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How to Select Potting Compounds for Industrial Sensors? Recommended Grades for Pressure, Torque and Temperature Sensors

2026-08-13

The core principle for adhesive selection on industrial sensors is not “the firmer the potting, the better”. Materials shall be selected separately according to sensitive elements, housing materials, medium environment, stress requirements and waterproof specifications. Elaplus recommends SIPC 2121 for torque sensors; SIPC 1816 for temperature & pressure sensor cores; SIPC 1810 LV can be evaluated for sealing between aluminum housings and plastics; EP 1788 applies to pressure transmitters; SIGEL 1876 or EP 1708-7# are suitable for the display areas of electromagnetic flowmeters. Adhesive for Torque Sensors SIPC 2121 Flowable One-Component Silicone Adhesive & Sealant SIPC 2121 is adopted for torque sensors. This one-component silicone material features outstanding softness and elasticity.A torque sensor is designed to detect tiny mechanical variations, so the adhesive must not impose excessive constraint on sensitive structures. Adhesive for Temperature & Pressure Sensor Cores SIPC 1816 SIPC 1816 is used for temperature and pressure sensor cores. It adopts a 10:1 mixing system with curing time of 1～2 hours. Key considerations for sensor core adhesives: Recommended Grade for Sealing Between Aluminum Housing and Plastics SIPC 1810 LV SIPC 1810 LV serves for sealing and bonding between aluminum housings and plastic components of temperature & pressure sensors.Dissimilar materials have obvious differences in thermal expansion, hence the sealing material needs to accommodate interfacial displacement. EP 1788 for Pressure Transmitters EP 1788 is an epoxy potting compound for mechanical bonding, sealing and waterproofing of pressure transmitters. Adhesives for Electromagnetic Flowmeters Elaplus provides two options: They are mainly used to protect display sections, preventing water ingress and ensuring stable display performance. Industrial Sensor Adhesive Selection Table Application Recommended Grade Torque Sensor SIPC 2121 Temperature & Pressure Sensor Core SIPC 1816 Sealing: Aluminum Housing / Plastic SIPC 1810 LV Pressure Transmitter EP 1788 Electromagnetic Flowmeter Display Area SIGEL 1876 / EP 1708-7#…

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How to Select Potting Compounds for Automotive Start-Stop Power Supplies? Recommended Grades for Inductors, Current Sensors and EMC Cores

2026-08-13

Different components inside automotive start-stop power supplies have different potting requirements. SIPA 1850 (15#) can be selected for low-stress thermally conductive potting of inductors; PUR 1680 is available for evaluation on current sensors; EP 1788 is suitable for EMC magnetic core potting. Covering silicone, polyurethane and epoxy systems respectively, the three materials balance thermal conductivity, flexibility and structural support. Why Cannot a Single Potting Compound Be Used Uniformly for Start-Stop Power Supplies? Automotive start-stop power supplies contain: These components vary greatly in sensitivity to material hardness, mechanical stress and thermal conduction.For instance, current sensors demand precise control of mechanical stress; magnetic cores generally require stronger structural fixation; inductors need to achieve heat dissipation at the same time. Inductor Potting: SIPA 1850 (15#) SIPA 1850 (15#) is recommended for inductor potting. It is a 1:1 two-component thermally conductive silicone potting compound. As specified in the datasheet, it delivers Shore A 20 hardness, low stress and thermal conductivity of around 1.5 W/m·K. This solution fits inductors requiring a combination of:Thermal conduction + insulation + buffering + potting protection. Current Sensor Potting: PUR 1680 PUR 1680 is a 100:16 two-component thermally conductive polyurethane potting compound. According to datasheet, it features medium hardness and high elasticity, with thermal conductivity ranging from 0.8～1.2 W/m·K for current sensor encapsulation. Compared with high-hardness epoxy, elastic polyurethane helps buffer structural stress effectively. EMC Magnetic Core Potting: EP 1788 EP 1788 is a 100:15 two-component epoxy potting compound designated for EMC magnetic core potting. It boasts stable thermal cycling performance and thermal conductivity of approximately 0.7 W/m·K. It is ideal for magnetic components requiring robust mechanical fixation and integral encapsulation. Grade Comparison for Start-Stop Power Supplies Component Recommended Grade Selection Focus Inductor SIPA 1850 (15#) Low stress & thermal conduction Current Sensor PUR 1680 Elasticity, thermal conduction & stress…

