EP 6102 5:1 general type epoxy potting compound,this compound can be cured by room temperature, the curing process is low temperature,low shrinkage rate. Solid surface light, not cracking, moisture proof, insulation
This compound can be cured by room temperature, the curing process is low temperature,low shrinkage rate.
Solid surface light, not cracking, moisture proof, insulation
Feature
Application
Used for general electronic components filling and sealing of circuit boards.
Room temperature can be cured, the curing process is low temperature, low shrinkage rate. Solid surface light, not cracking, moisture proof, insulation.
Item | Unit | Standards | Typical Value |
---|---|---|---|
Color | – | Visual inspection | transparent |
Viscosity | 25℃, mPa·s | GB/T 10247-2008 | 200±50 |
Tack-free time | 25℃, 55%RH,min | GB/T13477-2002 | 20-40 |
Density | 25℃, g/cm3 | ASTM D792 | 0.85±0.05 |
Tensile Strength | MPa | GB/T 528-2009 | 38 |
Elongation at break | % | GB/T 528-2009 | 200 |
Thermal Conductivity | W/m.K | GB/T 10297-1998 | 0.247 |
T-peel strength, T-Peel | N/mm,Sandblasted Iron(1mm), Fe-Fe,170℃ 20min | —— | 8.31 |
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