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Industry Application

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The secret of increasing the sealing efficiency of the shell by 5 times: CIPG process+UV 3306

2026-03-17

Why are more and more engineers giving up O-rings?If you have disassembled a car engine or electronic controller, you must have seen a large number of rubber O-rings and sealing gaskets. These seemingly inconspicuous small parts undertake important tasks: Prevent liquid leakage and maintain shell sealing. But as the structures of new energy vehicles and electronic devices become increasingly complex,Traditional seals are exposing more and more problems: ❌ Low assembly efficiency❌ Installation is prone to errors❌ Structural design is limited❌ Low degree of automation So, a new sealing process is rapidly becoming popular: CIPG (Cured In Place Gasket) in-situ molding sealing technology. What is CIPG sealing process?Simply put, there is no need to prefabricate seals, simply glue to form a sealing ring. CIPG in-situ forming sealing technologyPractical application of CIPG sealTraditional production process vs CIPG production process: ⚡ CIPG process: automatic dispensing of flange surface → assembly of shell → solidification to form sealing ring 🔧 Traditional process: purchase O-ring → install O-ring → lubricate → position → prevent distortion → assemble This method has significant advantages compared to traditional O-rings. The three major advantages of CIPG technology🎨High degree of design freedomGlue dispensing in any shape, irregular sealing structure, multi-layer sealing path, hollow sealing structure🤖High assembly efficiencyFully automatic dispensing assembly, assembly efficiency increased by 3-5 times🛡️Good sealing reliabilityLonger sealing path, more uniform contact surface, better surface adhesion ① Higher degree of freedom in sealing structure designO-rings are standard components and can only be used for simple structures. CIPG glue can be dispensed in any shape, and engineers can customize the best sealing solution according to the product structure, supporting complex designs such as irregular sealing structures, multi-layer sealing paths, and hollow sealing structures. ② Automated assembly has higher efficiencyTraditional assembly requires: installation of O-rings → lubrication → positioning → anti…

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Module semiconductor cooling solution | TCMP 3380 thermal conductive gel 8.4W/M · K high thermal conductivity

2026-03-12

With the rapid development of high-speed electronic products such as 5G communication, data centers, and optical modules, device power consumption and heat generation have sharply increased, and thermal management has become a key factor restricting product performance. Elion ELAPLUS launched TCMP 3380 high-performance heatable gel, which is specially designed for precision electronic devices such as optical modules and semiconductors, to help engineers easily solve the problem of heat dissipation in narrow spaces. ELAPLUS TCMP 3380One component heat curable silicone thermal conductive gel | Heavy engineering type Thermal conductivity, 8.4 W/m·KMinimum thickness, 250 μmTemperature resistance range, -40℃~+200℃Heavy Industry,Peel off without residueEight core advantages🔥Rapid heat conduction8.4W/m · K high thermal conductivity, fast heat conduction, effectively reducing device temperature🛡️Relieve stressAfter curing, an elastic gasket is formed to eliminate thermal stress and protect precision components🔊vibration and noise reductionElastic material properties effectively absorb vibrations and enhance product reliability💧Moisture resistant and weather resistantCan resist moisture and other harsh environments, without cracking or sagging💪High tensile strengthHigh tensile strength, good toughness, not easy to tear, convenient for construction and rework📏Ultra thin and compressibleCan be lowered to a thickness of 250um, perfectly filling narrow gaps and reducing thermal resistance🔄Heavy IndustryRework and peel off without residue, convenient for maintenance and replacement, reducing production costs🎯Flexible constructionVarious thicknesses and shapes can be formed through dispensing or screen printingProduct Details Thermal conductive gel Thermal conductive gel Typical application areasOptical module: 400G/800G QSFP-DD, OSFP optical module, DSP chip, TOSA/ROSA component heat dissipationSemiconductors: IGBT modules, power devices, integrated circuit heat dissipation5G Communication: Thermal Management of 5G Base Station Optical Modules and Front/Middle Transmission EquipmentData center: Heat dissipation of switches, routers, optical portsAutomotive Electronics: Vehicle mounted optical module, LiDAR, motor controllerIndustrial control: frequency converter, servo drive, PLC controllerWhy choose ELAPLUS?Core advantages of ELAPLUSProfessional R&D: ELAPLUS has a team of senior material engineers, focusing on innovative research…

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Thermal Management and Thermal Conductive Material Solution for Optical Modules

