Key performance indicators for three-phase copper busbar potting compounds include insulation, oil resistance, thermal cycling resistance, CTE and crack resistance. Elaplus offers three material solutions for three-phase copper busbars: EP 1716, EP 1721-1 and SIPA 3005. EP 1716 features high Tg and low CTE; EP 1721-1 adopts a flexible epoxy system; SIPA 3005 is a one-component heat-curable self-leveling silicone.
Three-phase copper busbars are widely applied in:
They are responsible for high-current transmission and electrical connections. Adhesives used here mainly serve insulation protection, thermal management, shock-resistant fixing and anti-corrosion.

EP 1716 is a 100:5 epoxy potting compound with high Tg and low CTE.
Recommended applications:
Copper and resin feature different coefficients of thermal expansion. Reducing CTE helps minimize interfacial stress generated during temperature cycling.

EP 1721-1 is a 3:1 flexible epoxy potting compound with low stress, excellent crack resistance and thermal stability.
Suitable for structures demanding strong buffering against thermal displacement and mechanical stress.

SIPA 3005 is a one-component heat-curable, self-leveling silicone.
Designed for specific copper busbar sealing and insulation scenarios requiring one-component processing and self-leveling technology.
| Grade | Material Type | Core Advantages |
|---|---|---|
| EP 1716 | Epoxy | High Tg, Low CTE |
| EP 1721-1 | Flexible Epoxy | Low stress, Crack resistance |
| SIPA 3005 | Silicone | One-component, Heat-curable, Self-leveling |
Copper busbars and resins expand to different extents under temperature variation. Improper CTE matching may lead to interfacial stress and cracking.
Reliability cannot be judged merely by the term “flexible”. Validation should be carried out based on actual structure, temperature range, adhesive thickness and loading conditions.
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