Selection Guide for IC Chip & Electronic Component Reinforcement Adhesives: Epoxy vs UV Silicone
Why IC Chips & Electronic Components Require Reinforcement In chips, sensors, connectors and precision electronic assemblies, solder joints, pins and dissimilar material interfaces are vulnerable to vibration, mechanical shock, thermal cycling and moisture. Applying adhesives to reinforce chip corners, component undersides, pin root bases and plastic-metal joints delivers the following benefits: ■ Secure fixation of IC chips and electronic components ■ Reduce mechanical stress borne by solder joints ■ Boost assembly resistance to vibration and impact ■ Provide electrical insulation, moisture resistance and sealing protection ■ Enhance structural stability under wide temperature cycling However, reinforcement locations impose different requirements on adhesive flowability, hardness and curing methods. LILIAN offers three specialized formulations for diverse electronic reinforcement processes: EP 1738-1, EP 2090 and SIPC UV 3302. EP 1738-1: Ideal for IC Corner Bonding & Dam Reinforcement EP 1738-1 is a black, solvent-free, heat-curable single-component structural epoxy adhesive. four-corner bonding of IC chips At 25°C, its viscosity ranges from 300,000 to 450,000 mPa·s with vertical sag less than 0.1 mm, delivering excellent thixotropy. It resists uncontrolled spreading after dispensing, making it perfect for applications requiring precise control over dot shape and coverage. Typical Applications: ■ Four-corner bonding of IC chips ■ Edge reinforcement for integrated circuits ■ Chip underfill ■ Chip dam encapsulation ■ Pressure sensor bonding ■ Local fixation of electronic components Post-curing hardness reaches Shore D 85±5, with a glass transition temperature of approximately 105°C and long-term service temperature ranging from -50°C to 180°C. Its steel-to-steel shear strength hits 22 MPa at 25°C, suiting reinforcement sites demanding superior structural strength and anti-sag performance. EP 2090: Structural Reinforcement for Plastic-Metal Electronic Assemblies EP 2090 is a two-part room-temperature-curable epoxy adhesive mixed at a 1:1 weight or volume ratio of Part A to Part B housing sealing It bonds a broad spectrum of substrates including ceramics, metals, glass, plastics and rubbers, with outstanding compatibility…
