Science Popularization of Thermal Conductive Epoxy Structural Adhesive | Principles, Characteristics, and Engineering Application System Analysis

01 | What is thermal conductive epoxy structural adhesive?Thermally Conductive Epoxy Structural Adhesive is a high-performance adhesive material that uses epoxy resin as the matrix, adds high thermal conductivity fillers, and forms a dense three-dimensional network structure through crosslinking reactions with curing agents. Its material essentially consists of three types of properties: ① Structural StrengthHigh shear strength, high peel strengthAnti impact, anti vibration, anti fatigueDimensional stability for long-term serviceIt can replace traditional mechanical fixing methods such as screwing, riveting, and welding.② Thermal ConductivityThermal conductive fillers (such as Al ₂ O3, BN, AlN) form a continuous thermal conduction chain during the curing process, giving the material significantly higher thermal conductivity than ordinary epoxy.This function is used for heat transfer of heating components and reduction of interface thermal resistance.③ Epoxy system functionality (Chemical&Environmental Stability)The epoxy matrix forms a stable three-dimensional structure through cross-linking and curing, with:Good temperature resistanceExcellent electrical insulation capabilityResistant to media, moisture and heat, and aging performanceMake it suitable for long-term complex environments.02 | Curing mechanism and interface bonding principleThermal conductive epoxy structural adhesives often use two-component A/B formulations.The standard mixing ratio of Yilian EP 2010A/B high thermal conductivity epoxy structural adhesive is 100:50 (weight ratio).The curing mechanism includes:① Epoxy ring opening and crosslinking reactionThe mixed epoxy group and curing agent undergo ring opening polymerization, and the system changes from liquid to gel to solid, finally forming a high modulus three-dimensional cross-linking structure.② Construction of Thermal Conductive NetworkHigh thermal conductivity fillers form a continuous heat transfer chain during the solidification process of the system, enabling the solidified body to effectively transfer heat outward.③ Surface interface chemical bondingEpoxy has high polarity and is compatible with metals, ceramics SMC、 Chemical bonding or polar adsorption is formed between composite materials and other substrates to improve interfacial stability.03 | EP 2010A/B: Representative of Typical…

How to choose the adhesive for fixing the motor coil? An article takes you to understand the core principles and adhesive solutions

With the rapid development of industries such as electric tools, home appliances, electric vehicles, drones, etc., motors are constantly upgrading with the goal of smaller size, higher efficiency, and stronger reliability. Inside a motor, the Motor Coil Fixing Adhesive, although inconspicuous, is a key material that affects the lifespan, stability, and safety of the motor. Today, we will start from a popular science perspective and explain in an article:Why do motor coils have to use adhesive?What are the common types of motor adhesives?How to choose the one that suits your motor?What is the latest trend in adhesive usage in the industry?1、 Why do motor coils need to be fixed and bonded?In environments with high-speed rotation, high temperature, and high vibration, motor coils will face: Strong vibration impactOnce the coil becomes loose, it can cause noise, unstable magnetic field, decreased efficiency, and even lead to short circuits.

Plastic bonding solution for electronic components – PUR 1672 A/B&PUR 1635 high-performance polyurethane materials

In electronic assembly and structural bonding, stable connections between plastics have always been a challenge that engineers cannot avoid, especially for ABS and PC materials. There is a significant difference in the physical properties between the two materials. Traditional adhesives either cannot stick firmly or are too brittle and prone to aging after curing, making it more difficult to maintain long-term reliability under complex working conditions. In order to meet the needs of new generation electronic devices for waterproofing, moisture resistance, earthquake resistance, electrical insulation, and reliable bonding, Yilian has launched two professional grade polyurethane materials – PUR 1672 A/B and PUR 1635, which are suitable for bonding, sealing, and potting applications of plastic shells such as ABS and PC. They are widely used in communication equipment, power modules, sensors, controllers, and other fields.Automotive parts ABS and PC bondingAutomotive parts ABS and PC bonding01 | PUR 1672 A/B: Flexible Polyurethane Adhesive+Sealing and Sealing Integrated SolutionPUR 1672 A/B belongs to two-component solvent-free resin elastomers, which have high fluidity, low hardness, deep curing ability, and excellent adhesion, especially suitable for adhesive sealing and electronic potting of plastic parts such as ABS and PC. Core advantages and highlights:

What adhesive is used for bonding electronic component shells? ——PUR 1680 (D70) A/B polyurethane sealant professional solution

Against the backdrop of the continuous development of electronic products towards lightweight, high reliability, and extreme environmental resistance, shell bonding and internal encapsulation have become key factors affecting the stability of electronic devices. Whether it is communication equipment, sensors, control power supplies, or ignition controllers, internal components all face challenges such as humidity, vibration, temperature shock, electrical interference, and outdoor exposure. In order to enhance the overall assembly strength and protect internal components, Yilian has launched PUR 1680 (D70) A/B high hardness polyurethane sealant, specifically designed for bonding and sealing electronic component housings.1、 Core advantages of PUR 1680 (D70) A/B polyurethane sealant

Solution for wiring harness board sealing with adhesive | SIPA 1850 gray two-component addition molding silicone

In the continuous upgrading of new energy vehicles, energy storage equipment, and intelligent manufacturing equipment, the stability of the wire harness PCB directly determines whether the system can operate stably in complex environments such as high temperature, vibration, and humidity for a long time. In order to ensure the weather resistance and reliability of the wiring harness board, the encapsulation process has become an indispensable part. Adhesive for wiring harness board sealing In the face of changing application environments, engineers often make the following requirements for sealant:✔ Having certain thermal conductivity to avoid heat accumulation affecting the lifespan of electronic components✔ The adhesive strength does not need to be too high, but it should maintain flexibility and fatigue resistance✔ Two component addition molding silicone system, combining low stress and high reliability✔ Fast curing speed, improving production line efficiencyIf you are looking for a material that meets the above requirements – SIPA 1850 gray is worth paying close attention to.Recommended product: SIPA 1850 gray thermal conductive sealantSIPA 1850A/B is a two-component addition molding silicone sealant designed specifically for electronic modules, high-temperature devices, and wiring harness boards. Its 1:1 mixing ratio, excellent fluidity, and good thermal stability make it highly suitable for convenient and efficient sealing processes.🔹 Core FeaturesTwo component addition molding silicone system, uniform curing, no shrinkage1: 1 ratio, automatic mixing machine and manual operation are both very convenientLow hardening shrinkage rate to avoid damage to solder joints or components under stressExcellent high-temperature electrical insulation ensures long-term stability of the wiring harness boardGood thermal conductivity, meeting general heat dissipation needsStrong waterproof and moisture-proof performance, improving the reliability of the whole machineFlame retardant rating UL 94 V-0, meets automotive electronic safety regulationsStrong deep curing ability, suitable for large volume sealingCompliant with ROHS/SVHC REACH environmental regulationsView SIPA 1850 detailsTypical application areasSIPA 1850 gray…

Micro switch waterproof sealing solution | PUR 1680 polyurethane foam adhesive

Micro switches are widely used in precision electronic components such as automotive electronics, smart home appliances, industrial control, etc. due to their small size, sensitive triggering, and high reliability. However, due to its compact internal structure and sensitive electrical contacts, it is prone to switch failure, contact oxidation, and sensitivity reduction in humid, vibrating, or chemical environments. Therefore, waterproof sealing protection has become a key link to ensure the long-term stable operation of micro switches. Application challenge: PP shell+long-term sealing, failure to stick firmly is ineffective protectionThe housing of micro switches is often made of PP (polypropylene) material, which has low surface energy and strong inertness. Even after plasma treatment, many adhesives still exist:✅ Insufficient adhesion, cracking occurs under slight stress✅ After solidification, it becomes hard and brittle, and after fatigue aging, it peels off✅ The waterproof layer is discontinuous and cannot form a sealed structureAt present, some factories use Weifu 500 adhesive, but there is still a risk of bonding fatigue and sealing degradation under long-term humidity and external forces.Therefore, it is crucial to choose a highly reliable adhesive that can tightly bond with plasma treated PP and has a flexible sealing effect.Recommended product: PUR 1680 Micro Switch Special Waterproof Sealing AdhesivePUR 1680 is a single component moisture curing polyurethane reactive adhesive, particularly suitable for bonding low surface energy materials such as PP, PE, TPE, and sealing and packaging electronic devices.Core strengthsPerformance Characteristics and Advantages ExplanationAfter plasma treatment, PP has high adhesive strength and is firmly bonded without breaking or delaminationExcellent waterproof sealing performance can effectively block the infiltration of moisture, dust, and oil stainsAfter curing, the flexibility does not crack due to vibration or fallingEasy to operate, dispensing friendly, can be automated or manually applied, suitable for large-scale productionStrong temperature resistance and environmental adaptability, maintaining stable performance in…

