High performance liquid thermal conductive gel gasket TCMP 1935– a new generation solution for automotive ECU thermal management
Industry Challenge: Thermal Management, Hidden Killer of Automotive ElectronicsWith the continuous evolution of new energy vehicles, autonomous driving, and intelligent cockpit technologies, automotive electronic systems are highly integrated, ECU、IGBT、MCU、 The continuous improvement of power density of core components such as motor controllers has put forward more stringent requirements for the performance of thermal management materials: ❌ Traditional thermal pads have a large thickness and high compressive stress, which can easily lead to fatigue failure of solder joints❌ Thermal paste is prone to long-term drying, cracking, and loss, with poor reliability and difficulty in repair❌ The application of thermal conductive gel is complex, and it is difficult to give consideration to both fluidity and positioning accuracy❌ In high-end manufacturing, manual patching and dispensing have low efficiency and do not meet automation requirements[Solution: TCMP 1935 Liquid Thermal Conductive gel]In response to the pain points of industrial thermal management, we launched a new product: TCMP 1935 Liquid Thermal Conductive gel. This is a two-component, low modulus, automatic adhesive thermal interface filling material (TIM) with a thermal conductivity coefficient of up to 3.5 W/m · K. It is widely used in fields such as automotive electronics, communication equipment, and high-performance computing platforms. [Product Features] Performance indicators TCMP 1935Thermal conductivity 3.5 W/m · KModerate viscosity (after mixing), suitable for automatic dispensing and scrapingModulus (after curing) low stress, flexible contact solder joint protectionthermal conductivity efficiency Extremely low thermal resistance, far superior to ordinary silicone grease or thermal pads in terms of Curing method Available at room temperature or heating, supporting flexible manufacturing processesPackaging form: two-component A/B adhesive, suitable for static/dynamic mixed feeding systemsRemovable for rework, does not contaminate the substrate, supports repeated maintenanceApplication advantages and customer value
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