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Home » Tag » Silicone potting compound

How to Select Potting Compounds for PCBA: Comparison of Epoxy, Polyurethane & Silicone Grades

2026-07-22

Potting compounds for PCBA shall be selected according to component stress sensitivity, operating temperature, thermal conductivity requirements, structural strength, potting clearance and rework demands. Silicone potting compound SIPA 1850 is suitable for modules with wide temperature range, low stress and frequent thermal cycling; PUR 1650 and PUR 1680 are recommended for control boards requiring flexibility, vibration resistance and gap filling; EP 1715 and EP 1780 apply to electronic modules demanding robust structural support, temperature resistance and dimensional stability. Why is PCBA Potting Required? PCBA potting refers to filling liquid compound between the PCB and housing, which cures to encapsulate printed circuit boards, solder joints and electronic components. Its core functions include: Compared with conformal coating, potting compounds form much thicker layers and deliver more comprehensive protection, yet they bring higher weight, greater exotherm during curing and increased difficulty for rework. Recommended Silicone Potting Compounds for PCBA SIPA 1850AB: Thermally Conductive Silicone Potting Compound SIPA 1850 is a 1:1 two-part thermally conductive silicone potting material. Its mixed viscosity is approximately 3000 cps. Multiple thermal conductivity grades ranging from 0.8 to 4.0 W/m·K are available, with cured hardness of Shore A 55. Typical Applications: 1、Automotive electronic controllers; 2、OBC, power supply and inductor modules; 3、Photovoltaic inverters; 4、Energy storage electronic modules; 5、PCBAs exposed to frequent thermal cycling; 6、Components sensitive to mechanical stress. Cured silicone remains elastic, capable of absorbing thermal displacement between PCBs, copper busbars, plastics and metal housings. Recommended Polyurethane Potting Compounds for PCBA PUR 1650AB: Low-Hardness Thermally Conductive Polyurethane PUR 1650 is a 5:1 low-hardness thermally conductive polyurethane potting material. Its mixed viscosity is roughly 600 cps with thermal conductivity of approx. 1 W/m·K. Typical Applications: 1、PCBAs with complex structures and narrow gaps; 2、Control boards requiring low-stress protection; 3、Sensors and compact electronic modules; 4、Equipment demanding low-temperature flexibility. PUR 1680AB: Balanced Flexibility &…

How to Choose Power Supply Potting Compound? ELAPLUS Thermal Conductive Potting Solutions — One-Stop Resolution for Power Module Heat Dissipation Challenges

2026-05-13

I. The Hidden Killer of Power Modules: Have You Paid Attention to Heat? Have your charging piles suddenly stopped working in scorching summer heat? Do LED driver power supplies frequently burn out within less than a year? Does your designed inverter always fail at critical moments? The culprit is most likely the same — heat accumulation. Geomagnetic sensor potting During continuous operation, core components such as transformers, inductors, MOSFETs and rectifier bridges inside power modules generate massive heat. When such heat cannot be dissipated efficiently, the failure rate of electronic devices may double for every 10℃ rise in junction temperature. Especially for high power density equipment like new energy vehicle charging guns, photovoltaic inverters and LED driver power supplies, heat dissipation is no longer an optional add-on, but a decisive factor determining product reliability and service life. In the past, engineers regarded thermal conductive potting compound as an auxiliary material. By 2026, the whole industry has reached a consensus: thermal conductive potting compound has upgraded from auxiliary material to a core functional component. Choosing the right potting compound is equivalent to equipping the power module with an all-round protective armor integrating heat dissipation, insulation, flame retardancy and environmental protection. With countless potting products on the market and thermal conductivity ranging from 0.5 W/m·K to over 3 W/m·K, how should you make the right choice? This article clarifies your selection logic from four dimensions: thermal conductivity matching, material comparison, application scenario adaptation and flame retardant rating. II. How to Choose 1W, 2W or 3W Thermal Conductivity? Higher Is Not Always Better Many purchasers and engineers hold a common misconception that the higher the thermal conductivity, the better. Thermal conductivity (Unit: W/m·K) refers to the heat transfer capability of materials; the higher the value, the stronger the heat conduction performance. In practical…

How to Choose Electronic Potting Compounds? ELAPLUS – A 10,000-Ton-Class Electronic Adhesive Manufacturer Providing One-Stop Solutions

2026-05-13

Against the backdrop of rapid development in new energy vehicles, photovoltaic energy storage, and 5G communications, electronic potting compounds, as critical materials that protect electronic components from moisture, vibration, and chemical corrosion, are embracing unprecedented industrial opportunities. Industry data shows that the global electronic potting and encapsulation market size is expected to reach USD 2.82 billion in 2026 and exceed USD 6.4 billion by 2035, with a compound annual growth rate (CAGR) of up to 9.6%. In this track, ELAPLUS® (Elaplus Functional Materials (Shanghai) Co., Ltd.), adhering to the brand philosophy of “Bonding Everything, Adhering to the Future”, has long been engaged in the electronic adhesive field and provides global customers with full-scenario solutions ranging from motor potting compounds, sensor potting compounds, and power supply potting compounds to thermal interface materials. Three Major Trends in the Electronic Potting Compound Industry Forcing Supply Chain Upgrades Currently, the electronic potting compound industry is undergoing three transformations: First, the accelerated penetration of 800V high-voltage platforms in new energy vehicles has raised higher requirements for the insulation strength and thermal conductivity of potting materials. It is estimated that from 2024 to 2026, the CAGR of vehicle-grade thermal conductive potting compound demand will reach 28.5%. Second, domestic substitution is accelerating in an all-round way. Under the considerations of tariff restructuring and supply chain security, the localization rate of electronic adhesives has rapidly climbed from 31% in 2024 to 44% in 2026. Chinese enterprises, leveraging their technological accumulation and production capacity advantages, are competing strongly with foreign-funded enterprises in the mid-to-high-end market. Third, the trend of multi-functional integration is obvious. Potting compounds with a single protective function can no longer meet demands, and composite materials with thermal conductivity, flame retardancy, low stress, fast curing, and other characteristics are becoming mainstream. It is at the intersection of these…

