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Industry Application

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Conformal Coating or Potting for Embodied Robot Controller PCBs: Zoned Protection Selection

2026-11-12

For embodied robot controller PCBs, neither full‑board potting nor blanket thin coating is universally suitable. Open board areas, connector peripheries and high‑voltage sensitive zones shall be zoned first. The protection method is then selected against moisture, condensation, vibration, thermal cycling and serviceability requirements. ELAPLUS SIPC UV 3301 may be evaluated as a candidate conformal coating for PCB surfaces requiring UV/moisture dual‑cure. For stress‑sensitive local components such as pressure sensors, ELAPLUS SIGEL 1806, a low‑hardness, low‑stress two‑part silicone gel, is a candidate option. Final zoning boundaries must be validated with actual hardware, process and environmental qualification. Map Protection Requirements by Controller Location Controllers mounted near the robot torso, joints and end effectors face distinct operating conditions. Modules close to joints must withstand vibration and harness pulling; those adjacent to enclosures or air ducts are exposed to condensate, dust and residual cleaning agents. For sensors, extra stress induced by cure shrinkage or high modulus must be avoided. Define the PCBA placement, connector orientation, heat sinks, no‑coat zones and rework workflow before specifying protection materials, so the chosen adhesive does not become a bottleneck for manufacturing or repair. Work Division between Conformal Coating and Local Gel Encapsulation Location / Objective Preferred Approach Candidate Grade Core Validation Items Open PCB surfaces requiring thin‑film protection Selective conformal coating with defined no‑coat zones SIPC UV 3301, UV/moisture dual‑cure silicone conformal coating for PCBs Masking boundary, shadow‑zone cure, coating continuity, reworkability Locally mounted pressure / position sensors sensitive to external force Low‑stress local encapsulation or overmoulding SIGEL 1806 two‑component silicone gel Mix ratio, cure profile, signal baseline drift after cycling Standalone controller cavities or highly vibration‑prone edges Evaluate whether full potting is truly necessary Qualified separately by cavity geometry, thermal design and rework rules Fill integrity, exotherm, added mass, rework and functional testing Note: SIPC UV 3301…

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Thermal Interface between AI Server Chips and Heat Sinks: Selection of Thermal Grease and Gel

2026-11-12

When specifying material between the integrated heat spreader (IHS) of GPUs and CPUs in AI servers and cold plates or heat sinks, thermal conductivity alone shall not be the primary selection criterion. ELAPLUS SIGR 2250 thermal grease may be considered for flat mating surfaces requiring a thin interface under consistent screw‑driven clamping pressure; its published thermal conductivity is 5.1 W/m·K, with microprocessors listed among typical applications. For assemblies prone to warpage, variable gaps, or where automated dispensing and shot‑volume control are preferred, ELAPLUS TCMP 3365 one‑component post‑cure thermal gel can be evaluated against the actual mechanical design. Its published thermal conductivity reaches 6.2 W/m·K with a minimum controllable bond‑line thickness (BLT) of 100 μm. Final material selection must be validated through stack dimensions, assembly pressure and system temperature‑rise testing. Identify the Target Thermal Interface First Inside an AI server, the typical thermal path runs from the package IHS, through the thermal interface material, to a vapour chamber or cold plate, then onward to the heat sink, air duct or liquid cooling loop. This article addresses only the interface between the chip IHS and its adjacent cooling component; the TIM itself is not a substitute for the heat sink. GPUs, CPUs, switch chips and power modules differ in heat flux, clamping scheme and serviceability, even within the same server platform, and may therefore require distinct thermal solutions. Four sets of baseline data should be collected before thermal modelling: contact area and flatness, minimum and maximum assembly gap, clamping force plus tolerance, and intended rework strategy. Preliminary Screening: Grease vs Thermal Gel Construction / Operating Condition Key Evaluation Focus Candidate Grade Validation Boundaries Flat IHS‑to‑cold‑plate interface, thin bond line, stable screw clamping Fill micro‑voids and control excessive squeeze‑out SIGR 2250 thermal grease Shot volume, coverage after compression, interface integrity after thermal cycling…

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Thermal Interface Material for 48V BSG Modules｜TCMP 1941 Thermal Gap Filling Solution