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Adhesive Selection for Electronic Water & Oil Pumps | PCB Potting, Power Module Thermal & Control Board Fixing Solutions

2026-08-12

Adhesive selection for electronic water pumps and electronic oil pumps in new energy vehicles focuses on PCB potting, power module heat dissipation and control board fixation. Elaplus recommends SIPA 1850 for PCB potting, TCMP 1941 for power module heat dissipation, and EP 2012 for control board fixation, to address electronic protection, thermal management and structural reliability challenges respectively. Why Adhesive Requirements for Electronic Water & Oil Pumps Are More Complex An electronic pump integrates motors, power devices, PCBs and fluid systems. Compared with conventional electronic control boards, electronic pumps are continuously exposed to: Key application demands for electronic pumps can be summarized as housing sealing, structural bonding and resistance to medium corrosion. Recommended Grade for Electronic Pump PCB Potting SIPA 1850 Two‑Component Thermally Conductive Silicone Potting CompoundWithin electronic water pump / oil pump solutions, SIPA 1850 is designated for PCB potting. Potting mainly delivers the following functions: Since electronic pumps contain components of varying heights, adequate flowability and air bubble evacuation shall be prioritized during potting process design. Recommended Grade for Power Module Thermal Dissipation TCMP 1941 Two‑Component Thermal Gel TCMP 1941 is used for heat dissipation of internal power modules inside electronic pumps. Heat‑generating components such as power MOSFETs and driver devices require efficient heat transfer to the pump body or metal housing, which makes intact thermal interfaces critical. Key evaluation criteria during material selection:‑ Thermal conductivity‑ Interface conformability‑ Hardness‑ Long‑term thermal cycling performance‑ Material stability Recommended Grade for Control Board Fixation EP 2012 Two‑Component Epoxy Structural Adhesive EP 2012 is applied for control board fixation. For electronic pumps subject to persistent vibration, control boards cannot rely solely on screws, fasteners or solder joints. Proper structural adhesives help share mechanical loads. Adhesive Selection Table for Electronic Water / Oil Pumps Application Location Recommended Grade Core Functions PCB SIPA 1850…

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EP 1721-1 Flexible Epoxy Potting Compound | Structural-Grade Solution for Three-Phase Busbar Sealing and Potting

2026-08-11

With accelerated adoption of 800V high‑voltage platforms and 3‑in‑1 e‑Axle drive systems, operating conditions for internal three‑phase busbars within electric drives have become significantly more demanding. For three‑phase busbars, connection terminals and high‑voltage connectors, potting materials are required not only to deliver insulation and sealing, but also to withstand hundreds of amperes of high current, high‑temperature oil media, long‑term vibration and shock, as well as thermal expansion mismatch between busbars and housing structures. Accordingly, selecting potting compounds for three‑phase busbars in 800V electric drives should focus not merely on hardness and bonding strength, but on the balanced combination of material modulus, flexibility, resistance to high‑temperature oil aging, interfacial adhesion and long‑term mechanical reliability. To address structural fixation and sealing requirements of three‑phase busbars and connection terminals in electric drives, ELAPLUS has developed EP 1721‑1 Flexible Epoxy Potting Compound. By balancing low modulus, high elongation and the adhesive performance of epoxy systems, it mitigates risks of stress concentration at busbar roots under thermal cycling and vibration. 01 Why 800V Electric Drive Three‑Phase Busbars Impose Higher Requirements on Potting Compounds Busbars in traditional electrical systems primarily function for current transmission and connection fixation. In the era of 800V electric drives, three‑phase busbars have evolved from simple wiring components into critical connection structures operating within complex environments. Especially within 3‑in‑1 e‑Axle assemblies, reduction gearboxes and oil‑cooled motor structures, busbars and their connection points are continuously exposed to: If potting materials with excessively high modulus and rigid properties are adopted, asynchronous thermal expansion and contraction between busbars and housings will concentrate stress at busbar roots or adhesive interfaces. After prolonged cycling, the following failures may occur:Adhesive cracking｜Interfacial delamination｜Busbar loosening｜Degraded sealing｜Reduced insulation reliability This explains why potting for electric drive busbars cannot simply follow the idea of “harder means stronger”. 02 EP 1721‑1: Relieve Interfacial…