2026-03-11

As data centers evolve towards 400G, 800G, and even 1.6T rates, the power consumption and heat generation of optical modules have sharply increased, and thermal management has become a key bottleneck restricting the performance of optical communication systems. As a professional electronic adhesive supplier, ELAPLUS has launched high-performance thermal conductive material solutions for optical module thermal management, helping you easily cope with high-power density heat dissipation challenges. The core challenges faced by thermal management of optical modulesDuring the operation of high-speed optical modules, key components such as DSP chips and TOSA/ROSA components generate a large amount of heat. If heat cannot be dissipated in a timely manner, it will cause device temperature rise, wavelength drift, signal distortion, and seriously affect communication quality and product life. The current thermal management of optical modules faces the following core challenges: space-constrainedhigh powerHigh power density: With the increase of transmission rate, the power consumption of optical modules has increased from a few watts to over ten watts or even higher, and the heat is highly concentrated.Space limitation: The volume of the optical module is constantly shrinking, and the heat dissipation space is limited, which puts higher requirements on the thickness and compressibility of the thermal conductive material.Low volatility requirement: Ordinary silicone materials will release silicone oil at high temperatures, which may contaminate optical lenses and cause signal attenuation.Heavy industry demand: The production process of optical modules is complex and requires thermal conductive materials with good reworkability to facilitate rework.Reliability requirement: Outdoor communication equipment needs to operate stably within a wide temperature range (-40 ℃ to+85 ℃).Yilian Optical Module Thermal Conductive Material Product MatrixElion ELAPLUS launched TCMP series high-performance thermal conductive gel products for optical module thermal management applications, which have excellent performance such as high thermal conductivity, low volatility, and can be reworked, and…

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PCB board waterproof and moisture-proof potting

2026-03-09

In today’s increasingly sophisticated electronic and electrical products, PCB circuit boards are facing increasingly severe environmental challenges. Water vapor erosion is one of the main factors leading to quality problems and decreased reliability of electronic products. Moisture may cause short circuits, corrosion, decreased insulation performance, and even product failure in PCB boards. As a professional electronic adhesive supplier, ELAPLUS provides you with a comprehensive PCB board waterproof and moisture-proof sealing strategy to safeguard the safe and reliable operation of electronic products. Water vapor, the invisible killer of electronic productsThere are a large number of solder joints, components, and copper lines distributed on the surface of PCB circuit boards, which are highly susceptible to moisture damage in humid environments. Water molecules can penetrate into the tiny gaps of PCB boards through capillary action, leading to electrochemical corrosion and electrical short circuits. Especially in the following application scenarios, waterproof and moisture-proof protection of PCB boards is indispensable. Charging gun sealing Charging gun sealingController encapsulation Controller encapsulationOutdoor electronic devices: Smart light poles, outdoor monitoring, charging stations, and other devices are exposed to the air for a long time and need to withstand harsh weather conditions such as rain and haze.New energy vehicle electronics: The working environment of components such as electric vehicle charging guns and battery management systems is complex, requiring extremely high waterproof levels, usually reaching IP67 or even IP68 levels.Industrial control equipment: Industrial automation controllers, frequency converters, and other equipment operate in humid environments such as workshops and basements, requiring effective moisture-proof measures.Consumer electronics products: Portable devices such as smartphones and smartwatches often come into contact with liquids such as sweat and rain, requiring basic waterproof capabilities.Four major protection measures to strengthen PCB security defense lineThere are four main technical solutions on the market for waterproof and moisture-proof protection of PCB…

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How to Choose the Right “Neck Glue” for High-Speed Motors?

