Solution for sealing the internal coil of car door handles

With the popularity of keyless entry systems (PEPS) in new energy and high-end fuel vehicles, door handles have been upgraded from traditional mechanical handles to intelligent components that integrate coils, micro switches, and antenna modules.These sensing coils are responsible for implementing key functions such as touch recognition, proximity sensing, and vehicle owner authentication, and their stability directly determines user experience and vehicle safety. Due to the long-term exposure of the door handle to the outdoors, its internal antenna coil needs to face:The damp heat cycle caused by long-term exposure to sunlight and rainCold and hot shock under temperature difference between winter and summer (-40~125 ℃)Structural fatigue caused by frequent pullingDifficulty in sealing due to narrow cavities and complex structuresTherefore, the sealing of the internal coil of the door handle must be selectedA special material system with low dielectric, low stress, temperature stability, moderate fluidity, and adhesive properties.Requirement analysis of sealing materialsBased on the structural characteristics of the car door handle antenna coil and the reliability requirements of the vehicle manufacturer, the core indicators for selecting adhesive are as follows:Temperature resistance performance (-40~125 ℃)Ensure that there is no cracking, detachment, or water leakage under severe thermal shock.Low dielectric constant (key!)Avoid affecting the signal resonance and transmission rate of the coil.Low hardness, low stress system Reduce stress concentration on the shell and components during thermal expansion and contraction processes.Good adhesion strength (PA66+GF, PC, metal)Ensure that the sealing body does not detach from the shell to prevent water leakage or structural looseness.Controllable liquidityIt is necessary to permeate the internal exhaust of the coil without being too thin to permeate excessively.Fast curing speed, improving production line efficiency The door handle usually needs to be glued in stages, so the curing time is crucial.In response to the above requirements, Yilian provides two preferred material systems…

Science Popularization of Thermal Conductive Epoxy Structural Adhesive | Principles, Characteristics, and Engineering Application System Analysis

01 | What is thermal conductive epoxy structural adhesive?Thermally Conductive Epoxy Structural Adhesive is a high-performance adhesive material that uses epoxy resin as the matrix, adds high thermal conductivity fillers, and forms a dense three-dimensional network structure through crosslinking reactions with curing agents. Its material essentially consists of three types of properties: ① Structural StrengthHigh shear strength, high peel strengthAnti impact, anti vibration, anti fatigueDimensional stability for long-term serviceIt can replace traditional mechanical fixing methods such as screwing, riveting, and welding.② Thermal ConductivityThermal conductive fillers (such as Al ₂ O3, BN, AlN) form a continuous thermal conduction chain during the curing process, giving the material significantly higher thermal conductivity than ordinary epoxy.This function is used for heat transfer of heating components and reduction of interface thermal resistance.③ Epoxy system functionality (Chemical&Environmental Stability)The epoxy matrix forms a stable three-dimensional structure through cross-linking and curing, with:Good temperature resistanceExcellent electrical insulation capabilityResistant to media, moisture and heat, and aging performanceMake it suitable for long-term complex environments.02 | Curing mechanism and interface bonding principleThermal conductive epoxy structural adhesives often use two-component A/B formulations.The standard mixing ratio of Yilian EP 2010A/B high thermal conductivity epoxy structural adhesive is 100:50 (weight ratio).The curing mechanism includes:① Epoxy ring opening and crosslinking reactionThe mixed epoxy group and curing agent undergo ring opening polymerization, and the system changes from liquid to gel to solid, finally forming a high modulus three-dimensional cross-linking structure.② Construction of Thermal Conductive NetworkHigh thermal conductivity fillers form a continuous heat transfer chain during the solidification process of the system, enabling the solidified body to effectively transfer heat outward.③ Surface interface chemical bondingEpoxy has high polarity and is compatible with metals, ceramics SMC、 Chemical bonding or polar adsorption is formed between composite materials and other substrates to improve interfacial stability.03 | EP 2010A/B: Representative of Typical…

What adhesive is used for bonding electronic component shells? ——PUR 1680 (D70) A/B polyurethane sealant professional solution

Against the backdrop of the continuous development of electronic products towards lightweight, high reliability, and extreme environmental resistance, shell bonding and internal encapsulation have become key factors affecting the stability of electronic devices. Whether it is communication equipment, sensors, control power supplies, or ignition controllers, internal components all face challenges such as humidity, vibration, temperature shock, electrical interference, and outdoor exposure. In order to enhance the overall assembly strength and protect internal components, Yilian has launched PUR 1680 (D70) A/B high hardness polyurethane sealant, specifically designed for bonding and sealing electronic component housings.1、 Core advantages of PUR 1680 (D70) A/B polyurethane sealant

Solution for wiring harness board sealing with adhesive | SIPA 1850 gray two-component addition molding silicone

