EP 6102 5:1 general type epoxy potting compound,this compound can be cured by room temperature, the curing process is low temperature,low shrinkage rate.
Solid surface light, not cracking, moisture proof, insulation
This compound can be cured by room temperature, the curing process is low temperature,low shrinkage rate. Solid surface light, not cracking, moisture proof, insulation
Feature
This product is non-dangerous goods and is transported and saved according to general chemicals.
shelf life is 12 months under 25 ℃. Please take a sample test before storage.
Black and white adhesive, in the stored procedure will have settlement, is normal phenomenon, can be inverted on a regular basis, can reduce settlement.
Application
Used for general electronic components filling and sealing of circuit boards. Room temperature can be cured, the curing process is low temperature, low shrinkage rate. Solid surface light, not cracking, moisture proof, insulation.