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How to Select Adhesives for PTC Heaters? Recommended Grades for Housing Sealing, Power‑Module Thermal Conduction and Connector Potting

2026-08-10

Multiple single‑material solutions shall be avoided for adhesives used in new‑energy‑vehicle PTC heaters. Material selection shall be carried out respectively for housing sealing, power‑module heat dissipation and local connector potting. For PTC heater applications, Elaplus recommends SIPA 1865‑2K for housing sealing, TCMP 1960‑2K for power‑module heat dissipation, and SIPA 3015‑2K for connector‑section potting, delivering a combined solution of “sealing + thermal conduction + insulation protection”. Adhesive Solution for PTC Heaters Why Multiple Types of Adhesives Are Required for PTC Heaters A new‑energy‑vehicle PTC heater integrates heating elements, power devices, control circuits, connectors and metal housings. Different positions face distinct challenges: Therefore, adopting one single high‑thermal‑conductivity adhesive or one single sealing adhesive for all positions hardly meets all functional requirements simultaneously. Recommended Grade for PTC Housing Sealing Elaplus SIPA 1865‑2K Within Elaplus PTC application solutions, SIPA 1865‑2K is mainly applied for housing sealing. Housing Sealing Main functions: For PTC housing‑sealing materials, initial bonding strength is not the only indicator. Interface delamination and sealing failure after thermal cycling shall be verified as key evaluation items. Recommended Grade for PTC Power‑Module Heat Dissipation Elaplus TCMP 1960‑2K Thermal Gel TCMP 1960‑2K is designated for heat dissipation of PTC power modules. Its core function is not rigidly bonding the power module in place, but filling the interface between power devices and heat‑dissipation structures to transfer heat efficiently to the metal housing. Key selection criteria:‑ Thermal conductivity‑ Interface gap‑filling capability‑ Material hardness‑ Assembly tolerance‑ Thermal‑cycling stability For power devices in particular, excessively hard thermal‑interface materials that introduce high assembly stress onto components shall be avoided. Recommended Grade for PTC Connector‑Section Potting Elaplus SIPA 3015‑2K SIPA 3015‑2K is used for potting of internal PTC connectors to provide local insulation, moisture resistance and fixation. Suitable for protection of:‑ Connector roots‑ Peripheral terminals‑ Local circuits‑ Electrical connection points PTC…

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Motor Lead‑Wire & Neck‑Section Adhesive Selection | High‑Temp, Oil‑Resistant & Anti‑Sagging Grade Recommendations

