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Industry Application

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SIPA 1830(H50) Vehicle Display Frame Bonding Solution

2026-01-27

— Effectively addressing the challenges of debonding and light leakage With the rapid development of smart cockpits, in-vehicle displays are evolving towards larger sizes, narrower frames, and higher brightness. The increasingly sophisticated structure of display modules poses higher demands on frame bonding materials. Once the bonding fails, it can lead to light leakage and abnormal noise at the least, and debonding and reliability failure at the most, directly affecting the overall quality of the vehicle. Common challenges in the display bonding industry: In the bonding of in-vehicle display frames, manufacturers generally face the following issues: The alternating temperature changes cause a significant temperature difference in the interior environment of the degumming vehicle, and ordinary glue is prone to stress concentration due to thermal expansion and contraction. The adhesive layer hardens, resulting in insufficient flexibility of the light-leaking colloid, which cannot absorb structural deformations, leading to changes in the frame gap.The pollution caused by the by-products of curing manifests as white mist volatilizing during the curing of glue in certain display areas, affecting the optical display effect.The long-term aging reliability is insufficient, and there is a significant performance degradation under high temperature, high humidity, and electrical environments.Recommended solution: SIPA 1835 (H50) RTV SIPA 1830A/B two-component addition-type silicone adhesive SIPA 1835 (H50) is based on the RTV SIPA 1830A/B two-component addition-type silicone system, specifically designed for bonding automotive electronics and display structures. It ensures high bonding strength while providing long-term stable elastic cushioning capability. This product can be cured at room temperature and also supports rapid curing through heating, making it suitable for automated production lines. During the curing process, no by-products are volatilized, and the volume change is minimal, making it extremely friendly to precision display modules. The core product features a two-component addition-type system (1:1 mixture) with simple metering and…

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Amid the wave of miniaturization of photonic integrated circuits (PICs), encapsulation adhesives are emerging as a key bottleneck for breakthrough

2026-01-27

Researchers at Columbia University have recently made a breakthrough in the field of optoelectronics, successfully fabricating the smallest integrated photonic circuit to date and achieving high-performance stable operation over a wide wavelength range for the first time. Researchers liken this achievement to replacing vacuum tubes with semiconductor transistors, with potential impacts significant enough to reshape optical communication and optical signal processing systems. However, as PIC continues to evolve towards smaller sizes, higher integration, and more complex functions, a key aspect that has long been underestimated but determines system reliability is gradually emerging: Packaging and bonding materials for photonic integrated circuits. In actual mass production, the challenges faced by PIC packaging mainly focus on the following aspects: Mode Field Matching (模场匹配) sub-micron high-precision alignment and assembly technology for high-speed, repeatable automated packaging processes, which can reliably operate under harsh conditions such as high temperature, high humidity, and reflow soldering, has a very high cost proportion. According to the report “Photonics Packaging 2023” by Yole Développement In photonic integrated systems, over 70% of the overall cost comes from packaging and assembly processes This means that packaging materials, especially adhesives, are no longer “auxiliary materials” but rather system-level key materials. II. Why are adhesives for PIC packaging so demanding?In the PIC package, the adhesive plays multiple roles simultaneously: 1️⃣ Mechanical fixation + optical stabilization: Wafers, chips, optical fibers, lenses, and waveguide arrays require long-term submicron-level positional stability. The shrinkage rate, modulus, and stress release capability of the adhesive directly affect the optical coupling efficiency. 2️⃣ Thermal-moisture-stress multiphysics coupling: Reflow soldering, high-temperature storage (HTS), and high-humidity high-temperature (HAST) conditions can lead to optical path drift or failure due to material water absorption and CTE mismatch. 3️⃣ Process window determines mass production yield: UV/thermal curing speed, dispensing fluidity, thixotropy, dimensional stability and consistency after curing….

