Motor Lead‑Wire & Neck‑Section Adhesive Selection | High‑Temp, Oil‑Resistant & Anti‑Sagging Grade Recommendations

Adhesives for motor lead‑wire fixing and neck‑section encapsulation shall be selected according to dispensing position, adhesive thixotropy, long‑term temperature resistance, oil resistance, lead‑wire material and curing process. For flexible fixation of heat‑shrinkable tubes and lead wires, evaluate Elaplus SIPC 1823. EP 1770‑1K is recommended for the neck‑section of brushless motors. EP 1770H‑1K can be applied for inter‑slot sealing of DC motor rotors. For motor housings or sealing positions exposed to oil media, evaluate SIPC 1887. Why Motor Lead‑Wires Require Fixation During motor operation, coil lead‑wires are subjected to continuous loads induced by vibration, electromagnetic force, thermal expansion‑contraction and high‑speed rotor motion. Without fixation at the lead‑wire root, the following failures may occur: Lead‑wire fixing adhesives shall maintain proper flexibility and shall not form rigid bending boundaries at lead‑wire roots. Recommended Grade for Brushless‑Motor Lead‑Wire Fixation SIPC 1823: One‑Component Silicone Lead‑Wire Fixing Adhesive SIPC 1823 is a one‑component silicone adhesive featuring fast tack‑free time and good bonding performance for heat‑shrinkable tubes. According to the datasheet, its viscosity is approx. 35 000 cps with service temperature ranging from ‑60 ℃ to 200 ℃. Suitable for: Note: The motor application schematic page of the datasheet marks SIPC 1822, whereas the parameter sheet lists SIPC 1823. Always confirm the final grade against the latest TDS for formal release, sampling and quotation. Recommended Grade for Brushless‑Motor Neck‑Section Encapsulation EP 1770‑1K: High‑Thixotropy Heat‑Curing Epoxy Adhesive EP 1770‑1K is a one‑component heat‑curing epoxy adhesive. It resists flow at ambient temperature and delivers moderate slight slump upon heating. Per datasheet, viscosity is approx. 150 000 cps; recommended curing profile: 120 ℃ for 60 minutes. Suitable for: Its rheological design of “no flow at room temperature, slight slump under heating” enables the adhesive to stay in place after dispensing, while achieving moderate wet‑out over coil surfaces during curing temperature rise. Recommended Grade for DC‑Motor Inter‑Slot Sealing…