In the continuous upgrading of new energy vehicles, energy storage equipment, and intelligent manufacturing equipment, the stability of the wire harness PCB directly determines whether the system can operate stably in complex environments such as high temperature, vibration, and humidity for a long time. In order to ensure the weather resistance and reliability of the wiring harness board, the encapsulation process has become an indispensable part. Adhesive for wiring harness board sealing In the face of changing application environments, engineers often make the following requirements for sealant:✔ Having certain thermal conductivity to avoid heat accumulation affecting the lifespan of electronic components✔ The adhesive strength does not need to be too high, but it should maintain flexibility and fatigue resistance✔ Two component addition molding silicone system, combining low stress and high reliability✔ Fast curing speed, improving production line efficiencyIf you are looking for a material that meets the above requirements – SIPA 1850 gray is worth paying close attention to.Recommended product: SIPA 1850 gray thermal conductive sealantSIPA 1850A/B is a two-component addition molding silicone sealant designed specifically for electronic modules, high-temperature devices, and wiring harness boards. Its 1:1 mixing ratio, excellent fluidity, and good thermal stability make it highly suitable for convenient and efficient sealing processes.🔹 Core FeaturesTwo component addition molding silicone system, uniform curing, no shrinkage1: 1 ratio, automatic mixing machine and manual operation are both very convenientLow hardening shrinkage rate to avoid damage to solder joints or components under stressExcellent high-temperature electrical insulation ensures long-term stability of the wiring harness boardGood thermal conductivity, meeting general heat dissipation needsStrong waterproof and moisture-proof performance, improving the reliability of the whole machineFlame retardant rating UL 94 V-0, meets automotive electronic safety regulationsStrong deep curing ability, suitable for large volume sealingCompliant with ROHS/SVHC REACH environmental regulationsView SIPA 1850 detailsTypical application areasSIPA 1850 gray…

Micro switch waterproof sealing solution | PUR 1680 polyurethane foam adhesive

Micro switches are widely used in precision electronic components such as automotive electronics, smart home appliances, industrial control, etc. due to their small size, sensitive triggering, and high reliability. However, due to its compact internal structure and sensitive electrical contacts, it is prone to switch failure, contact oxidation, and sensitivity reduction in humid, vibrating, or chemical environments. Therefore, waterproof sealing protection has become a key link to ensure the long-term stable operation of micro switches. Application challenge: PP shell+long-term sealing, failure to stick firmly is ineffective protectionThe housing of micro switches is often made of PP (polypropylene) material, which has low surface energy and strong inertness. Even after plasma treatment, many adhesives still exist:✅ Insufficient adhesion, cracking occurs under slight stress✅ After solidification, it becomes hard and brittle, and after fatigue aging, it peels off✅ The waterproof layer is discontinuous and cannot form a sealed structureAt present, some factories use Weifu 500 adhesive, but there is still a risk of bonding fatigue and sealing degradation under long-term humidity and external forces.Therefore, it is crucial to choose a highly reliable adhesive that can tightly bond with plasma treated PP and has a flexible sealing effect.Recommended product: PUR 1680 Micro Switch Special Waterproof Sealing AdhesivePUR 1680 is a single component moisture curing polyurethane reactive adhesive, particularly suitable for bonding low surface energy materials such as PP, PE, TPE, and sealing and packaging electronic devices.Core strengthsPerformance Characteristics and Advantages ExplanationAfter plasma treatment, PP has high adhesive strength and is firmly bonded without breaking or delaminationExcellent waterproof sealing performance can effectively block the infiltration of moisture, dust, and oil stainsAfter curing, the flexibility does not crack due to vibration or fallingEasy to operate, dispensing friendly, can be automated or manually applied, suitable for large-scale productionStrong temperature resistance and environmental adaptability, maintaining stable performance in…

Micro switch waterproof sealing solution: Elaplus high reliability epoxy sealing adhesive helps stabilize and protect

Waterproof Adhesive Solution for Automotive Lights – SIPC 1859 Organic Silicon

In the automotive industry, waterproof bonding of car lights is an important part of ensuring long-term stability of lighting fixtures. Optical components such as headlights, taillights, and daytime running lights are prone to problems such as water leakage, delamination, or PC material aging in harsh environments such as high temperature, humidity, and ultraviolet radiation if they lack effective waterproof bonding protection. Elapluus car lamp waterproof bondingCore requirements for waterproof bonding of car lightsWhen carrying out waterproof bonding of car lights, the following key performance should be paid attention to:Efficient bonding of PC materials: Car lamp covers are mostly made of polycarbonate (PC) material, and the adhesive needs to ensure long-lasting and strong adhesion.Non flowing and de methanol: During the construction process, the colloid does not flow, and solidification does not release methanol, ensuring the safety of optical transparent parts and internal components.Aging resistance and corrosion resistance: Car lights must withstand environmental tests such as temperature differences, humidity, rain, and ultraviolet rays during long-term use. The adhesive should be anti-aging and not corrode the PC material.Recommended product: SIPC 1859 silicone adhesive sealantSIPC 1859 is a high-performance single component silicone adhesive sealant designed specifically for waterproof bonding of car lightsExcellent PC adhesion: Directly bond PC lampshades without the need for primer, ensuring long-lasting stability.Black, non flowing: easy to construct, neat and beautiful glue line.Methanol removal environmentally friendly formula: does not release methanol during the curing process, protecting optical components and internal circuits.Aging resistance and corrosion resistance: The adhesive strength is maintained during high temperature, humid heat, UV and other aging tests without damaging the PC substrate.Dual function of waterproof sealing: achieving dual protection of adhesion and waterproof sealing, effectively extending the service life of car lights.Application scenarios SIPC 1859 is widely used for waterproof bonding of various automotive lighting fixtures:Front headlight assembly:…