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LED adhesive application solution

2026-01-27

— From potting to optics, from sealing to thermal conductivity, one set of adhesive solves the reliability issues of LEDs. In LED lighting and display applications, brightness, lifespan, and stability are never determined by a single factor. Temperature rise, moisture, mechanical stress, and optical attenuation are often the key factors determining how long and stably an LED can illuminate. Behind these issues, the selection and matching of adhesives are becoming an indispensable part of LED reliability design. Focusing on the core application scenarios of LEDs, ELAPLUS provides a complete and mature LED adhesive application solution 👇 I. LED encapsulation protection – SIPC 1816 creates a long-term stable “protective layer” for the internal circuit of LEDs. In structures such as LED driver power supplies, modules, and light bars, internal components are exposed to high temperatures, humidity, and electrical stress for extended periods, making them highly susceptible to issues such as insulation degradation and solder joint failure. LED encapsulation LED encapsulation SIPC 1816 silicone encapsulant, specifically designed for LED electronic encapsulation: Application value: The overall protection provided to PCBs and electronic components significantly enhances the moisture resistance, dust resistance, and insulation performance of the LED system. It also cushions the mechanical stress caused by thermal expansion and contraction, reducing the risk of cracking. Core advantages: Low stress and low shrinkage, suitable for precise LED electronic structures with good fluidity, no dead spaces in potting, minimal bubbles, long-term resistance to high and low temperatures, suitable for outdoor and high-power LED applications. 📌 Typical applications: LED driver power supplies, LED modules, power control board potting II. LED Optical Packaging – SIPA 1840 High Transparency, Only Deserving of High-Brightness LED Displays. In the LED optical structure, the encapsulant is not only a “fixing material”, but also a part of the optical system.Insufficient light transmittance, yellowing,…

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Elaplus Conformal Coating for Key Applications in BMS

2026-01-27

— A range of silicone conformal coatings, comprehensively enhancing the reliability and safety level of BMS. With the rapid development of new energy vehicles, energy storage systems, and high-end industrial equipment, BMS (Battery Management System) is operating in complex environments such as high humidity, high temperature, salt spray, dust, and electrochemical corrosion for extended periods.Once the PCB board becomes damp, experiences creepage, or is corroded, it will directly affect the safety and lifespan of the battery system. Therefore, three-proofing coating (moisture-proof, mold-proof, and salt spray-proof) has become a standard process for BMS electronic protection. Silicone three-proofing coating, with its excellent flexibility, electrical insulation, and environmental adaptability, has become the mainstream material choice for BMS coating. Analysis of core requirements for BMS three-proofing coating In BMS applications, three-proofing coating materials typically need to meet the following requirements simultaneously: Excellent moisture resistance, salt spray resistance, and chemical corrosion resistance Long-term stable electrical insulation performance Resistance to thermal shock, avoiding coating cracking caused by thermal expansion and contraction Fast surface drying, improving production line efficiency Compliance with UL flame retardant and environmental regulations Reworkability, facilitating maintenance and quality control For different BMS structural designs and process requirements, the following various silicone conformal coatings can provide differentiated solutions. Recommended product and detailed explanation of application advantages 1️⃣ Coating 9062 silicone conformal coating adhesive Basic selection of high reliability protection for BMS A single-component, low-viscosity, environmentally friendly formula with excellent workability, complies with RoHS requirements and forms a dense, flexible protective film, effectively isolating water vapor and corrosive media. Applicable scenarios: PCB areas with high protection requirements and relatively compact structures, such as BMS control boards, sampling boards, and equalization circuits. View Coating 9060 details 2️⃣ SIPC 1823 silicone conformal coating adhesive quick-drying BMS production line efficiency solution The single-component silicone adhesive has a low…

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Thermal conductive potting solution for industrial controllers

2026-01-15

—— A reliable and removable protective option after curing. In applications such as industrial automation, smart manufacturing, and energy control, industrial controllers operate in environments with high loads, high temperature rises, strong vibrations, and complex conditions for extended periods.The key challenge in the potting design of industrial controllers lies in balancing efficient heat dissipation with the removability for future maintenance, repair, and upgrades. Addressing this industry pain point, ELAPLUS has launched SIPA 1850, a low-stress, removable thermal conductive potting adhesive, providing a more reliable and flexible potting solution for industrial controllers. ❌ Non-detachable after curing, making repair essentially equivalent to scrapping ❌ High internal thermal stress, prone to cracking of solder joints and components ❌ Decreased reliability after thermal cycling ❌ Not conducive to product upgrades and rework. Modern industrial controllers, however, place higher demands on potting materials: ✔ Possesses stable thermal conductivity, reducing the operating temperature of the device ✔ After potting, exhibits good moisture resistance, vibration resistance, and electrical insulation properties ✔ After curing, is removable and repairable, enhancing the overall lifecycle value of the device II. Solution Recommendation: SIPA 1850 Thermal Conductive Potting Compound Product Positioning SIPA 1850 is a low-stress, self-adhesive, silicone thermal conductive potting compound specifically designed for electronic control systems that require heat dissipation and maintainability. III. Core Advantages of SIPA 1850 1️⃣ Efficient Heat Conduction and Stable Heat Dissipation: The thermal conductivity is stable and fast, effectively conducting the heat generated by power devices (MOS, IGBT, power modules, etc.) to the housing. This significantly reduces the temperature of hot spots inside the controller, enhancing system stability. 👉 It is particularly suitable for industrial control modules with high power density 2️⃣ Low-stress curing: After curing, the silicone elastomer system, which protects sensitive devices, maintains good flexibility and toughness, effectively absorbing thermal expansion and contraction…

