Charging module MOS tube bottom heat dissipation adhesive solution | SIPA 1921 thermal conductive silicone
In the current trend of fast charging, continuous miniaturization and high power of power modules, MOS transistors, as core power devices, often need to withstand high currents, high temperatures, and frequent working impacts. The heating problem of MOS transistors directly affects the efficiency and reliability of the entire charging module. If the heat dissipation is not timely, there may be a risk of excessive temperature rise, device performance degradation, or even failure.Therefore, how to achieve efficient heat dissipation at the bottom of MOS transistors while balancing adhesion and reliability has become a focus of attention for major power supply manufacturers.Background and ChallengesIn practical applications, there are several common solutions for heat dissipation at the bottom of MOS tubes in charging modules, including:Thermal pad: requires manual cutting and screw fixation, making assembly complex;Gap Filler: Similar to a soft cushion after curing, it has thermal conductivity but no adhesive force;RTV thermal conductive silicone: has adhesive properties, but has a long curing time at room temperature, which is not conducive to mass production;Thermal conductive silicone grease: It has good thermal conductivity in the initial stage, but it is prone to drying out after high temperature and long-term aging, resulting in a significant decrease in thermal conductivity.These traditional methods either have complex processes or lack long-term reliability, and cannot simultaneously meet the needs of “bonding+thermal conductivity+reliability”.Solution: SIPA 1921 high thermal conductivity siliconeTo solve this problem, a customer introduced Elaplus SIPA 1921 single component high thermal conductivity silicone gel in the bottom heat dissipation bonding process of MOS tubes.This material adopts a thermosetting and molded silicone system, and achieves a balance between high thermal conductivity and high strength adhesive force through a special liquid powder two-phase combination process. Bottom heat dissipation adhesive of MOS tube in charging module120 ℃ can cure in 30 minutes, greatly…
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