2026-08-10

Adhesives for motor lead‑wire fixing and neck‑section encapsulation shall be selected according to dispensing position, adhesive thixotropy, long‑term temperature resistance, oil resistance, lead‑wire material and curing process. For flexible fixation of heat‑shrinkable tubes and lead wires, evaluate Elaplus SIPC 1823. EP 1770‑1K is recommended for the neck‑section of brushless motors. EP 1770H‑1K can be applied for inter‑slot sealing of DC motor rotors. For motor housings or sealing positions exposed to oil media, evaluate SIPC 1887. Why Motor Lead‑Wires Require Fixation During motor operation, coil lead‑wires are subjected to continuous loads induced by vibration, electromagnetic force, thermal expansion‑contraction and high‑speed rotor motion. Without fixation at the lead‑wire root, the following failures may occur: Lead‑wire fixing adhesives shall maintain proper flexibility and shall not form rigid bending boundaries at lead‑wire roots. Recommended Grade for Brushless‑Motor Lead‑Wire Fixation SIPC 1823: One‑Component Silicone Lead‑Wire Fixing Adhesive SIPC 1823 is a one‑component silicone adhesive featuring fast tack‑free time and good bonding performance for heat‑shrinkable tubes. According to the datasheet, its viscosity is approx. 35 000 cps with service temperature ranging from ‑60 ℃ to 200 ℃. Suitable for: Note: The motor application schematic page of the datasheet marks SIPC 1822, whereas the parameter sheet lists SIPC 1823. Always confirm the final grade against the latest TDS for formal release, sampling and quotation. Recommended Grade for Brushless‑Motor Neck‑Section Encapsulation EP 1770‑1K: High‑Thixotropy Heat‑Curing Epoxy Adhesive EP 1770‑1K is a one‑component heat‑curing epoxy adhesive. It resists flow at ambient temperature and delivers moderate slight slump upon heating. Per datasheet, viscosity is approx. 150 000 cps; recommended curing profile: 120 ℃ for 60 minutes. Suitable for: Its rheological design of “no flow at room temperature, slight slump under heating” enables the adhesive to stay in place after dispensing, while achieving moderate wet‑out over coil surfaces during curing temperature rise. Recommended Grade for DC‑Motor Inter‑Slot Sealing…

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Motor Stator Thermally‑Conductive Potting Compound Selection | Recommended Grades for Robot Joint Motors and NEV Motors

2026-08-10

When selecting potting compounds for motor stators, thermal conductivity alone should not be the only comparison indicator. Viscosity, wet‑out capability, Tg, coefficient of thermal expansion (CTE), cure shrinkage, hardness and crack‑resistance performance shall also be evaluated simultaneously. For conventional epoxy potting of motor stators, evaluate Elaplus EP 1715. Choose EP 1716 for applications requiring high Tg, low shrinkage and crack resistance. For high‑power‑density applications such as robot‑joint motors and new‑energy‑vehicle motors where higher thermal conductivity is needed, evaluate EP 1796‑2# with a thermal conductivity of approx. 2.5 W/m·K. Motor Potting Why Do Motor Stators Require Potting? Stator windings continuously generate heat when energized. As motors trend toward miniaturization, higher rotational speed and elevated power density, heat inside windings becomes harder to dissipate in a timely manner. Motor stator potting compounds mainly deliver the following functions: Robot‑joint frameless torque motors, servo motors and new‑energy‑vehicle drive motors feature high power density, which places higher comprehensive requirements on motor thermally‑conductive potting compounds. Recommended Grades for Conventional Motor Stator Potting EP 1715: Epoxy Potting Compound for Stators EP 1715 is a 100:15 two‑component heat‑curing epoxy potting compound, suitable for potting of general‑purpose motor stators and windings. Recommended Applications: Parameters of EP 1715 may vary for different suffixes or formula versions. Always refer to the latest corresponding TDS for public release. Grade Recommendation for Motors Requiring High Tg and Crack Resistance EP 1716: High‑Tg Low‑Shrinkage Epoxy Potting Compound EP 1716 is a 100:5 two‑component epoxy potting compound characterized by high Tg, high temperature resistance, low cure shrinkage and crack resistance. Its service temperature ranges from approx. ‑50 ℃ to 180 ℃. Suitable for: High Tg helps the material maintain mechanical stability at elevated operating temperatures. Low cure shrinkage and low CTE help reduce thermal stress among windings, iron cores and cured compound. High‑Thermal‑Conductivity Grade for Motor Stators EP…

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Motor Magnet Bonding Adhesive Selection | Model Comparison for Permanent‑Magnet Motors and Small Motors

