In modern manufacturing, adhesives are no longer just adhesive materials, but also one of the core processes for improving product reliability, durability, and protective performance. Especially in high-precision industries such as electronics, electrical, automotive, and new energy, higher requirements have been put forward for the performance of adhesives.
Single component epoxy adhesive is a pre mixed epoxy resin system that does not require manual mixing and can be quickly cured by heating. It is suitable for various industrial applications such as automated production, precision manufacturing, electronic packaging, and structural bonding.
1、 What is a single component epoxy adhesive? One component epoxy adhesive is a pre mixed epoxy resin system at the factory, which does not require secondary mixing by the user and can be used directly. It is usually cured by heating. This type of adhesive is stable when stored at room temperature for a long time, and only reacts quickly at a certain temperature to form a high-strength structure. Compared with traditional two-component adhesives, single component products greatly simplify the operation process, avoid human proportioning errors, and improve production efficiency, especially suitable for automated dispensing, sealing, or coating systems.
2、 The core advantages of single component epoxy adhesive
✅ 1. Convenient operation and efficient production No need for weighing and mixing, ready to use, greatly reducing the operating threshold and working time, especially suitable for assembly line operations and automation equipment, can significantly improve unit production capacity.
✅ 2. Fast curing, adjustable control Most products are cured by heating (such as 80 ℃/30 minutes or 120 ℃/10 minutes), and the curing window can be flexibly set according to the actual production cycle, supporting efficient batch processing.
✅ 3. Strong adhesion and wide applicability Epoxy system has excellent polarity and excellent adhesion to various substrates such as metals, ceramics, glass, engineering plastics, etc. It can achieve structural bonding and is widely used in electrical components, motors, sensors, transformers and other fields.
✅ 4. Excellent electrical performance and reliable packaging The solidified colloid usually has good insulation, moisture resistance, and heat resistance, and is suitable for insulation packaging, moisture-proof protection, shock reinforcement, and other working conditions of electronic components.
✅ 5. Strong environmental resistance After curing, single component epoxy adhesive has excellent resistance to moisture, aging, and chemical corrosion, especially suitable for harsh environments such as high temperature, high humidity, high salt spray, and high impact.
3、 Typical application areas
🔹 Power&Transformer Packaging Used for encapsulating electronic transformers, inductors, power modules, etc., to enhance electrical insulation, thermal stability, and moisture resistance.
🔹 Motor motor bonding Adhesive key components such as stator, rotor, and magnet have high shear strength and heat resistance, effectively improving the operating life of the motor.
🔹 Sensor packaging Used for internal sealing of microstructures such as pressure sensors, acceleration sensors, MEMS devices, etc., with strong fluidity and no cracking or peeling after curing.
🔹 LED packaging/structural bonding Suitable for LED bead fixation, circuit board bonding, thermal conductive structural layers and other fields, meeting UL flame retardant/ROHS environmental protection requirements.
🔹 Automotive electronic module Encapsulating or bonding electronic control components such as ECU, BMS, and driver modules, they perform excellently under requirements of high and low temperature resistance, impact resistance, and long lifespan.
4、 How to choose a suitable single component epoxy adhesive? The requirements for adhesive performance vary greatly in different application scenarios. The following are several key selection dimensions:
Application direction Recommended parameter description
Adhesive structure strength shear strength ≥ 15MPa meets the requirements of bearing and vibration impact
Electronic packaging insulation strength>20kV/mm to ensure voltage resistance High temperature environments temperature resistance of ≥ 150 ℃, such as automobiles, motors, and high-power modules
Rapid curing time ≤ 10 minutes @ 120 ℃ to increase production pace
Liquidity requirements: low viscosity or slow flow type to meet the needs of dispensing and poting
Environmental regulations ROHS/REACH/halogen-free meet international standards for export requirements
🧪 Some high-end products also require technical thresholds such as UL 94 V-0 flame retardant certification, low CTE coefficient of thermal expansion, and thermal conductivity requirements.
5、 Recommended popular products of Elaplus
Model Features Curing Conditions Bonding Strength Application Examples
EP 1750 has excellent low-temperature impact performance and toughness, suitable for folding and structural bonding in the automotive industry at 180 ℃/30min
EP 1767 has excellent adhesive performance, electrical performance, moisture resistance, and mechanical performance. It can be used for automotive electronics, pressure sensors, connecting wire harnesses, motor magnet bonding, and fixing inductors at 120 ℃/1h
EP 1761 has strong toughness after curing, with high bonding strength, impact resistance, vibration resistance, good insulation, and compression resistance at the bonding site. It can be used for automotive electronics, pressure sensors, connecting wire harnesses, and motor magnetic sheet bonding at 120 ℃/1h EP 1788 has a low water absorption rate, good waterproof, moisture-proof, electrical insulation, and thermal stability. It is suitable for packaging high motors, automotive electronics, power tools, reactors, instruments, etc. at 80 ℃/2h
6、 Precautions for use It is recommended to store under low temperature conditions (2-8 ℃) to prolong the colloidal stability. Preheat to room temperature before use to avoid condensation affecting the bonding effect. After dispensing, try to complete heating and curing within 30 minutes to prevent moisture absorption from affecting performance. If further processing is required after curing, it is recommended to wait for 24 hours for complete stabilization before proceeding.
7、 Conclusion Under the current trend of intelligent, lightweight, and electrified manufacturing, single component epoxy adhesives are becoming the new protagonists in the fields of bonding and packaging. With its simple operation, superior performance, and strong adaptability, it has been widely used in key industries such as electronics and electrical, automotive industry, new energy equipment, and industrial automation. If you are looking for a high reliability, batch production friendly adhesive solution, single component epoxy adhesive is undoubtedly a preferred choice.
Tag: Single component epoxy adhesive
