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How to Select Adhesives for Bonding Motor Magnets & Magnet Segments — Reliable Bonding Solutions for High-Speed Motors

2026-07-15

Why Do Motor Magnets/Magnet Segments Require Specialized Adhesives? In permanent magnet synchronous motors (PMSM), brushless DC motors (BLDC), servo motors and robot joint motors, magnets (magnet segments) are generally fixed onto the inner wall of rotors. As motors evolve toward higher power density, higher rotational speed and miniaturization, magnet bonding materials must deliver sufficient bonding strength while maintaining stable performance under high centrifugal force, high-temperature cycling and long-term vibration. Insufficient bonding performance may lead to: ■ Magnet detachment ■ Rotor unbalance ■ Increased motor noise ■ Reduced output torque ■ Failure during high-speed operation ■ Shortened motor service life Therefore, magnet bonding adhesive has become a critical material affecting reliability in motor manufacturing. Required Performance Specifications for Magnet & Magnet Segment Adhesives Motor Magnet Adhesive High Shear Strength During high-speed rotation, magnets are subjected to tremendous continuous centrifugal force. The adhesive must possess high shear strength to securely hold magnets over long-term operation and prevent displacement or detachment. High Temperature Resistance Drive motors for new energy vehicles, robot joint motors and industrial servo systems operate at elevated temperatures for extended periods. Magnet adhesives should feature a high glass transition temperature (Tg) to avoid softening, creep or degradation of bonding performance under high temperatures. Excellent Electrical Insulation Beyond structural bonding, magnet adhesives provide reliable electrical insulation protection to prevent electric leakage and partial discharge, improving long-term operational stability of motors. Thermal Shock Resistance Motors undergo frequent start-stop cycles and temperature fluctuations. The adhesive layer should exhibit good anti-fatigue properties and remain stable under repeated thermal expansion and contraction, resisting cracking or delamination. ELAPLUS Bonding Solutions for Motor Magnets & Magnet Segments ELAPLUS offers a range of single-component epoxy structural adhesives to match diverse motor manufacturing processes. Flux Motor Magnet Sheet Bonding EP 1739-1K Single-Component Epoxy Adhesive Suitable for medium-temperature fast curing processes. Product Features: ■ Single-component structural epoxy…

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How to Select Potting Compound for Strain Gauge Pressure Sensors? ELAPLUS EP 2016 AB Flexible Epoxy Solution Reduces Stress and Improves Measurement Stability

2026-07-14

The core of a strain gauge pressure sensor lies in its sensitive element, which captures tiny deformations and converts pressure variations into electrical signals. Such sensors are highly susceptible to structural stress. If the potting material is overly rigid, or generates excessive curing shrinkage and thermal stress, it will impose extra loads on strain gauges, solder joints, leads and sensitive cores, resulting in zero drift, fluctuating sensitivity and poor long-term measurement stability. Therefore, when choosing potting compounds for pressure sensors, hardness alone is not the key factor. Priority should be given to materials featuring flexibility and low stress, reliable adhesion, stable temperature resistance, contamination resistance, oil resistance and long-term fixation performance. For strain gauge pressure sensors, high-temperature resistant sensors, soft magnetic component potting and other applications, ELAPLUS Functional Materials (Shanghai) Co., Ltd. recommends the two-component flexible structural epoxy ELAPLUS EP 2016 A/B. According to the product datasheet, EP 2016 A/B is a two-part epoxy curable at room or elevated temperature, suitable for metal bonding, soft magnetic component encapsulation and high-temperature sensor potting. After curing, it delivers high mechanical strength, outstanding adhesion, wide temperature resistance and excellent contamination resistance. I. Why Overly Rigid Potting Materials Are Unsuitable for Strain Gauge Pressure Sensors A strain gauge pressure sensor generally consists of an elastic body, strain gauges, bridge circuit, leads, PCB, housing and sealing structure. During operation, the elastic body must produce consistent, repeatable micro-deformation. Hard potting materials will compromise product reliability in the following aspects: ■ Extra stress impairs measurement accuracy Strain gauges output signals by detecting minimal strain. Ultra-rigid potting compounds generate additional stress during curing shrinkage, thermal cycling or mechanical vibration, triggering sensor zero drift, unstable output or sensitivity deviation. ■ Thermal cycling causes interfacial tension Pressure sensors are widely deployed in automotive equipment, industrial machinery, hydraulic systems and engine oil pressure…

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Potting Compound Selection for EMI Filter PCBs – ELAPLUS PUR 1635 Polyurethane Potting Compound Delivers Waterproof, Flame-Retardant & Insulating Protection