2026-11-12

When assembly gaps exist between power devices and metal heat dissipation structures inside a 48V BSG module, ELAPLUS TCMP 1941 two‑component thermal gel may be evaluated. Key verification targets include gap compatibility, assembly pressure, transient temperature rise and vibration reliability. For 48V mild‑hybrid systems equipped with power electronic control units, the thermal interface material shall match the actual heat path; potting adhesive for motor windings shall not be used directly at the thermal interface between power devices and heat sinks. A 48V BSG generally refers to a belt‑driven starter‑generator system. Its control electronics deliver cranking assistance, power generation and energy management according to the specific architecture. Under different operating modes, power devices are subject to varying current levels, power losses and thermal loads. For designs with power electronics integrated inside a compact housing, heat transfer between heat‑generating components and metal structures is critical for thermal management. Where mating surfaces feature height offsets, local unevenness or intentional assembly gaps, a suitable thermal interface material shall be selected according to the construction. 1. Why Thermal Gap Filling Is Required for 48V BSG Modules Although the operating voltage of a 48V BSG system is lower than that of conventional high‑voltage powertrain drives, its power electronics can still generate substantial heat loss under large currents and fast load transients. Thermal requirements therefore cannot be underestimated merely because of the 48V voltage class. In certain controller designs, MOSFETs and other power devices dissipate heat through their packages, thermal substrates and metal housings. If a designed gap separates the heat source from the heat dissipation hardware, air alone will often fail to meet specified thermal targets. Thermal gap filler improves interfacial contact and creates a compliant heat transfer path within design limits. It is not intended to serve as the primary mechanical fastener, nor can it…

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Adhesive for Solder Joint Reinforcement in Camera Modules｜UV 1018 Dispensing and Light‑Shield Zone Validation

2026-11-12

ELAPLUS UV 1018, a one‑component UV‑curable adhesive, may be evaluated for local solder joint fixation on camera modules. It is suitable for dispensing at locations accessible to curing light, where adhesive can be kept away from restricted zones such as lenses and connectors. If brackets or flexible cables block light entirely, adjust the light path or assembly sequence first, then verify through mass‑production hardware whether full cure is achieved at the bottom of the dot and whether module functionality remains intact. Selection Consideration Validation during Prototyping Can light reach the entire adhesive dot? Check for obstruction by brackets and flex cables following the actual assembly sequence; focus on cure at the dot base Is the dispensed volume appropriate? Confirm solder joint coverage, adhesive boundary and closing clearance; check for overflow into restricted zones Will dispensing impair module performance? Compare connection stability and imaging before and after dispensing; retest following environmental qualification Permissible Dispensing Zones Mark designated solder joint reinforcement points on assembly drawings, together with no‑adhesive areas including lenses, photosensitive surfaces, connector contact regions and moving components. Verify access for dispensing needles and light sources against the physical assembly sequence. ELAPLUS lists UV 1018 as a candidate one‑component UV adhesive for solder joint fixation in camera modules for eligible designs. Post‑Cure Checks beyond Surface Skinning Inspect the base of adhesive dots, edges obscured by components and thicker cross‑sections. Record irradiation distance, angle, shot volume and actual equipment parameters during prototyping. Set up tests in accordance with the product datasheet, and confirm cure level against supplier guidelines and internal process specifications. If permanent obstruction remains after assembly, evaluate whether the assembly sequence or light path can be revised; otherwise, reassess alternative curing chemistries for that construction. Module Acceptance Criteria Compare paired samples from the same batch before dispensing, after dispensing and…

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Thermal Grease Bleeding after Opening? Re‑Inspection and Material Selection for SIGR 2235

2026-11-12

If thermal grease shows obvious free oil, paste separation or local agglomeration once opened, it is not recommended for direct use in electronic power modules without re‑qualification. It shall first be determined whether the change represents an acceptable storage drift or abnormal loss of material homogeneity. ELAPLUS SIGR 2235 thermal grease may be evaluated for thermal interfaces of IGBTs, DC/DC converters and other power devices; nevertheless, release criteria must be established with reference to material condition, application process and actual thermal performance. Thermal grease generally consists of base oil and thermally conductive fillers. It is a non‑crosslinking paste and relies on no curing reaction to form a thermal interface. Its storage condition can be affected by temperature cycling, shelf time, transit vibration and the inherent formulation. Surface gloss, local liquid exudation or uneven colour after opening do not automatically render the material invalid, nor can it be simply stirred and fed directly into mass production. The correct workflow is to confirm usability by visual inspection, homogeneity check, application performance and functional testing. 1. Why Does Thermal Grease Bleed or Separate? Conductive fillers and base oil serve distinct roles inside thermal grease: fillers build the primary thermal conduction network, while base oil facilitates filler wetting and enables the paste to spread and fill micro‑irregularities on mating surfaces. Prolonged storage or temperature fluctuation may trigger redistribution of the liquid phase, filler sedimentation or local viscosity variation. Formulations differ in sensitivity to these factors, so the state of one grease grade cannot be adopted as the acceptance standard for all products. A faint oily sheen on top of the container with homogeneous bulk paste does not necessarily indicate failure. Visible free liquid layer, hardened sediment at the bottom or irreversible particle agglomeration, by contrast, call for close scrutiny. Additional checks shall cover package…