Induction gate electromagnetic induction coil potting solution

Induction gate electromagnetic induction coil potting solution

2024-08-22

As the core component of modern intelligent access control system, induction gate is widely used in office buildings, residential areas, factories and transportation hubs. In order to ensure the long-term stable operation of the induction gate, especially in various complex environments such as high temperature, high humidity or frequent mechanical vibration, high-performance potting glue must be used for protection. The potting glue not only needs to have excellent waterproof, dustproof and corrosion resistance, but also needs to provide excellent electrical insulation and mechanical stress relief functions to extend the product life. Potting material requirements: Waterproof: The induction gate needs to be exposed to the outdoors and be affected by rain, moisture, etc. for a long time. Therefore, the potting glue needs to have a protection level of IP67 or higher to ensure that the electronic components are not corroded by moisture. Weather resistance: Adaptability to different environmental conditions, including high temperature, low temperature, UV rays, etc. The material must maintain stable performance in the temperature range of -40°C to +120°C. Electrical insulation: To ensure the safety of circuit components in long-term operation and avoid the risk of short circuit or electric shock, the electrical insulation should reach 10^14 Ω·cm. Mechanical properties: Good impact resistance and vibration resistance to ensure that the equipment will not be damaged under daily use and external impact. Environmental requirements: Materials must comply with environmental standards such as RoHS and REACH. Glue recommendation

SIPA 8606 A/B silicone gel

SIPA 1850 A/B general use silicone potting compound

2024-08-18

Product Description: SIPA 1850 A/B is a two-component low-density silicone potting adhesive. It has good fluidity after mixing. The operation time can be adjusted according to the temperature. It can be deeply cured at room temperature. It is suitable for potting protection of various heat dissipation and temperature-resistant components. It fully complies with the EU ROHS directive and SVHC REACH requirements. Feature

SIPC 8125 A/B Silicone Potting Adhesive

SIPC 1815T A/B Silicone Potting Adhesive

2024-08-17

Product Description: SIPC 1815T is a normally popular potting material. It supplies stable protection to variety of electric components.The mixture is flowable, would be deeply cured. Theoperation time can be adjusted according to the temperature and agent added.The majority of materials have a good bonding effect without primer, suitable for accessories fixed and waterproof, dust and leakage. Feature: 1)Two-component, condensation de-alcohol type2)Low viscosity, easy processing3)Low hardening shrinkage, no corrosion without stress4)Excellent high temperature electrical insulation, stability set5)Excellent adhesion, good waterproof, moisture resistance Applications：1)Automotive electronics, modules2)Power control module3)Solar module junction box4)LED spotlights, wall washer, bar lights, LED lamps

Two-component silicone potting compound

Two-component silicone potting compound

2024-08-13

Two-component silicone potting compound can be divided into condensation type and addition type. The general characteristics of the condensation type silicone encapsulant: insulation, moisture resistance, excellent electrical properties, excellent heat and cold resistance, weather resistance, etc. Cures at room temperature without exothermic or endothermic. During the curing process, a small amount of low molecular weight (alcohol) is released. Shanghai Elaplus SIPC 8125 condensation type silicone encapsulants have the following characteristics: The product characteristics of the addition type silicone encapsulant: insulation, moisture resistance, excellent electrical properties, excellent heat and cold resistance, and earthquake resistance. Curing at room temperature, or heat curing. No low molecular release during curing. When curing, the inside and outside are cured at the same time, which can be deeply cured. Shanghai Elaplus SIPA 8230 addition type Silicon Potting compound has the following characteristics:

Silicone potting gel for Thyristor, IGBT, SCR Rectifier modules

Silicone Potting Gel for Thyristor, IGBT, SCR Rectifier modules

2024-08-12

Shanghai Elaplus is a professional supplier of silicone, epoxy and polyurethane potting compound. In SCR Rectifier filed, we have rich experience, below is our silicone potting gel solution for SCR Rectifier. Thermal conductivity potting compound for Three-phase SCR Rectifier chip Silicone potting gel for SCR Rectifier bottom, polyurethane and epoxy potting on top of SCR Rectifier Silicone potting gel for IGBT SCR Rectifier Shell bonding and sealing for IGBT Rectifier Thermal grease heat dissipation for SCR Rectifier bottom

6102 5:1 general type epoxy potting compound

SIPA 3015 bonding type potting compound

2024-08-12

Description SIPA 3015 is a product designed for addition reaction with adhesive force and mixing ratio100:100 two-component silicone sealant that can be used with numerous substances without the need for a primerGenerate excellent adhesion ability: for example, common polar plastic PC (polycarbonate)PET (polyethylene terephthalate), PA nylon (polyamide), PBT (poly (p-phenylene))Diethylene glycol dicarboxylate, thermosetting resin epoxy resin, metal aluminum, copper and other materials. Feture 1:1 mixing convenienceLow viscosity and good fluidityCan be cured at room temperature or by heatingThe curing process produces no by-productsBlack glossy surface after curingLow stress, easy to repairNo need for primer to bond numerous substratesWide working temperature range -60-220 ℃Has excellent end insulation properties

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