EP 6102 5:1 general type epoxy potting compound

This compound can be cured by room temperature, the curing process is low temperature,low shrinkage rate.Solid surface light, not cracking, moisture proof, insulation Feature Application Used for general electronic components filling and sealing of circuit boards.Room temperature can be cured, the curing process is low temperature, low shrinkage rate. Solid surface light, not cracking, moisture proof, insulation. Item Unit Standards Typical Value Color – Visual inspection transparent Viscosity 25℃, mPa·s GB/T 10247-2008 200±50 Tack-free time 25℃, 55%RH,min GB/T13477-2002 20-40 Density 25℃, g/cm3 ASTM D792 0.85±0.05 Tensile Strength MPa GB/T 528-2009 38 Elongation at break % GB/T 528-2009 200 Thermal Conductivity W/m.K GB/T 10297-1998 0.247 T-peel strength， T-Peel N/mm，Sandblasted Iron(1mm), Fe-Fe，170℃ 20min —— 8.31