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Industry Application

EP 1702 white epoxy potting adhesive, easily meets the waterproof and insulation challenges of electronic components!

2025-06-25

In modern electronic manufacturing, more and more terminal equipment put forward higher requirements of “multi performance integration” for potting adhesive: not only must it be waterproof and moisture-proof, reliable insulation, strong anti-aging ability, but also must achieve low shrinkage, bright surface, and bubble free packaging effect. Today, we will share a real case of ELAPLUS star product – EP 1702 white epoxy potting adhesive in customer applications, taking you to understand how it easily meets the challenges of electronic component potting! Project background: The customer’s pain points are highlighted, and traditional adhesives are difficult to handleA customer specializing in industrial electronic module packaging has been searching for a sealing adhesive that combines easy operation, excellent insulation, and moisture resistance stability for their small relays, power modules, controllers, and other products. Although the adhesive used previously had decent apparent performance, there were several issues:Slow curing at room temperature, affecting the production line rhythm;During the sealing process, there are many bubbles that are difficult to eliminate;After curing, the surface is not smooth enough and the appearance is not good;It is prone to aging and shedding in humid and hot environments.So, the customer decided to introduce ELAPLUS recommended EP 1702 two-component ambient temperature epoxy potting adhesive and conduct a one week potting and environmental testing. Solution: EP 1702 white epoxy sealantEP 1702 is a white two-component ambient temperature curing epoxy potting adhesive designed specifically for electronic devices, with the following core advantages:Low exothermic reaction, with a shrinkage rate of less than 2% during the curing processStrong operability, the operable time after mixing can reach 40 minutes to 2 hoursAfter curing, the surface is shiny and does not bubbleWide temperature resistance range (-40~120 ℃), stable electrical performanceThe customer selected the standard EP 1702 white potting adhesive for testing according to their requirements, with an…

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SIPA 3052, lighter than glass and more transparent than glass, is specially designed for car headlight lenses and LED optical modules!

2025-06-25

In LED optical devices, intelligent car lights, and new display modules, transparent encapsulation adhesive is not only a protective material, but also determines light efficiency, durability, and reliability. Today we are introducing a truly optical grade transparent packaging solution from Elaplus. ——SIPA 3052 optical grade liquid silicone, make your optical module “transparent”!SIPA 3052 Optical Grade Liquid Silicone – High Transparency Packaging Material Specially Designed for LED Lens Modules. SIPA 3052 Optical Module Packaging AdhesiveSIPA 3052 is a two-component heat curing transparent silicone gel with excellent optical performance and long-term environmental stability. Specially developed for applications such as LED packaging, car headlight lenses, and optical waveguide modules.

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Solution for bonding and sealing copper tubes in battery pack water-cooled plates

2025-06-20

With the rapid development of new energy vehicles, electric tools, and energy storage systems, the thermal management system of power batteries has become a key link in ensuring performance, safety, and lifespan. Among them, the water-cooled plate, as the core heat exchange component, widely adopts a structural design of interference fit between copper pipes and aluminum bottom plates to achieve efficient heat dissipation. However, traditional brazing processes face a series of challenges in actual mass production, which has driven the demand for high thermal conductivity structural adhesive solutions from enterprises. This article will focus on the application scenarios of bonding and sealing copper tubes in battery pack water-cooled plates, analyze the challenges faced, and recommend a high-performance and process friendly structural adhesive – EP 1710 high thermal conductivity epoxy sealant – to assist in the upgrading and iteration of thermal management systems.1、 Application background: Structural characteristics of copper tube aluminum bottom water-cooled plate The water-cooled plate is usually composed of a high thermal conductivity aluminum alloy bottom plate and a high thermal conductivity copper tube. The copper tube is responsible for conducting the coolant, while the aluminum bottom plate is in close contact with the battery module to complete heat exchange.In order to improve heat dissipation efficiency and structural stability, a combination of copper tube and aluminum groove interference fit+brazing reinforcement is often used in design. Although this design exhibits excellent thermal conductivity efficiency, it faces a series of technical difficulties in actual manufacturing.2、 Application Challenge Analysis

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Structural adhesives for non rusting stainless steel bonding: selection, advantages, and application guidelines

2025-06-09

Stainless steel materials are widely used in modern manufacturing, construction, rail transit, home appliances, medical equipment, and even new energy industries due to their corrosion resistance, high strength, and good aesthetics. However, at the same time, the surface passivation layer of stainless steel also poses challenges to adhesion. Traditional welding or mechanical connection methods may cause problems such as thermal deformation, stress concentration, and corrosion hazards. At this point, structural adhesives have become an ideal solution for achieving rust free stainless steel bonding.This article by Yilian will systematically introduce the types, advantages, selection suggestions, and typical applications of structural adhesives used for non corrosive stainless steel bonding, helping you find more reliable and efficient bonding solutions. 1、 Why choose structural adhesive to bond stainless steel?