2026-07-13

EMI filter circuit boards are widely integrated into power supplies, electronic controllers, industrial equipment, communication hardware, new energy systems and other assemblies. Their core function is to suppress electromagnetic interference and stabilize circuit performance. Filter PCBs are densely populated with inductors, capacitors, solder joints, terminals, PCB traces, alongside plastic and metal housings. During long-term operation, these components are exposed to multiple hazards including moisture, dust, vibration, temperature cycling and electrical safety risks. Therefore, when selecting potting adhesive for EMI filter motherboards, full filling capacity alone is insufficient. Critical performance metrics to evaluate include electrical insulation, water & moisture resistance, flame retardancy, flexibility, low shrinkage, weatherability and adhesion to various substrates. For EMI filter PCB potting applications, Elaplus Functional Materials (Shanghai) Co., Ltd. recommends the two-component polyurethane potting compound ELAPLUS PUR 1635, which provides long-term stable sealing and electrical protection for filter circuit boards. Potting for EMI Filter Circuit Boards I. Why EMI Filter PCBs Require Potting Protection EMI filters are critical anti-interference components within power systems, commonly deployed in power modules, controllers, charging equipment, industrial electronics, inverters, energy storage units and communication devices. Without reliable potting encapsulation during continuous energized operation, filter PCBs are prone to the following failures: 1.Moisture ingress degrades insulation performance Solder points, terminals, inductors, capacitors and PCB traces on EMI filter boards are highly sensitive to humidity. Prolonged moisture penetration can cause degraded insulation, electric leakage, component corrosion and even short circuits. Waterproof & moisture-resistant potting compound forms a protective film over all electronic parts, mitigating failure risks in hot-humid operating environments. 2.Vibration and shock loosen electronic components Power equipment, industrial controllers and vehicle-mounted electronics are subject to constant vibration and mechanical impact. Tall components such as inductors and capacitors will suffer solder joint fatigue, displacement or poor electrical contact if not secured by potting resin. The…

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How to Select Potting Compound for Start-Stop Controllers: ELAPLUS EP 1712 Flame-Retardant Epoxy Potting Compound for Potting & Protection of Controllers, ECUs and Power Modules

2026-07-09

Are you searching for potting adhesives for start-stop controllers, general controllers, ECUs and power supplies? It is critical to select an electronic potting material that simultaneously delivers insulation, moisture resistance, flame retardancy, crack resistance, bonding fixation and long-term reliable protection. For automotive start-stop controllers, ECU boards, power control modules, sensor circuit boards and other applications, ELAPLUS Functional Materials (Shanghai) Co., Ltd. recommends ELAPLUS EP 1712 flame-retardant epoxy potting compound. EP 1712 is a two-component solvent-free room-temperature curing epoxy potting compound. It features moderate flowability after mixing and certain anti-leakage performance. Fully cured material boasts high hardness, favorable toughness, outstanding adhesion and electrical insulation, superior waterproof and moisture-proof properties, and meets UL 94 V-0 flame retardant rating. It is suitable for encapsulation and protection of automotive electronics, sensors, optoelectronic LEDs, lighting products and more. I. Why Do Start-Stop Controllers Require Potting Compound? Installed within automotive electrical systems, start-stop controllers are exposed to long-term temperature fluctuations, hot-humid environments, vibration and shock, fluctuating electrical loads and limited structural space. Their internal components include PCBs, inductors, capacitors, relays, MOSFETs, connection terminals and other parts. Without reliable encapsulation, the following failures may occur: ■ Moisture ingress leading to reduced insulation or corrosion failure ■ Fatigue damage to solder joints, components and wiring harnesses caused by vehicle vibration ■ Local heat generation inside power modules compromising long-term reliability ■ Cavities between control boards and housings prone to water accumulation, dust buildup and heat concentration ■ Risks of short circuits, electric arcs and thermal runaway, which necessitate flame retardant protection Therefore, potting compound for start-stop controllers is not merely for cavity filling. After curing, it forms a stable protective layer to provide electrical insulation, mechanical fixation, waterproof & moisture-proof shielding, flame retardancy and crack resistance for internal electronic components of controllers. II. Core Selection Criteria for Controller, ECU and Power Supply Potting…

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Potting Compounds for High Power Density Motors: Thermal Conductivity Alone Is Not the Only Criterion