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Resistor High-Temperature Potting Solution | SIPC 1813 Silicone Sealant

2026-01-15

In applications such as high-power resistors, braking resistors, and power load resistors, SIPC 1813 silicone adhesive sealant is exposed to harsh environments characterized by long-term exposure to high temperatures, high power, thermal cycling, and vibration.The potting material should not only be able to “wrap up” the components, but also not affect the long-term stable operation of the resistor. Application Challenges 🔥 High long-term temperature tolerance requirements: -60 to 250°C Repeated environmental impacts ⚡ High power stability requirements under high temperatures to avoid resistance drift due to stress concentration 🔩 Reliable bonding with substrates such as ceramics, metals, and pins 🌧️ In outdoor or industrial environments, moisture resistance, stain resistance, and anti-aging are required. Recommended product: SIPC 1813 SIPC 1813 is a neutral, semi-flowable RTV silicone adhesive sealant that cures by absorbing moisture at room temperature. It is specifically designed for the long-term stable operation of electronic devices in high-temperature and vibrating environments. Key Performance Advantages✅ – Long-term stability in a wide temperature range of -60 to 260°C, meeting the continuous operation requirements of high-power resistors✅ Excellent adhesion, good compatibility with substrates such as ceramics, resistor coatings, and metal pins✅ Elastic adhesive layer design, effectively relieving thermal stress and avoiding device cracking or resistance drift✅ Resistant to chemicals, moisture, and corona, ensuring long-term reliable electrical performance✅ Resistant to vibration and thermal shock, suitable for industrial, power electronics, and rail transit applications✅ Excellent outdoor aging performance, with a design lifespan of up to 20–30 years✅ ROHS / HF / REACH compliant, environmentally friendly and suitable for mass applicationsTypical Application Scenarios🔹 Power resistor and brake resistor potting🔹 Local sealing of high-temperature electronic modules🔹 Protection of industrial power supplies and power electronics devicesSIPC 1813 is not just “potting”, but also provides a long-term stable safety buffer layer for resistors in high-temperature and high-power environments….

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PCB waterproof potting solution for new energy vehicle charging gun

2026-01-15

With the rapid popularization of new energy vehicles, charging guns, as external connection components that are used frequently, are exposed to rain, moisture, temperature changes, and complex outdoor conditions for extended periods. Their internal PCB boards not only carry out signal transmission and current control functions but also directly affect the safety, stability, and service life of the entire gun.Once the PCB protection is not in place, it is extremely prone to: The intrusion of moisture leads to electrical leakage and short circuits. Humid environments cause a decline in insulation performance. Temperature cycling results in stress concentration and solder joint failure. Therefore, higher requirements are placed on the potting materials inside PCBs.Key Challenges High waterproof grade requirements: Long-term stability to achieve IP67 moisture resistance + reliable electrical insulation performance Possess a certain adhesive strength with PC housing and wiring harness to prevent vibration and loosening Process-friendly: Manual potting is less prone to bubbling, with feasible rework No stress, cracking, or corrosion during long-term use Main recommended solution for electronic components: SIPC 1815 silicone potting adhesive SIPC 1815 is a two-component condensation de-alcoholized silicone potting adhesive, specifically designed for applications such as new energy vehicle charging guns and outdoor electronic modules.Product advantages:✔ Excellent waterproof performance, easily meeting IP67 requirements ✔ Good fluidity, easy to spread and spread without entraining bubbles when manually pouring glue ✔ Repairable design, reducing maintenance and after-sales costs ✔ Low curing shrinkage rate, no corrosion, no internal stress, protecting PCB and solder joints ✔ Stable high-temperature electrical insulation performance, adapting to temperature rise environment during charging process ✔ Good adhesion to PC housing and wiring harness, taking into account both sealing and structural fixation ✔ Waterproof, moisture-proof, and high reliability for long-term use View SIPC 1815 details 👉 Especially suitable for charging gun products with high requirements…

