How to Select Potting Compounds for EV Charging Guns?Recommended Grades for Charging Connectors, Charging Piles and OBC

Different materials shall be adopted for various positions within charging systems. PUR 1645 is suitable for potting of charging gun housings; PUR 1660 GR can be evaluated for applications requiring low viscosity and extended pot life. EP 1788 is recommended for charging sockets. The SIPA 1850 series is an option for inductors inside charging piles. PUR 1680 or SIPA 1850 can be used for thermally conductive potting of OBC units. Why Flexibility and Flame Retardancy Are Emphasized for Charging Gun Potting? Charging guns are continuously subjected to: Although high-hardness materials deliver strong fixing performance, they tend to generate localized stress upon drop impact. PUR 1645A/B Elaplus PUR 1645 is a 100:10 two-component polyurethane potting compound. It features outstanding flexibility after curing and complies with UL94 V-0 flame retardancy standard.It is therefore ideal for charging gun cavity potting. PUR 1660 GR PUR 1660 GR is a 1:1 two-component polyurethane potting compound characterized by low viscosity, long pot life and favorable temperature & weather resistance.This grade is recommended for evaluation on charging guns with intricate internal structures where full penetration of encapsulant into narrow gaps is required. Recommended Adhesive for Charging Sockets EP 1788A/B EP 1788 is a 100:15 two-component epoxy potting compound with: Recommended Grade for Charging Pile Inductors SIPA 1850A/B Series SIPA 1850 (30#) is designed for charging pile inductor potting with thermal conductivity of approximately 3.0 W/m·K. Additional variants such as SIPA 1850 (20#) offer thermal conductivity around 2.0 W/m·K as specified in the full product datasheet.Different thermal conductivity grades can be selected according to inductor heat generation, encapsulant thickness and thermal design requirements. Potting Adhesives for OBC Modules Recommended options:PUR 1680A/B Two-Component Polyurethane Potting Compound100:16 thermally conductive polyurethane encapsulant, medium hardness and high elasticity; thermal conductivity: 0.8～1.2 W/m·K. SIPA 1850A/B Two-Component Silicone Thermally Conductive Potting Compound1:1 addition-cure silicone…