epoxy sealant, whose core advantages perfectly match their requirements:

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Solution for bonding and sealing copper tubes in battery pack water-cooled plates

2025-06-20

With the rapid development of new energy vehicles, electric tools, and energy storage systems, the thermal management system of power batteries has become a key link in ensuring performance, safety, and lifespan. Among them, the water-cooled plate, as the core heat exchange component, widely adopts a structural design of interference fit between copper pipes and aluminum bottom plates to achieve efficient heat dissipation. However, traditional brazing processes face a series of challenges in actual mass production, which has driven the demand for high thermal conductivity structural adhesive solutions from enterprises. This article will focus on the application scenarios of bonding and sealing copper tubes in battery pack water-cooled plates, analyze the challenges faced, and recommend a high-performance and process friendly structural adhesive – EP 1710 high thermal conductivity epoxy sealant – to assist in the upgrading and iteration of thermal management systems.1、 Application background: Structural characteristics of copper tube aluminum bottom water-cooled plate The water-cooled plate is usually composed of a high thermal conductivity aluminum alloy bottom plate and a high thermal conductivity copper tube. The copper tube is responsible for conducting the coolant, while the aluminum bottom plate is in close contact with the battery module to complete heat exchange.In order to improve heat dissipation efficiency and structural stability, a combination of copper tube and aluminum groove interference fit+brazing reinforcement is often used in design. Although this design exhibits excellent thermal conductivity efficiency, it faces a series of technical difficulties in actual manufacturing.2、 Application Challenge Analysis

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Structural adhesives for non rusting stainless steel bonding: selection, advantages, and application guidelines

2025-06-09

Stainless steel materials are widely used in modern manufacturing, construction, rail transit, home appliances, medical equipment, and even new energy industries due to their corrosion resistance, high strength, and good aesthetics. However, at the same time, the surface passivation layer of stainless steel also poses challenges to adhesion. Traditional welding or mechanical connection methods may cause problems such as thermal deformation, stress concentration, and corrosion hazards. At this point, structural adhesives have become an ideal solution for achieving rust free stainless steel bonding.This article by Yilian will systematically introduce the types, advantages, selection suggestions, and typical applications of structural adhesives used for non corrosive stainless steel bonding, helping you find more reliable and efficient bonding solutions. 1、 Why choose structural adhesive to bond stainless steel?

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Solution for Waterproof Adhesive of UV Disinfection Lamp Board – Using SIPC 1816 to Achieve Efficient Sealing and UV Protection

2025-06-09

With the increasing awareness of health and hygiene, ultraviolet disinfection lamps are widely used in various scenarios such as medical care, home appliances, and public environments. These types of products work in environments with high temperature, high humidity, and high ultraviolet radiation for a long time, especially the lamp board (control circuit board) part, which requires reliable waterproof treatment to avoid electrical short circuits, device corrosion, and other faults caused by water vapor intrusion. UV disinfection lampAmong numerous sealing solutions, the SIPC 1816 silicone series has become an ideal choice for UV disinfection lamp manufacturing enterprises due to its excellent fluidity, waterproofness, UV resistance, and temperature stability. This article will provide a detailed analysis of how to use SIPC 1816 to achieve deep sealing protection for lamp boards and improve the overall reliability and lifespan of the product, based on specific application cases. 1、 The application challenges of ultraviolet disinfection lampsWhen the ultraviolet lamp works, it produces high-intensity ultraviolet light, especially in the UV-C band (200-280nm), which not only has a killing effect on bacteria and viruses, but also poses a challenge to the internal materials of the lamp. As a control center, the lamp board often integrates important components such as LED drivers, timing modules, and power circuits, and imposes the following performance requirements on the adhesive: LED waterproof sealingExcellent UV aging resistance, preventing colloids from powdering and cracking due to prolonged UV exposure;Excellent fluidity, able to penetrate into device gaps and achieve deep sealing without bubbles;Good high temperature resistance (80 ℃~120 ℃), ensuring long-term stable operation;Strong waterproof and moisture-proof ability, preventing condensation or moisture from entering and causing short circuits;Good electrical insulation and flame retardancy ensure the safe operation of circuit boards.2、 Solution recommendation: SIPC 1816 silicone sealant▶ Product IntroductionSIPC 1816 A/B is a two-component, condensation type room…

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Solution for Encapsulation Protection of Filter PCB Board: Optimal Application of PUR 1680 Polyurethane Adhesive

2025-06-05

High performance potting adhesive helps stabilize the operation of electronic componentsIn modern electronic devices, the filter PCB board serves as a key signal processing unit, and its long-term stable operation directly affects the overall performance of the machine. However, the working environment of filters is usually accompanied by multiple challenges such as temperature changes, moisture invasion, electromagnetic interference, etc. Therefore, higher requirements are put forward for the encapsulation and protection materials of PCB boards. Application pain points and encapsulation requirementsFor the special application scenarios of filter PCB boards, the potting adhesive must meet the following performance requirements:Moderate hardness after curing: it should not be too hard to avoid stress damage to the components, nor too soft to prevent inadequate protection. It is recommended to control the hardness at around 80A.Excellent electrical performance: It has good insulation and dielectric properties, ensuring circuit stability without interference.Moderate viscosity: Avoid excessive fluidity caused by low viscosity, which is difficult to control and increases the difficulty of sealing operations.Thermal conductivity ≥ 0.5W/m · K: possessing certain thermal conductivity, which helps with device heat dissipation.After curing, there are no bubbles in the appearance: ensuring sealing and electrical safety, and improving the consistency of product appearance.Good adhesion to the shell: improves overall mechanical strength and enhances environmental adaptability.Recommended product: PUR 1680 polyurethane sealantFor the above technical requirements, we recommend using PUR 1680 polyurethane sealant. This product is a single component moisture cured polyurethane material with the following significant advantages:

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