Potting Compound for Automotive Connector
Automotive connectors are an important component of automotive electronic systems, mainly used to transmit electrical signals and power, ensuring stable connections between various electronic devices. They are designed to be compact, durable, and have features such as waterproof, dustproof, and shockproof to adapt to complex in car environments. Widely used in engine management, vehicle electronics, intelligent driving and other fields, automotive connectors play a key role in ensuring vehicle safety and high-performance operation.What is connector encapsulation?The sealing process refers to the use of epoxy adhesive, resin, or other similar compounds to fill a certain area into a hard and stable state, thereby forming an effective barrier. In the field of connectors, the encapsulation process is usually used on the back of the connector, which is called back encapsulation. Its main purpose is to enhance the overall firmness of the connector, improve retention force through encapsulation, ensure a more stable connection, and provide additional protection for cables and contacts.The main protective function of connector encapsulation compoundsWaterproof: Block moisture penetrationCorrosion resistance: resist chemical corrosionAnti wear: Extend service lifeHigh temperature resistance: to cope with hot environmentsThermal shock resistance: resisting the effects of sudden temperature changesAnti vibration: maintain stable connectionResistance to mechanical impact: providing additional structural supportThe best time to use connector encapsulation and protective coatingConnector back design: Typically designed with retaining walls or extension walls to accommodate liquids when the potting compound solidifies.Cover protection: Cable connectors are generally equipped with a cover, and sealing can be carried out inside the cover to enhance overall protection.Temporary retaining wall: A temporary retaining wall can be built around the rear of the connector to ensure that the sealing compound does not overflow during the curing process.Special layout: For situations where not all contacts are wired, designing appropriate encapsulation channels can help the compound flow through the…
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