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Industrial wiring harness bonding solution | PUR 1601 two-component polyurethane structural adhesive

2026-01-08

In the fields of industrial equipment, automotive electronics, automation equipment, etc., wire harness systems not only undertake signal and power transmission functions, but also need to face complex usage environments: PVC wire harness bonding and fixation 🔧 Vibration and impact are frequent, demanding high toughness and fatigue life for the bonding structure 🌡️ Temperature changes and aging issues are prominent, with ordinary adhesives prone to embrittlement and cracking 🧪 In oily and chemical environments, bonding materials are required to have good chemical resistance 🤖 Assembly methods are diverse, satisfying both automated dispensing and the flexibility of manual assembly 🌱 Environmental regulations are becoming stricter, with low odor and low VOC becoming rigid requirements Therefore, wire harness bonding materials must not only be “firmly bonded” but also long-term reliable, process-friendly, and environmentally compliant.Application: Recommended product for structural bonding of industrial wiring harnesses: PUR 1601, a two-component polyurethane structural adhesive PUR 1601 A/B is a two-component, solvent-free, room temperature curing polyurethane adhesive specifically designed for bonding industrial wiring harnesses and multi-substrate structures, achieving an ideal balance between strength, flexibility, and durability.The core advantages of PVC wire harness bonding and fixing products include low VOC and low odor, compliance with RoHS/REACH regulations, and adaptability to various application scenarios with strict environmental and operational requirements. The process is highly adaptable, allowing for both automated machine dispensing and manual mixing operations to meet different production line needs. It exhibits strong adhesion to multiple substrates, including metals, plastics, rubbers, and polyesters. High toughness and elasticity effectively absorb vibration and stress, enhancing the long-term reliability of the wire harness system. Resistant to aging and chemicals, it is suitable for complex industrial environments such as oil contamination and chemical media. Typical application scenarios include industrial equipment wire harness fixing and sealing, automotive and new energy wire harness structure…

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Semiconductor ECU thermal management solution

2026-01-08

— Liquid thermal conductive gel pad TCMP 1935 boosts the high-reliability electronic system industry. Background and challenges With the high integration of automotive electronics and the continuous increase in power density, the heat generated by semiconductor ECU (Electronic Control Unit) during operation rapidly increases. In practical applications, ECU thermal management often faces the following challenges:🔥 Severe local heat concentration: There are assembly tolerances between the chip, power module, and heat sink, making it difficult for traditional thermal pads to fully fit. ⚠️ High mechanical stress risk: High-hardness materials are prone to stress damage to solder joints and chips during compression. 🛠️ Difficult and costly rework: Once assembled, traditional thermal pads are complex to rework and repair, affecting yield. 🤖 Inadequate automation adaptation: Solid materials are not conducive to high-speed, fully automated production line applications. Against this backdrop, liquid thermal gel pads are gradually becoming the mainstream choice for thermal management in the new generation of ECUs. Application scheme: Recommended product for thermal gap filling: TCMP 1935 liquid thermal gel gasketTCMP 1935 is a two-component liquid thermal gel gasket specifically designed for high-reliability applications such as semiconductor ECUs, automotive electronics, battery systems, and communication equipment. With a thermal conductivity of up to 3.5 W/mK, it achieves an excellent balance between thermal performance and reliability. Product Core Advantages 🌡️ Highly Efficient Heat Conduction, Stable and Reliable Thermal Conductivity Coefficient 3.5 W/mK Effectively fills the tiny gaps between devices and heat dissipation structures Significantly reduces junction temperature and enhances the long-term operational stability of ECUs 🧩 High Adaptability, Eliminates Assembly Tolerances Liquid form allows for full flow, self-adapts to complex surfaces Achieves good contact with almost no compression force required Effectively protects solder joints, chips, and precision electronic components 🧘 Low Stress Design, Cares for Sensitive Devices Thixotropic system, low stress application Low…

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