2026-02-05

Reliable Application Scheme of EP 1738 in Key Parts of High speed MotorsIn the structure of high-speed motors, the “neck position” is a small and critical adhesive point.Not only does it bear high-speed centrifugal force here, but it also has to face multiple working conditions such as high temperature, vibration, and thermal shock for a long time. Once the adhesive layer fails, it may cause abnormal noise and eccentricity, and in severe cases, the magnetic steel may fall off and the entire machine may be scrapped. Neck glue This is also the reason why “motor neck glue” has higher requirements for materials. 1、 What are the mandatory requirements for adhesive in the neck position of the motor?Based on the actual application scenarios of high-speed motors, the use of adhesive needs to meet the following requirements simultaneously: ✅ 1. Good thixotropy, slightly collapsed but not saggingNo flow or drawing after dispensingMicro collapse filling gaps under gravity or assembly pressureEnsure even adhesive layer and avoid eccentricity issues✅ 2. Stable appearance without yellowingColor stability under long-term high-temperature operationDoes not affect assembly visual inspection and quality consistency due to aging✅ 3. Stable high-speed operating conditions (≥ 30000 Rpm)Can withstand high centrifugal force for a long timeThe adhesive layer is not brittle, powdery, or debonding✅ 4. High temperature resistance and resistance to thermal shockMaintain structural strength even in high temperature environmentsStable adhesion performance after cold and hot cycles2、 Recommended solution: EP 1738 single component epoxy structural adhesiveEP 1738 exhibits extremely high stability in practical applications for the complex working conditions of the neck position of high-speed motors. 🔧 Product Core FeaturesSingle component, solvent-freeNo volatilization, no shrinkage risk, suitable for use in precision structural partsExcellent thixotropy, strong resistance to saggingGlued molding is good, suitable for neck position, facade or narrow seam structureGood toughness+resistance to thermal shockNot…

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What adhesive is used for sealing three-phase copper busbars?

2026-02-05

Analysis of the Application Solution of EP 1721 in High-Reliability Electrical Connection SealingIn new energy vehicles, electric drive systems, industrial motors, and power modules, three-phase copper busbars not only handle high-current transmission tasks but also serve as critical nodes for structural sealing and reliability.Once the seal fails, the ingress of lubricating oil, coolant, or oil vapor can lead to insulation degradation in mild cases, or corrosion, short circuits, and even system failure in severe cases. Therefore, the sealing adhesive for three-phase copper busbars is by no means “just about sticking.”. Three-phase copper busbar sealing ✅ 1. Reliable bonding capability to copper and its coatingsIt exhibits excellent wetting and adhesion on bare copper/brassThe copper busbar with a nickel-plated layer should not delaminate or edge climbLong-term use without interface failure due to oxidation✅ 2. Stable bonding to plastic housingsCompatible with common engineering plastic housingsNo detachment or chipping under thermal expansion and contraction conditions✅ 3. Maintain airtightness after high and low temperature shockThe bonding strength remains stable after thermal cyclingThe airtightness test is passable, with no leakage✅ 4. Excellent chemical resistanceIt can withstand lubricating oil, engine oil, and coolant for extended periodsResistant to oil and gas erosion, not softening or crackingII. Recommended Solution: EP 1721 Conductive Epoxy Encapsulation / Sealing CompoundFor the high-reliability application scenario of three-phase copper busbar sealing, EP 1721 demonstrates exceptional stability in both practical testing and mass production applications. 🔧 Core Advantages of EP 1716Dual bonding capability for both metals and plasticsIt exhibits excellent adhesion to bare copper, copper, and nickel-plated copper busbars while also ensuring bonding with plastic housingsExcellent oil resistanceAfter long-term aging in a 130–150°C hot oil environment:The colloid does not crackThe bonding interface does not develop cracksStructural integrity remains stableMaintains sealing performance after high and low temperature shockAfter passing the thermal shock test, it can still…

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Silicone potting compound | Battery cell fixing and potting solution – enhancing battery safety and lifespan

2026-01-27

In power batteries, energy storage batteries, and various lithium battery modules, the issue of cell fixation and potting is no longer a matter of “whether there is any”, but rather a matter of choosing what material to use and how to choose it.The appropriate potting material not only determines the structural reliability, but also directly affects the safety, stability, and service life of the battery system. 🔋 Vibration and Shock: Mechanical Stress during Transportation, Running, and Start-Stop Processes 🔥 Thermal Cycling Stress: Repeated Temperature Rise and Drop during Charging and Discharging ⚡ Electrical Safety Risks: Extremely High Insulation Performance Requirements in High-Voltage Environments 🌧️ Environmental Erosion: Long-term Effects of Moisture, Dust, and Condensate Water If the battery cells lack effective fixation and protection, they are prone to: Loose structure, fatigue of solder joints, decreased insulation performance, potential short-circuit hazards, noise and resonance issues, and significantly shortened service life👉 The core value of cell fixation and potting lies in providing long-term stable “second-layer protection” for cells in terms of structure, electrical, and environmental aspects. II. Key requirements for adhesive used in cell fixation and potting For cell application scenarios, potting materials typically need to meet the following requirements simultaneously: – Good fluidity and filling performance fully coat the cells and gaps, avoiding voids – Moderate flexibility to buffer vibrations and accommodate thermal expansion and contraction, avoiding stress concentration – Excellent electrical insulation performance enhances the overall electrical safety level of the package – The flame retardant and temperature resistance capabilities meet the long-term reliable operation requirements of the battery system – Lightweight and noise reduction: Reduce the weight of the system while lowering the operating noise III. Recommended Product: SIPA 1850 (7#) A/B Potting Silicone For cell fixation and potting scenarios, SIPA 1850 (7#) two-component potting silicone is a mature solution…