2026-08-10

Adhesives for motor magnet bonding shall be selected based on motor rotational speed, long‑term temperature resistance, magnet‑to‑rotor substrate combination, adhesive layer thickness, curing method and production cycle. For conventional one‑component heat‑curing options, evaluate Elaplus EP 1739‑1K. Choose EP 1769‑1K when high Tg and high thixotropy are required. For two‑component systems with high shear strength and toughness, select EP 2029‑2K. For high‑frequency electromagnetic fast curing requirements in small motors, EP 1772‑1K is recommended. Why Mechanical Snap‑in Grooves Alone Are Not Enough for Motor Magnets During operation, permanent‑magnet motor magnets are subjected to: Adhesive failure may cause magnet displacement, detachment and rotor unbalance. In severe cases, the motor stator and housing can be damaged. Recommended Grades for Conventional Magnet Bonding EP 1739‑1K: One‑component semi‑fluid epoxy adhesive Motor Magnet Bonding EP 1739‑1K is a one‑component heat‑curing epoxy adhesive with semi‑fluid consistency. Its datasheet lists viscosity at approx. 27 000 cps and service temperature ranging from ‑50 ℃ to 200 ℃. Suitable for: EP 1769‑1K: High‑Tg & high‑thixotropy magnet‑bonding adhesive EP 1769‑1K is a one‑component low‑flow epoxy adhesive with viscosity ≥ 300 000 cps. Recommended curing profile: 120 ℃ for 30 minutes; service temperature: ‑50 ℃ ~ 200 ℃. Suitable for: Recommended Two‑Component Magnet‑Bonding Grade EP 2029‑2K: High‑shear epoxy structural adhesive Motor Epoxy Structural Adhesive EP 2029‑2K is a 2:1 two‑component epoxy adhesive featuring good peel resistance and shear strength. According to its datasheet, shear strength on stainless steel reaches approx. 6 MPa at 150 ℃; service temperature ranges from ‑50 ℃ to 180 ℃. Suitable for: Grade for High‑Volume Small‑Motor Production EP 1772‑1K: High‑frequency electromagnetic fast‑curing adhesive EP 1772‑1K is a one‑component epoxy adhesive that achieves fast curing within around 20 seconds via high‑frequency electromagnetic heating, ideal for magnet segment bonding of small‑size motors. Recommended applications: Elaplus EP 1739‑1K, EP 1769‑1K, EP 2029‑2K and EP 1772‑1K cover semi‑fluid thermal curing, high‑thixotropy high‑Tg, two‑component high‑shear and high‑frequency fast‑curing…

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How to Select Potting Materials for Server Power Supplies amid Rising Power Density

2026-08-08

When selecting potting materials for server power supplies, thermal conductivity alone should not be the sole consideration. With the continuous increase in power density of AI servers, power supply modules, high‑frequency transformers, inductors, PFC and DC‑DC modules are subjected to rising temperature rise, vibration and electrical stress. A suitable potting material must strike a balance among thermal conductivity, electrical insulation, stress resistance, flame retardancy, flowability and production cycle time. Improper material selection may lead to incomplete filling, excessive bubbles, cracking upon curing, component stress‑induced damage and unstable heat dissipation performance. 1. Why Do Server Power Supplies Require Potting? Server power supplies integrate a large number of power devices and magnetic components, operating continuously under high‑load, frequent start‑stop and persistent heat‑generation conditions. Potting materials generally deliver the following functions: It should be noted that potting does not mean fully filling the entire power‑supply module. High‑frequency transformers, inductors and auxiliary power supplies are suitable for potting. Between power semiconductors and heat sinks, thermal gels, thermal greases or other thermal interface materials are more applicable. 2. Do Not Rely Solely on Thermal Conductivity for Material Selection 2.1 Actual Thermal Resistance Outweighs Nominal Thermal Conductivity High nominal thermal conductivity does not guarantee superior practical heat dissipation. Whether a stable thermal conduction path can be formed after potting depends on multiple factors: For server power supplies, temperature‑rise tests on actual modules are recommended, instead of merely comparing W/m·K values from product datasheets. 2.2 Flowability Determines Potting Feasibility Fine winding gaps commonly exist inside high‑frequency transformers and inductors. Excessively high material viscosity prevents sufficient penetration into gaps among coils, bobbins and magnetic cores, resulting in bubbles or unfilled areas. Therefore, key points to verify during selection: High‑thermal‑conductivity materials contain abundant thermal fillers. Higher thermal conductivity is usually accompanied by increased viscosity and density. A balance between…

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