2026-07-08

In recent years, the development of high power density motors has been driven forward by humanoid robots, industrial robots, electric vehicles (EVs), unmanned equipment and industrial automation machinery. As motors become more compact yet deliver higher output power, the conventional potting mindset of “just fill the cavity” is no longer adequate. Whether it is potting compound for robot joint motors or thermally conductive potting adhesive for EV drive motors, engineers now focus on a complete thermal management system and long-term reliability rather than thermal conductivity as a standalone metric. This explains why more engineers are searching for answers to the following questions: ■ How to select potting compounds for motors? ■ Recommended thermally conductive potting adhesives for motors ■ Potting materials for robot joint motors The core question to address is simple: ■ What potting materials are required for high power density motors? Why an Increasing Number of Motors Adopt Potting Technology For robot joint motors, frameless torque motors, servo motors and drive motors, stator windings constitute the primary heat source within the whole system. Potting compounds do far more than merely fix windings in place. They perform five critical functions simultaneously: ■ Establish efficient thermal conduction pathways ■ Secure windings and suppress vibration ■ Provide electrical insulation ■ Resist moisture and corrosion ■ Enhance long-term operational reliability Accordingly, industry engineers frequently search for these product categories: ■ Thermal conductive motor potting compounds ■ Epoxy potting resins for motors ■ Stator potting materials ■ Potting adhesives for robotic motors Is Higher Thermal Conductivity Always Better? When selecting thermally conductive motor potting compounds, most engineers first check thermal conductivity figures. This is, however, a common misconception. For high power density motors, service life is predominantly determined by four key indicators: 1. Thermal Conductivity Dictates how rapidly heat transfers from windings to the motor housing. Insufficient thermal conductivity leads to: ■ Excessive temperature rise ■ Reduced power output…

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How to Select Adhesives for Bonding & Fixing Inductors

2026-07-06

Required Performance of Inductors Bonding Fixing Adhesives Inductors, coils, magnetic cores and power electronic components are subject to long-term temperature rise, mechanical vibration, thermal cycling and electrical stress during operation. Inductor Potting Compound Insufficient bonding strength of fixing adhesives, or cracking & debonding after curing, may lead to loose inductors, abnormal noise, pin fatigue or even abnormal electrical performance. Therefore, adhesives for bonding and fixing inductors must meet all the following requirements: ■ Excellent adhesion to magnetic cores, metals, PCBs and plastic bobbins; ■ Good anti-sagging property after dispensing to retain the shape of adhesive dots and lines; ■ High structural strength after full curing; ■ Outstanding electrical insulation performance; ■ Resistance to high-low temperature cycling and long-term operating temperatures; ■ Compatible with manual dispensing and automatic dispensing processes. For different inductor fixing structures, ELAPLUS, a manufacturer of electronic adhesives, offers four epoxy structural bonding fixing adhesives: EP 2011, EP 1769, EP 1767 and EP 1763. EP 2011: Suitable for Medium-Temperature Curing & Ambient Storage Processes EP 2011 is a two-component epoxy structural adhesive in grey paste with slight thixotropy. Inductor Fixing Adhesive It can be stored under ambient temperature away from light. The recommended curing profile is heating at 80°C for 1 hour. It is ideal for inductor fixing applications that require high structural strength without high curing temperatures. Typical properties: ■ Thixotropic index: 3.5 ■ Hardness after curing: Shore D 83 ■ Glass transition temperature (Tg): 55°C ■ Shear strength: 16 MPa ■ Volume resistivity: 1.2×10¹⁵ Ω·cm ■ Dielectric constant: 3.3 ■ Operating temperature range: -40 ~ 120°C EP 2011 is applicable to magnetic core fixation of inductors, coil assembly bonding, electronic component reinforcement and general structural bonding for industrial electronics. EP 1769: High Tg & High-Strength Solution for Inductor Fixing EP 1769 is a single-component grey paste epoxy adhesive with typical viscosity of 300,000 cps at 25°C and thixotropic index…

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Selection Guide for IC Chip & Electronic Component Reinforcement Adhesives: Epoxy vs UV Silicone

2026-07-04

Why IC Chips & Electronic Components Require Reinforcement In chips, sensors, connectors and precision electronic assemblies, solder joints, pins and dissimilar material interfaces are vulnerable to vibration, mechanical shock, thermal cycling and moisture. Applying adhesives to reinforce chip corners, component undersides, pin root bases and plastic-metal joints delivers the following benefits: ■ Secure fixation of IC chips and electronic components ■ Reduce mechanical stress borne by solder joints ■ Boost assembly resistance to vibration and impact ■ Provide electrical insulation, moisture resistance and sealing protection ■ Enhance structural stability under wide temperature cycling However, reinforcement locations impose different requirements on adhesive flowability, hardness and curing methods. LILIAN offers three specialized formulations for diverse electronic reinforcement processes: EP 1738-1, EP 2090 and SIPC UV 3302. EP 1738-1: Ideal for IC Corner Bonding & Dam Reinforcement EP 1738-1 is a black, solvent-free, heat-curable single-component structural epoxy adhesive. four-corner bonding of IC chips At 25°C, its viscosity ranges from 300,000 to 450,000 mPa·s with vertical sag less than 0.1 mm, delivering excellent thixotropy. It resists uncontrolled spreading after dispensing, making it perfect for applications requiring precise control over dot shape and coverage. Typical Applications: ■ Four-corner bonding of IC chips ■ Edge reinforcement for integrated circuits ■ Chip underfill ■ Chip dam encapsulation ■ Pressure sensor bonding ■ Local fixation of electronic components Post-curing hardness reaches Shore D 85±5, with a glass transition temperature of approximately 105°C and long-term service temperature ranging from -50°C to 180°C. Its steel-to-steel shear strength hits 22 MPa at 25°C, suiting reinforcement sites demanding superior structural strength and anti-sag performance. EP 2090: Structural Reinforcement for Plastic-Metal Electronic Assemblies EP 2090 is a two-part room-temperature-curable epoxy adhesive mixed at a 1:1 weight or volume ratio of Part A to Part B housing sealing It bonds a broad spectrum of substrates including ceramics, metals, glass, plastics and rubbers, with outstanding compatibility…

