As data centers evolve towards 400G, 800G, and even 1.6T rates, the power consumption and heat generation of optical modules have sharply increased, and thermal management has become a key bottleneck restricting the performance of optical communication systems. As a professional electronic adhesive supplier, ELAPLUS has launched high-performance thermal conductive material solutions for optical module thermal management, helping you easily cope with high-power density heat dissipation challenges.
The core challenges faced by thermal management of optical modules
During the operation of high-speed optical modules, key components such as DSP chips and TOSA/ROSA components generate a large amount of heat. If heat cannot be dissipated in a timely manner, it will cause device temperature rise, wavelength drift, signal distortion, and seriously affect communication quality and product life. The current thermal management of optical modules faces the following core challenges:
space-constrained
high power
High power density: With the increase of transmission rate, the power consumption of optical modules has increased from a few watts to over ten watts or even higher, and the heat is highly concentrated.
Space limitation: The volume of the optical module is constantly shrinking, and the heat dissipation space is limited, which puts higher requirements on the thickness and compressibility of the thermal conductive material.
Low volatility requirement: Ordinary silicone materials will release silicone oil at high temperatures, which may contaminate optical lenses and cause signal attenuation.
Heavy industry demand: The production process of optical modules is complex and requires thermal conductive materials with good reworkability to facilitate rework.
Reliability requirement: Outdoor communication equipment needs to operate stably within a wide temperature range (-40 ℃ to+85 ℃).
Yilian Optical Module Thermal Conductive Material Product Matrix
Elion ELAPLUS launched TCMP series high-performance thermal conductive gel products for optical module thermal management applications, which have excellent performance such as high thermal conductivity, low volatility, and can be reworked, and can meet the heat dissipation requirements of 400G, 800G and even higher rate optical modules.
ELAPLUS TCMP 33606.2W/M·K
Product type: one component heat curing silicone heat conduction gel
Thermal conductivity: 6.2 W/m · K
Hardness: Low hardness, excellent compressibility
Temperature resistance range: -40 ℃ to+200 ℃
Low volatility: Low silicone oil volatility, protecting optical components
Application thickness: can be compressed to a thickness of 250 microns
Typical applications: 400G QSFP-DD optical module, 5G front/middle transmission optical module, data center switch optical port, automotive electronic module
ELAPLUS TCMP 33808.4W/M · K Heavy Industry
Product type: one component heat curing silicone thermal conductive gel (reusable)
Thermal conductivity: 8.4 W/m · K
Heavy Industry: After curing, it has appropriate tensile strength and elongation, and is easy to peel off without residue
Temperature resistance range: -40 ℃ to+200 ℃
Low volatility: Low silicone oil volatility, protecting optical components
Application thickness: can be compressed to a thickness of 250 microns
Typical applications: 800G OSFP optical module, 1.6T optical module, high-power LiDAR, data center core switch
Performance Comparison between TCMP 3360 and TCMP 3380
Project TCMP 3360 TCMP 3380
Thermal conductivity 6.2 W/m · K 8.4 W/m · K
Excellent repeatability (easy to peel off without residue)
Low volatile matter, extremely low
Temperature resistance range -40 ℃~+200 ℃ -40 ℃~+200 ℃
Minimum application thickness 250 μ m 250 μ m
Recommended application: 400G optical module, 5G base station 800G/1.6T optical module
Typical application areas
Elion TCMP series thermal conductive gel is widely used in the field of optical communication, providing reliable thermal management solutions for various high-speed optical modules.
Consumer Electronics Thermal Management
Thermal conductive gel semiconductor
Application of led thermal conductive gel
Data center: 400G/800G QSFP-DD, OSFP optical modules, switch optical port heat dissipation
5G communication: thermal management of 5G base station optical modules, front/middle/back transmission equipment
Fiber optic access: GPON, EPON optical modules, Fiber to the Home (FTTH) devices
Lidar: Vehicle mounted LiDAR, high-power laser heat dissipation
Automotive electronics: In car optical module, intelligent driving perception system
Open a new chapter in thermal management of optical modules
ELAPLUS is committed to providing high-performance thermal conductive material solutions for the optical communication industry. The TCMP 3360 and TCMP 3380 products can effectively solve the heat dissipation problem of 400G, 800G, and even higher speed optical modules, helping your products stand out in the fierce market competition.
Label: 400G optical module · 5G base station heat dissipation · 6.2W heat conduction · 8.4W heat conduction · 800G optical module · ELAPLUS · OSFP · QSFP-DD · TCMP 3360 · TCMP 3380 · optical module heat dissipation · optical module heat management · single component heat conduction gel · reusable heat conduction gel · domestic substitution · heat conduction gel · heat conduction materials · data center heat dissipation · Elaplus · silicone heat conduction gel