Micro switch waterproof sealing solution: Elaplus high reliability epoxy sealing adhesive helps stabilize and protect

Waterproof Adhesive Solution for Automotive Lights – SIPC 1859 Organic Silicon

In the automotive industry, waterproof bonding of car lights is an important part of ensuring long-term stability of lighting fixtures. Optical components such as headlights, taillights, and daytime running lights are prone to problems such as water leakage, delamination, or PC material aging in harsh environments such as high temperature, humidity, and ultraviolet radiation if they lack effective waterproof bonding protection. Elapluus car lamp waterproof bondingCore requirements for waterproof bonding of car lightsWhen carrying out waterproof bonding of car lights, the following key performance should be paid attention to:Efficient bonding of PC materials: Car lamp covers are mostly made of polycarbonate (PC) material, and the adhesive needs to ensure long-lasting and strong adhesion.Non flowing and de methanol: During the construction process, the colloid does not flow, and solidification does not release methanol, ensuring the safety of optical transparent parts and internal components.Aging resistance and corrosion resistance: Car lights must withstand environmental tests such as temperature differences, humidity, rain, and ultraviolet rays during long-term use. The adhesive should be anti-aging and not corrode the PC material.Recommended product: SIPC 1859 silicone adhesive sealantSIPC 1859 is a high-performance single component silicone adhesive sealant designed specifically for waterproof bonding of car lightsExcellent PC adhesion: Directly bond PC lampshades without the need for primer, ensuring long-lasting stability.Black, non flowing: easy to construct, neat and beautiful glue line.Methanol removal environmentally friendly formula: does not release methanol during the curing process, protecting optical components and internal circuits.Aging resistance and corrosion resistance: The adhesive strength is maintained during high temperature, humid heat, UV and other aging tests without damaging the PC substrate.Dual function of waterproof sealing: achieving dual protection of adhesion and waterproof sealing, effectively extending the service life of car lights.Application scenarios SIPC 1859 is widely used for waterproof bonding of various automotive lighting fixtures:Front headlight assembly:…

Silicon gel for pressure sensor potting – high viscosity, high reliability and high protection

In the packaging protection of pressure sensors, the fluidity, viscosity, and stress release ability of the sealing adhesive often determine the long-term stability and reliability of the sensor. Especially in the face of complex environmental conditions (high humidity, high temperature, mechanical vibration), it is particularly important to select a suitable silicon gel. Today, we recommend a high-performance potting material SIGEL 1805 two-component addition molding silicon gel specially designed for pressure sensors, MEMS chips and precision circuit modules. Load cell gel encapsulation Load cell gel encapsulation1、 Product Features Highlights✅ Soft and elastic, excellent cushioningAfter curing, it forms a soft elastic body that can release mechanical stress under thermal cycling and vibration conditions, protecting the chip and leads from damage.✅ Excellent electrical insulation and protection performanceAfter curing, it has extremely low oil leakage and excellent dielectric properties, which can effectively isolate moisture and corrosive media, providing stable insulation protection for high-voltage circuits.✅ Outstanding aging resistance and weather resistanceLong term exposure to high temperature, high humidity, ozone, and ultraviolet environments results in stable performance, making it suitable for outdoor or automotive electronic sensor applications.✅ 1: 1-ratio additive curing systemEasy to mix, no by-products, low shrinkage rate, mild curing process, can be cured at room temperature or by heating, compatible with automatic glue filling production lines.2、 Typical application scenarios🔸 Pressure sensor encapsulation: used for overall protection of silicon-based chips and circuit board areas, preventing moisture intrusion and mechanical stress damage.🔸 Differential pressure/air pressure sensor packaging: Provides flexible buffering in the packaging cavity to ensure measurement sensitivity and long-term stability.🔸 MEMS、 Micro sensor module: provides stress relief and protective barriers for sensitive components.🔸 Automotive electronic module: suitable for high temperature and high humidity working conditions such as wheel speed sensors and intake pressure sensors. Application case of gel potting4、 Analysis of Technical AdvantagesLeak proof design:…