Silicon gel for pressure sensor potting – high viscosity, high reliability and high protection

In the packaging protection of pressure sensors, the fluidity, viscosity, and stress release ability of the sealing adhesive often determine the long-term stability and reliability of the sensor. Especially in the face of complex environmental conditions (high humidity, high temperature, mechanical vibration), it is particularly important to select a suitable silicon gel. Today, we recommend a high-performance potting material SIGEL 1805 two-component addition molding silicon gel specially designed for pressure sensors, MEMS chips and precision circuit modules. Load cell gel encapsulation Load cell gel encapsulation1、 Product Features Highlights✅ Soft and elastic, excellent cushioningAfter curing, it forms a soft elastic body that can release mechanical stress under thermal cycling and vibration conditions, protecting the chip and leads from damage.✅ Excellent electrical insulation and protection performanceAfter curing, it has extremely low oil leakage and excellent dielectric properties, which can effectively isolate moisture and corrosive media, providing stable insulation protection for high-voltage circuits.✅ Outstanding aging resistance and weather resistanceLong term exposure to high temperature, high humidity, ozone, and ultraviolet environments results in stable performance, making it suitable for outdoor or automotive electronic sensor applications.✅ 1: 1-ratio additive curing systemEasy to mix, no by-products, low shrinkage rate, mild curing process, can be cured at room temperature or by heating, compatible with automatic glue filling production lines.2、 Typical application scenarios🔸 Pressure sensor encapsulation: used for overall protection of silicon-based chips and circuit board areas, preventing moisture intrusion and mechanical stress damage.🔸 Differential pressure/air pressure sensor packaging: Provides flexible buffering in the packaging cavity to ensure measurement sensitivity and long-term stability.🔸 MEMS、 Micro sensor module: provides stress relief and protective barriers for sensitive components.🔸 Automotive electronic module: suitable for high temperature and high humidity working conditions such as wheel speed sensors and intake pressure sensors. Application case of gel potting4、 Analysis of Technical AdvantagesLeak proof design:…

Pressure sensor sealing solution | SIPC 2130 single component silicone adhesive sealant

In the fields of modern industry and automotive electronics, pressure sensors are widely used as key detection components in hydraulic, pneumatic, refrigeration, oil and gas transportation, automotive braking systems, and other scenarios. Its core function is to accurately perceive changes in external pressure and convert them into electrical signals.However, the sensor contains sensitive circuits and measurement cores inside, which can easily cause performance drift or even failure if exposed to moisture, dust, oil, and vibration for a long time.Therefore, sealing and sealing protection have become key links for the reliable operation of pressure sensors. Application Requirements AnalysisThe sealing material for pressure sensors needs to have the following performance characteristics simultaneously:one ️⃣ Waterproof and moisture-proof – prevent water vapor from entering and causing short circuits or signal drift;two ️⃣ Low hardness and excellent elasticity – balancing mechanical protection and stress buffering of internal components;three ️⃣ Excellent insulation performance – ensuring circuit safety and signal stability;four ️⃣ High and low temperature resistance and aging performance – suitable for complex working conditions from -40 ℃ to 250 ℃;five ️⃣ Single component system, easy to operate – convenient for production automation and batch process control.Recommended product by Yilian: SIPC 2130 silicone adhesive sealantSIPC 2130 is a neutral dealcoholized single component silicone sealant designed specifically for electronic devices and sensors.It performs well in waterproof sealing, dielectric insulation, high and low temperature resistance, chemical corrosion resistance, etc., and is suitable for bonding and potting protection of various substrates (such as metal, ceramic, plastic, PCB). Key Features Low viscosity and good flowability: suitable for comprehensive sealing of complex internal structures;Combining high mechanical strength and flexibility: balancing structural stability with cushioning and shock absorption;Excellent insulation performance: effectively preventing leakage and corona phenomena;Wide temperature range stability: temperature resistance range -60 ℃~220 ℃, suitable for alternating cold and hot environments;Resistant…