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OBC Housing Leakage during Air Tightness Test? Sealing Troubleshooting with SIPA 1820 CIPG

2026-11-12

If the on‑board charger (OBC) housing fails the air tightness test, distinguish leaks at housing joints, connectors and test fixtures first. Once the leak is localised to the flange joint, inspect the continuity of the adhesive bead, consistency of bead height after curing, and insufficient local compression after closure. For the CIPG process where the bead is cured prior to clamping and lid closure, ELAPLUS SIPA 1820 may be evaluated as a candidate for flange sealing. Final acceptance shall rely on repeated air tightness testing of the complete assembly. Leakage Symptom Priority Inspection Verification Method Recurring leaks at bead start/end across multiple units Missing adhesive, excess build‑up or stringing at overlap Compare dispensing trajectory and bead photos; adjust overlap and retest Leaks concentrated between two fasteners Flange gap, flatness and local compression Check physical gap and tightening sequence; retest after closure Passes initial test but leaks after environmental cycling Bead contact, interfacial adhesion and housing distortion Record leak points before and after testing; validate against control samples after disassembly Where Do Leaks Occur? Follow the full assembly inspection flow to separate housing seams, connectors and other sealing interfaces. If leakage originates from the housing joint, focus on bead overlap, corners, spans between screws and uneven flange areas. Map leak locations to the actual bead condition before deciding whether to modify dispensing, curing or closure parameters. Where Is SIPA 1820 Applied? Bonding between plastic housing and aluminium plate ELAPLUS recommends SIPA 1820 as a candidate CIPG sealant for OBC housings. It is a one‑component heat‑cure system. For evaluation, prepare test coupons using production‑representative housing flanges or grooves, surface treatments and mating components. Bead height, curing profile and target compression shall follow the product datasheet and assembly design respectively. How to Verify the Effectiveness of Modifications Record bead continuity, cross‑section dimensions and…

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Thermal Adhesive for Power Devices in Industrial Power Supplies｜SIPC 1928 Selection Guide

2026-11-12

ELAPLUS SIPC 1928 silicone thermal conductive adhesive sealant may be evaluated for thermal bonding and fixation of power transistors, thyristors and other heat‑generating components mounted on PCBs of industrial power supplies. Key verification targets include the component heat transfer path, mechanical positioning method, adhesive curing regime and electrical clearance. For industrial power supplies fitted with aluminium or copper heat sinks, thermal bonding adhesive can deliver auxiliary fixation and heat transfer at qualified locations, yet it shall not replace mechanical fasteners or dedicated electrical insulation structures without prior qualification. Industrial power supplies generally incorporate switching devices, rectifiers, inductors, capacitors and control PCBs. Certain power semiconductors continuously generate heat during operation, which must be dissipated to the ambient via heat sinks, metal baseplates or comparable structures. One‑component thermal silicone adhesives offer convenient processing for components requiring local retention and supplementary heat dissipation. Nevertheless, material selection depends not merely on thermal conductivity; rational adhesive placement, full cure and structural endurance against transit and operating loads must also be confirmed. 1. Why Power Components in Industrial Power Supplies Require Thermal Fixation Heat from power semiconductors inside industrial power supplies travels through the package, metallic thermal interface and heat sink. Poor interfacial contact between the component and heat dissipation hardware degrades overall thermal transfer. In selected designs, thermal bonding adhesive can locate parts, provide local retention or fill controlled gaps between devices and designated metal substrates. Components subject to high mechanical loads shall retain screws, spring clips or other robust fastening schemes. A clear distinction must be drawn between thermal structural adhesive and ordinary thermal grease. The former cures into an elastic layer with measurable bonding strength, while thermal grease functions primarily as an interface filler and cannot serve as a standalone structural fastener. If the primary thermal path of a power device relies on…