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Solution for Waterproof Adhesive of UV Disinfection Lamp Board – Using SIPC 1816 to Achieve Efficient Sealing and UV Protection

2025-06-09

With the increasing awareness of health and hygiene, ultraviolet disinfection lamps are widely used in various scenarios such as medical care, home appliances, and public environments. These types of products work in environments with high temperature, high humidity, and high ultraviolet radiation for a long time, especially the lamp board (control circuit board) part, which requires reliable waterproof treatment to avoid electrical short circuits, device corrosion, and other faults caused by water vapor intrusion. UV disinfection lampAmong numerous sealing solutions, the SIPC 1816 silicone series has become an ideal choice for UV disinfection lamp manufacturing enterprises due to its excellent fluidity, waterproofness, UV resistance, and temperature stability. This article will provide a detailed analysis of how to use SIPC 1816 to achieve deep sealing protection for lamp boards and improve the overall reliability and lifespan of the product, based on specific application cases. 1、 The application challenges of ultraviolet disinfection lampsWhen the ultraviolet lamp works, it produces high-intensity ultraviolet light, especially in the UV-C band (200-280nm), which not only has a killing effect on bacteria and viruses, but also poses a challenge to the internal materials of the lamp. As a control center, the lamp board often integrates important components such as LED drivers, timing modules, and power circuits, and imposes the following performance requirements on the adhesive: LED waterproof sealingExcellent UV aging resistance, preventing colloids from powdering and cracking due to prolonged UV exposure;Excellent fluidity, able to penetrate into device gaps and achieve deep sealing without bubbles;Good high temperature resistance (80 ℃~120 ℃), ensuring long-term stable operation;Strong waterproof and moisture-proof ability, preventing condensation or moisture from entering and causing short circuits;Good electrical insulation and flame retardancy ensure the safe operation of circuit boards.2、 Solution recommendation: SIPC 1816 silicone sealant▶ Product IntroductionSIPC 1816 A/B is a two-component, condensation type room…

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Solution for Encapsulation Protection of Filter PCB Board: Optimal Application of PUR 1680 Polyurethane Adhesive

2025-06-05

High performance potting adhesive helps stabilize the operation of electronic componentsIn modern electronic devices, the filter PCB board serves as a key signal processing unit, and its long-term stable operation directly affects the overall performance of the machine. However, the working environment of filters is usually accompanied by multiple challenges such as temperature changes, moisture invasion, electromagnetic interference, etc. Therefore, higher requirements are put forward for the encapsulation and protection materials of PCB boards. Application pain points and encapsulation requirementsFor the special application scenarios of filter PCB boards, the potting adhesive must meet the following performance requirements:Moderate hardness after curing: it should not be too hard to avoid stress damage to the components, nor too soft to prevent inadequate protection. It is recommended to control the hardness at around 80A.Excellent electrical performance: It has good insulation and dielectric properties, ensuring circuit stability without interference.Moderate viscosity: Avoid excessive fluidity caused by low viscosity, which is difficult to control and increases the difficulty of sealing operations.Thermal conductivity ≥ 0.5W/m · K: possessing certain thermal conductivity, which helps with device heat dissipation.After curing, there are no bubbles in the appearance: ensuring sealing and electrical safety, and improving the consistency of product appearance.Good adhesion to the shell: improves overall mechanical strength and enhances environmental adaptability.Recommended product: PUR 1680 polyurethane sealantFor the above technical requirements, we recommend using PUR 1680 polyurethane sealant. This product is a single component moisture cured polyurethane material with the following significant advantages:

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Case Study of Elaplus | Solution for High Temperature Oil Environment potting of Automotive Oil Pressure Sensor

