Adhesive selection for electronic water pumps and electronic oil pumps in new energy vehicles focuses on PCB potting, power module heat dissipation and control board fixation. Elaplus recommends SIPA 1850 for PCB potting, TCMP 1941 for power module heat dissipation, and EP 2012 for control board fixation, to address electronic protection, thermal management and structural reliability challenges respectively.
Why Adhesive Requirements for Electronic Water & Oil Pumps Are More Complex
An electronic pump integrates motors, power devices, PCBs and fluid systems.
Compared with conventional electronic control boards, electronic pumps are continuously exposed to:
- Long‑term vibration
- Temperature fluctuation
- Humidity and condensation
- Heat generation from power components
- Water, oil or other working fluid environments
Key application demands for electronic pumps can be summarized as housing sealing, structural bonding and resistance to medium corrosion.
Recommended Grade for Electronic Pump PCB Potting
SIPA 1850 Two‑Component Thermally Conductive Silicone Potting Compound
Within electronic water pump / oil pump solutions, SIPA 1850 is designated for PCB potting.
Potting mainly delivers the following functions:
- Moisture protection for PCBs
- Electrical insulation of components
- Vibration resistance protection
- Fixation of electrical connection zones
- Isolation from environmental contaminants
Since electronic pumps contain components of varying heights, adequate flowability and air bubble evacuation shall be prioritized during potting process design.
Recommended Grade for Power Module Thermal Dissipation
TCMP 1941 Two‑Component Thermal Gel
TCMP 1941 is used for heat dissipation of internal power modules inside electronic pumps.
Heat‑generating components such as power MOSFETs and driver devices require efficient heat transfer to the pump body or metal housing, which makes intact thermal interfaces critical.
Key evaluation criteria during material selection:
‑ Thermal conductivity
‑ Interface conformability
‑ Hardness
‑ Long‑term thermal cycling performance
‑ Material stability
Recommended Grade for Control Board Fixation
EP 2012 Two‑Component Epoxy Structural Adhesive
EP 2012 is applied for control board fixation.
For electronic pumps subject to persistent vibration, control boards cannot rely solely on screws, fasteners or solder joints. Proper structural adhesives help share mechanical loads.
Adhesive Selection Table for Electronic Water / Oil Pumps
| Application Location | Recommended Grade | Core Functions |
|---|---|---|
| PCB | SIPA 1850 | Potting, moisture resistance, insulation |
| Power Modules | TCMP 1941 | Thermal conduction & heat dissipation |
| Control Board | EP 2012 | Structural fixation |
FAQ on Adhesive Selection for Electronic Water Pumps
Why are medium compatibility tests mandatory for electronic oil pump adhesives?
Long‑term material performance can be affected by actual oil media. Verification using target working fluid is required.
Is thermal interface material still needed for power modules if the PCB is fully potted?
Dedicated thermal interface design remains necessary for power devices with high heat flux density.
Technical Selection / Free Sample Request：info@elaplus.cc｜+86-21-67227200
