Thermal Interface Material for 48V BSG Modules｜TCMP 1941 Thermal Gap Filling Solution
When assembly gaps exist between power devices and metal heat dissipation structures inside a 48V BSG module, ELAPLUS TCMP 1941 two‑component thermal gel may be evaluated. Key verification targets include gap compatibility, assembly pressure, transient temperature rise and vibration reliability. For 48V mild‑hybrid systems equipped with power electronic control units, the thermal interface material shall match the actual heat path; potting adhesive for motor windings shall not be used directly at the thermal interface between power devices and heat sinks. A 48V BSG generally refers to a belt‑driven starter‑generator system. Its control electronics deliver cranking assistance, power generation and energy management according to the specific architecture. Under different operating modes, power devices are subject to varying current levels, power losses and thermal loads. For designs with power electronics integrated inside a compact housing, heat transfer between heat‑generating components and metal structures is critical for thermal management. Where mating surfaces feature height offsets, local unevenness or intentional assembly gaps, a suitable thermal interface material shall be selected according to the construction. 1. Why Thermal Gap Filling Is Required for 48V BSG Modules Although the operating voltage of a 48V BSG system is lower than that of conventional high‑voltage powertrain drives, its power electronics can still generate substantial heat loss under large currents and fast load transients. Thermal requirements therefore cannot be underestimated merely because of the 48V voltage class. In certain controller designs, MOSFETs and other power devices dissipate heat through their packages, thermal substrates and metal housings. If a designed gap separates the heat source from the heat dissipation hardware, air alone will often fail to meet specified thermal targets. Thermal gap filler improves interfacial contact and creates a compliant heat transfer path within design limits. It is not intended to serve as the primary mechanical fastener, nor can it…