2025-05-22

In modern automotive electronics, the working environment of sensors is becoming increasingly demanding. Especially in high temperature, high pressure, and high oil immersion application scenarios such as engine compartments and transmission systems, unprecedented challenges have been posed to the reliability of sealing materials. In this case study, we focus on how to use high-performance epoxy sealant to achieve long-term stable sealing protection and electrical insulation for automotive oil pressure sensors when facing various highly corrosive liquid immersion and extreme temperature difference conditions. 1、 Application Background: Challenging “Oil Sea” EnvironmentOil pressure sensors are widely deployed in engine lubrication systems to monitor oil pressure in real-time and ensure safe engine operation. The sensor body needs to be immersed in the following media for a long time:🔧 Long term soaking of engine oil🛑 Brake oil DOT3/DOT4 erosion⚙️ Transmission fluid (such as Castrol BOT790/Shell SL2100)❄️ Volatile erosion of refrigerant mediumMore importantly, the environment in which the sensor is located also faces severe temperature fluctuations, with a temperature range covering all operating conditions from -40 ℃ to 140 ℃, and even requiring the material to withstand long-term thermal aging environments of 150-180 ℃.If the adhesive performance does not meet the standard, it is highly likely to cause the sealing layer and substrate to peel off, crack, and even lead to internal short circuit failure of the sensor, thereby triggering a vehicle warning or malfunction. 2、 Recommended solution: EP 1710A/B high temperature resistant epoxy sealantFor the above extreme application environments, we recommend using EP 1710 A/B two-component epoxy sealant. Its formula is designed specifically for environments with high temperature resistance, oil resistance, and resistance to refrigerant corrosion, and has the following outstanding properties:✅ 1. Long term high temperature and thermal shock resistanceCan work at a temperature of 150-180 ℃ for a long time, with stable thermal…

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Tire pressure sensor adhesive solution: PUR 1680, firmly bonded!

2025-05-22

1、 What is a tire pressure sensor? What are the key requirements for adhesives?Tire pressure sensor (TPMS) is an indispensable safety component in modern automobiles, mainly installed at the wheels or valves, used to monitor the internal pressure and temperature of the tires in real time, and transmit data to the vehicle control system to prevent tire blowouts or abnormal air pressure. PUR 1680 tire pressure sensor encapsulationDue to its extremely harsh working environment (such as high-frequency vibration, high and low temperature cycles, humidity and heat, oil stains, and long-term use), strict requirements have been put forward for the selection of internal and external adhesives:Adhesives need to have the following key properties:✅ Strong adhesive force: can firmly bond different substrates such as metal, ceramic, plastic, etc✅ High and low temperature resistance: Long term stability from -40 ℃ to 125 ℃, with some applications requiring up to 150 ℃✅ Salt spray and humid heat resistance: does not fail or corrode sensor materials in outdoor environments✅ Flexible cushioning: resist stress changes caused by tire vibration and thermal shock✅ Excellent oil resistance: resistant to oil, water, or hydrocarbons that may come into contact with the interior of the tire2、 Recommended solution: Hot melt reactive polyurethane adhesive (PUR 1680)🔹 Product Name: PUR 1680PUR 1680 A/B two-component polyurethane sealant, used for two-component sealing and filling. The raw materials are free of heavy metals, environmentally friendly, and have a wide range of process operability. The finished product has high physical properties and good adhesion to the substrate. It can be cured at room temperature or by heating, and can be deeply cured. The two-component mixture has good fluidity and excellent flexibility after curing. It is used for casting and sealing of communication equipment, transformers, control power supplies, ignition controllers, electronic sensors, etc.Low viscosity, strong operabilityExcellent low-temperature…

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High performance liquid thermal conductive gel gasket TCMP 1935– a new generation solution for automotive ECU thermal management

2025-05-15

Industry Challenge: Thermal Management, Hidden Killer of Automotive ElectronicsWith the continuous evolution of new energy vehicles, autonomous driving, and intelligent cockpit technologies, automotive electronic systems are highly integrated, ECU、IGBT、MCU、 The continuous improvement of power density of core components such as motor controllers has put forward more stringent requirements for the performance of thermal management materials: ❌ Traditional thermal pads have a large thickness and high compressive stress, which can easily lead to fatigue failure of solder joints❌ Thermal paste is prone to long-term drying, cracking, and loss, with poor reliability and difficulty in repair❌ The application of thermal conductive gel is complex, and it is difficult to give consideration to both fluidity and positioning accuracy❌ In high-end manufacturing, manual patching and dispensing have low efficiency and do not meet automation requirements[Solution: TCMP 1935 Liquid Thermal Conductive gel]In response to the pain points of industrial thermal management, we launched a new product: TCMP 1935 Liquid Thermal Conductive gel. This is a two-component, low modulus, automatic adhesive thermal interface filling material (TIM) with a thermal conductivity coefficient of up to 3.5 W/m · K. It is widely used in fields such as automotive electronics, communication equipment, and high-performance computing platforms. [Product Features] Performance indicators TCMP 1935Thermal conductivity 3.5 W/m · KModerate viscosity (after mixing), suitable for automatic dispensing and scrapingModulus (after curing) low stress, flexible contact solder joint protectionthermal conductivity efficiency Extremely low thermal resistance, far superior to ordinary silicone grease or thermal pads in terms of Curing method Available at room temperature or heating, supporting flexible manufacturing processesPackaging form: two-component A/B adhesive, suitable for static/dynamic mixed feeding systemsRemovable for rework, does not contaminate the substrate, supports repeated maintenanceApplication advantages and customer value

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