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SIPA 1830(H50) Vehicle Display Frame Bonding Solution

2026-01-27

— Effectively addressing the challenges of debonding and light leakage With the rapid development of smart cockpits, in-vehicle displays are evolving towards larger sizes, narrower frames, and higher brightness. The increasingly sophisticated structure of display modules poses higher demands on frame bonding materials. Once the bonding fails, it can lead to light leakage and abnormal noise at the least, and debonding and reliability failure at the most, directly affecting the overall quality of the vehicle. Common challenges in the display bonding industry: In the bonding of in-vehicle display frames, manufacturers generally face the following issues: The alternating temperature changes cause a significant temperature difference in the interior environment of the degumming vehicle, and ordinary glue is prone to stress concentration due to thermal expansion and contraction. The adhesive layer hardens, resulting in insufficient flexibility of the light-leaking colloid, which cannot absorb structural deformations, leading to changes in the frame gap.The pollution caused by the by-products of curing manifests as white mist volatilizing during the curing of glue in certain display areas, affecting the optical display effect.The long-term aging reliability is insufficient, and there is a significant performance degradation under high temperature, high humidity, and electrical environments.Recommended solution: SIPA 1835 (H50) RTV SIPA 1830A/B two-component addition-type silicone adhesive SIPA 1835 (H50) is based on the RTV SIPA 1830A/B two-component addition-type silicone system, specifically designed for bonding automotive electronics and display structures. It ensures high bonding strength while providing long-term stable elastic cushioning capability. This product can be cured at room temperature and also supports rapid curing through heating, making it suitable for automated production lines. During the curing process, no by-products are volatilized, and the volume change is minimal, making it extremely friendly to precision display modules. The core product features a two-component addition-type system (1:1 mixture) with simple metering and…

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Amid the wave of miniaturization of photonic integrated circuits (PICs), encapsulation adhesives are emerging as a key bottleneck for breakthrough

2026-01-27

Researchers at Columbia University have recently made a breakthrough in the field of optoelectronics, successfully fabricating the smallest integrated photonic circuit to date and achieving high-performance stable operation over a wide wavelength range for the first time. Researchers liken this achievement to replacing vacuum tubes with semiconductor transistors, with potential impacts significant enough to reshape optical communication and optical signal processing systems. However, as PIC continues to evolve towards smaller sizes, higher integration, and more complex functions, a key aspect that has long been underestimated but determines system reliability is gradually emerging: Packaging and bonding materials for photonic integrated circuits. In actual mass production, the challenges faced by PIC packaging mainly focus on the following aspects: Mode Field Matching (模场匹配) sub-micron high-precision alignment and assembly technology for high-speed, repeatable automated packaging processes, which can reliably operate under harsh conditions such as high temperature, high humidity, and reflow soldering, has a very high cost proportion. According to the report “Photonics Packaging 2023” by Yole Développement In photonic integrated systems, over 70% of the overall cost comes from packaging and assembly processes This means that packaging materials, especially adhesives, are no longer “auxiliary materials” but rather system-level key materials. II. Why are adhesives for PIC packaging so demanding?In the PIC package, the adhesive plays multiple roles simultaneously: 1️⃣ Mechanical fixation + optical stabilization: Wafers, chips, optical fibers, lenses, and waveguide arrays require long-term submicron-level positional stability. The shrinkage rate, modulus, and stress release capability of the adhesive directly affect the optical coupling efficiency. 2️⃣ Thermal-moisture-stress multiphysics coupling: Reflow soldering, high-temperature storage (HTS), and high-humidity high-temperature (HAST) conditions can lead to optical path drift or failure due to material water absorption and CTE mismatch. 3️⃣ Process window determines mass production yield: UV/thermal curing speed, dispensing fluidity, thixotropy, dimensional stability and consistency after curing….

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