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Pin Sealant for Automotive Connectors｜Dual‑Cure Dispensing Solution with SIPC UV 3302

2026-11-12

Material selection of sealant for automotive connector pin terminals calls for simultaneous consideration of precision dispensing, fluid flowability, UV penetration, shadow‑zone curing and insulation protection after cure. For such applications, ELAPLUS SIPC UV 3302 UV/moisture dual‑cure silicone sealant is recommended for evaluation. This one‑component material features low viscosity and self‑levelling behaviour, rapid UV tack cure and progressive moisture cure, offering a material and process option for root sealing of connector pins in automotive assemblies. Rather than focusing merely on fast curing, automotive electronics manufacturing places greater emphasis on controlled ingress of adhesive into designated sealing zones, adequate cure in shadowed areas and stable interfacial bonding between the adhesive and diverse substrates. 1. Why Both Material and Process Matter for Automotive Connector Pin Sealing Within automotive electronic systems, connectors deliver power transmission, signal routing and module communication. Connectors deployed in automotive controllers, sensors and body electronics generally comprise metallic pins, plastic housings and terminal retention structures. These constituents differ substantially in thermal expansion, surface energy and mechanical properties, introducing multiple considerations for sealant selection. 2. Why SIPC UV 3302 Is Recommended for Pin Sealing ELAPLUS SIPC UV 3302 is a one‑component UV/moisture dual‑cure silicone sealant. Its primary selection value lies in combining rapid tack cure on exposed surfaces with subsequent cure in shadowed regions. The material possesses controlled flowability and cures into a soft, tough elastomer, serving as a candidate for precision sealing of automotive connectors. Needle geometry, dispensing trajectory and per‑shot volume shall be matched to the connector design. 3. Process Design for SIPC UV 3302 Dispensing on Automotive Connectors Process evaluation for pin sealing may be divided into four major stages: targeted dispensing, UV tack cure, moisture‑driven post‑cure and sample validation. Process Stage Key Operations Engineering Focus Pre‑dispensing preparation Substrate cleaning, definition of dispensing zones Surface contamination, pin plating,…

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Why Do Insulators Prone to Pollution Flashover in Rain and Fog? Start with Hydrophobicity and Surface Leakage Current

2026-11-12

High‑voltage insulators face elevated pollution flashover risk under rainy and foggy conditions. Priority shall be given to examining accumulated surface contamination, conductive behaviour upon wetting, hydrophobicity variation and local electric field distribution, rather than simply thickening the insulating coating. For substation post insulators, external insulation of transmission lines and other eligible power equipment, ELAPLUS SICOAT 9099R anti‑pollution‑flashover insulating coating may be evaluated, with focus on coating hydrophobicity, substrate adhesion, erosion resistance and adaptability for long‑term outdoor service. High‑voltage insulators achieve electrical isolation via solid insulation and creepage distance. During prolonged operation, they are subject to deposition of dust, salt and industrial contaminants. Under dry conditions, surface fouling may not trigger obvious abnormalities immediately; yet when rain, fog or condensation wets the contaminated layer, the electrical condition along the surface may alter. Accordingly, anti‑flashover design shall take into account the geometric configuration of external insulation, on‑site pollution environment and surface material performance. Insulating coating serves as one protective measure for external insulation, but it cannot substitute for structural design, operational maintenance and electrical safety assessment of the insulator itself. 1. Why Are Insulators More Vulnerable to Pollution Flashover in Rain and Fog? Salts, industrial dust and other pollutants accumulated over time on insulator surfaces may form a conductive wet layer once moistened. Under applied voltage, surface leakage current rises; heat generated by local current redistributes the water film and creates uneven dry and wet zones. Under certain conditions, local dry bands withstand high voltage and initiate dry‑band discharges. When discharges propagate along the insulating surface and meet relevant criteria, flashover occurs. Pollution flashover is governed by multiple factors, including contaminant type, deposition density, wetting severity, insulator profile, creepage distance and operating voltage. For silicone‑rubber‑based anti‑pollution‑flashover coatings, hydrophobicity restricts the formation of continuous water films. Nevertheless, satisfactory hydrophobicity does not eliminate flashover…

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