How to Select Thermal Gel, Thermal Pad and Thermal Putty? Recommended Grades of Electronic Thermal Materials

Electronic thermal interface materials shall be selected based on interface gap, assembly pressure, rework requirements, thermal conductivity, dispensing process and component stress. Elaplus TCMP thermal gel is recommended for irregular gaps and automated dispensing. TCMP 3375 can be evaluated for applications with high heat flux and curing positioning demands. GP 50 thermal putty suits large gaps and reworkable structures. GP 600 thermal pads are ideal for fixed-thickness mass assembly. If both thermal conduction and bonding are required, SIPA 1921 or SIPC 1928 are available options. Why Thermal Interface Materials Are Needed Even With Heatsinks Surfaces of chips, power modules and heatsinks look flat visually, yet they feature numerous micro bumps and air voids at the microscopic level. Air has poor thermal conductivity. Direct contact between chips and housings leads to insufficient effective contact area and high interfacial thermal resistance. Thermal gels, thermal pads and thermal putty fill these voids to form continuous thermal conduction paths. Suitable Applications for Thermal Gel TCMP Two-Part Thermal Gel Series TCMP series adopts a 1:1 mixing ratio and offers multiple thermal conductivity grades to match different thermal design targets. Key Features Recommended Applications: 1、IGBT and power modules; 2、ECU, MCU and automotive controllers; 3、Communication base stations; 4、Optical modules; 5、AI server boards; 6、LED driver power supplies. TCMP 3375: Curable High-Thermal-Conductivity Gel As specified in the datasheet, TCMP 3375 is a one-part curable thermal gel with thermal conductivity of approx. 7.5 W/m·K, viscosity ranging from 280,000 ~ 350,000 cps and cured hardness of Shore 00 50. Recommended Applications： 1、High heat-flux chips; 2、Interfaces requiring shape retention after dispensing; 3、Structures where material migration or pump-out shall be avoided; 4、Long-term thermal conduction between chips and heat dissipation housings. Suitable Applications for Thermal Putty GP 50: Pre-Cured Thermal Putty GP 50 is a one-part pre-cured thermal putty with thermal conductivity of approx….