Battery module lightweighting cannot be achieved by simply replacing conventional solid potting adhesives entirely with low-density foam materials. Foam filling, thermal conduction, structural bonding and insulation protection serve distinct functions. The correct approach is to define zones for cavity filling, heat transfer or load bearing, then adopt a combined solution of PUR 1685 foamed polyurethane, lightweight silicone or standard thermally conductive materials accordingly.

This is one common selection pitfall in battery PACK lightweighting: Lower density does not mean suitability for every adhesive application point.
Suppose a battery module requires filling a large internal cavity. If high-density solid potting material is used for the whole space, greater adhesive volume brings substantial weight gain. For new energy vehicles, drones, mobile energy storage and similar applications, weight directly affects:
Therefore, for large-volume potting, a key question arises: does every part of this adhesive really need to be high-density solid material?
Foam materials contain numerous controlled closed cells. At equal volume, less raw material is consumed, which reduces potting weight. PUR 1685 is a 1:1 two-component foamed polyurethane system. Its density after foaming is approximately 0.2 g/cm³ with UL94 V-0 flame retardancy, designed for large-volume filling scenarios requiring lightweighting such as battery modules.
This material is engineered to fill large spaces with less material mass, rather than pursuing maximum thermal conductivity.
They are designed for different missions.
| Material Type | Primary Function | Key Indicators |
|---|---|---|
| Foamed Polyurethane | Lightweight filling | Density, flame retardancy, cushioning |
| Thermal Gel | Thermal interface | Thermal conductivity, BLT, thermal resistance |
| Thermally Conductive Potting Compound | Encapsulation + heat dissipation | Thermal conductivity, insulation, flowability |
| Structural Adhesive | Load-bearing bonding | Bond strength, toughness, fatigue resistance |
| Silicone Gel | Low-stress protection | Softness, insulation, moisture resistance |
Take heat transfer from cell base to cold plate as an example. Replacing the original thermal interface material with low-thermal-conductivity foam reduces weight but may degrade the thermal path. Lightweighting must not compromise thermal design.

Priority evaluation areas include:
If a zone bears major structural loads, conducts primary heat flow or requires precision dimensional positioning, the suitability of foam systems must be re-assessed.
As foaming ratio rises, the internal structure of the material changes. Engineering evaluation should not chase minimum density alone. Additional validation targets:
Uncontrolled foaming may cause:
What matters is stable and controllable low density, not an extremely high foaming ratio achieved only in lab trials.
Solid potting mainly requires control over adhesive flow paths. Foam potting has an extra factor: where the material expands. Excessive dispense volume may lead to:
Dispense volume cannot be calculated simply as “cavity volume = liquid adhesive volume”. Final foamed volume must be verified on the actual structure.
Air trapped inside the cavity must escape during foam expansion. Fully enclosed structures can trap air at:
Structural design should define:
This is not purely a material issue. It requires integrated design of material, structure and process.


| Material System | Features | Typical Application |
|---|---|---|
| PUR 1685 | Foamed polyurethane, ~0.2 g/cm³, V-0 | Large-volume lightweight filling |
| SIPA 2100-7# | Lightweight addition-cure silicone, 0.70 g/cm³ | Wide-temperature-range lightweight potting |
| PUR 1680 | Solid polyurethane, 0.8 W/m·K | Moderate thermal conduction and protection |
| TCMP Series | Thermal interface materials | Thermal management for cells and power devices |
SIPA 2100-7# is a 1:1 addition-curing lightweight silicone with density of approx. 0.70 g/cm³ and service temperature from -60 ~ 200°C. It fits applications requiring low density over a wide temperature range without high foaming structure.
There are at least two lightweighting routes: Weight reduction via foaming and Weight reduction via low-density solid materials.
These five questions are more practical for engineering selection than simply asking “is there a lighter adhesive”.
Lightweighting must be achieved without functional degradation.
A battery module can adopt multiple materials at the same time: Structural adhesives for bonding Thermal gels for heat dissipation Potting compounds for electronic protection Foam adhesives for large cavity filling
This approach appears more complex than filling the whole cavity with one single adhesive. Yet it enables precise material deployment and balances weight, thermal management, safety and reliability simultaneously.
This is ELAPLUS’s principle: select adhesives according to working conditions instead of stacking material parameters.
Q: Is lower density always better for battery module foaming potting adhesive?
A: No. Density is only one lightweighting indicator. Flame retardancy, mechanical properties, foam cell stability and long-term reliability also need verification.
Q: What are the main applicable scenarios for PUR 1685?
A: It is suitable for large-volume lightweight filling, cushioning and flame retardant protection inside battery modules. For zones undertaking major heat transfer or load bearing, alternative materials should be matched.
Q: Can foam adhesive replace thermal adhesive?
A: Direct replacement is not feasible. They are designed for different functions. Primary thermal paths shall be designed based on thermal resistance and thermal conductivity requirements.
Q: Why cannot the entire cavity of a battery pack be fully filled with foam adhesive?
A: Thermal paths, structural loads, expansion clearance, venting routes and no-adhesive zones such as connectors must all be considered.
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