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Selection Guide for Potting Compounds for Robotic Joint Motors: EP1715(2#) Enables Heat Dissipation and Reliable Encapsulation of Frameless Torque Motor Stators

2026-06-30

With the rapid advancement of embodied intelligence, humanoid robots, collaborative robots and precision servo systems, robotic joint modules are being upgraded toward miniaturization, lightweight design and higher power density. Featuring a compact structure, fast response and direct power output, frameless torque motors have become key drive components in robotic joints. However, the increased power density leads to more concentrated heat generation in motor stator windings with limited heat dissipation space. Stator potting compound is no longer just an auxiliary material but a critical factor determining the reliability of joint motors. For robotic joint motors, potting compound does not merely fill gaps. It transfers heat from windings to the housing to reduce local heat accumulation, secures windings to improve vibration resistance, and delivers insulation, moisture resistance, thermal cycle crack resistance and long-term dimensional stability. Therefore, the selection of potting material for frameless torque motor stators requires comprehensive evaluation of thermal conductivity, CTE, Tg, curing temperature, hardness, toughness, insulation properties and aging stability. I. Why Stator Potting Is Required for Frameless Torque Motors The stator winding is the primary heat source inside a robotic joint module. If heat generated during energization cannot be dissipated promptly, winding temperature will keep rising, shortening the service life of enameled wires, destabilizing motor output and impairing long-term operational reliability. Stator potting serves three major purposes: ■ Thermal Conduction: The potting compound fills air gaps between windings and the stator core to cut thermal resistance, enabling efficient heat transfer from windings to the housing. ■ Mechanical Fixation: Robotic joints frequently start, stop, accelerate, decelerate and endure continuous vibration. The potting material firmly supports windings and prevents displacement caused by mechanical shock and vibration. ■ Insulation & Environmental Protection: Epoxy potting compound insulates windings, blocks moisture and resists contamination, stabilizing motor performance under harsh operating conditions. II. Key Performance Indicators for…

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EP 1716 Thermal Conductive Epoxy Potting Compound – Customized for Stators of Frameless Torque Motors in Humanoid Robots

2026-06-25

As humanoid robots enter a phase of rapid development, frameless torque motors—the core drive components—act as the “muscle system” of robot joints. However, numerous engineers repeatedly highlight a critical challenge in practical engineering design:  Motor stators generate severe heat within an extremely compact structural space. How to simultaneously resolve heat conduction, electrical insulation and crack resistance issues? The solution lies in one core material: ■ EP 1716 High Thermally Conductive Epoxy Potting Compound Why Potting Is Mandatory for Frameless Torque Motors The structural characteristics of frameless torque motors make potting materials indispensable: ■ High torque density → concentrated heat generation ■ No housing air cooling → poor heat dissipation ■ Compact construction → short heat transfer paths ■ Long-term operation under low speed and high torque Without potting treatment, the following failures will typically occur: ■ Excessive temperature rise of stators ■ Degraded insulation performance ■ Vibration abrasion of windings ■ Failure caused by long-term thermal aging ■ Unstable joint drive performance Therefore, potting material is far more than just a filler; it serves as the core material integrating motor thermal management, structural fixation and electrical insulation. Why Epoxy Is the Optimal Choice Potting for torque motor stators needs to satisfy three key requirements simultaneously: ■ Thermal conductivity ■ Structural bonding strength ■ Resistance to thermal cycling Comparison of three mainstream material systems: ■ Silicone: Soft but weak bonding strength, high coefficient of thermal expansion (CTE) ■ Polyurethane: Good toughness but limited temperature resistance ■ Epoxy: High mechanical strength, outstanding stability and reliable structural locking Conclusion: Only epoxy can deliver long-term stable structural fixation. Core Advantages of EP 1716 ■ High thermal conductivity: Thermal conductivity coefficient of 1.5 W/mK, efficiently transferring heat from windings to the housing and unlocking continuous torque output potential; ■ Low CTE: Linear expansion coefficient of only 25 μm/m·℃ below Tg, paired with excellent crack resistance to withstand repeated thermal cycling; ■ High temperature resistance:…

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