— Liquid thermal conductive gel pad TCMP 1935 boosts the high-reliability electronic system industry. Background and challenges With the high integration of automotive electronics and the continuous increase in power density, the heat generated by semiconductor ECU (Electronic Control Unit) during operation rapidly increases.
In practical applications, ECU thermal management often faces the following challenges:
🔥 Severe local heat concentration: There are assembly tolerances between the chip, power module, and heat sink, making it difficult for traditional thermal pads to fully fit.
⚠️ High mechanical stress risk: High-hardness materials are prone to stress damage to solder joints and chips during compression.
🛠️ Difficult and costly rework: Once assembled, traditional thermal pads are complex to rework and repair, affecting yield.
🤖 Inadequate automation adaptation: Solid materials are not conducive to high-speed, fully automated production line applications. Against this backdrop, liquid thermal gel pads are gradually becoming the mainstream choice for thermal management in the new generation of ECUs.
Application scheme: Recommended product for thermal gap filling: TCMP 1935 liquid thermal gel gasket
TCMP 1935 is a two-component liquid thermal gel gasket specifically designed for high-reliability applications such as semiconductor ECUs, automotive electronics, battery systems, and communication equipment. With a thermal conductivity of up to 3.5 W/mK, it achieves an excellent balance between thermal performance and reliability.
Product Core Advantages
🌡️ Highly Efficient Heat Conduction, Stable and Reliable Thermal Conductivity Coefficient 3.5 W/mK Effectively fills the tiny gaps between devices and heat dissipation structures Significantly reduces junction temperature and enhances the long-term operational stability of ECUs
🧩 High Adaptability, Eliminates Assembly Tolerances Liquid form allows for full flow, self-adapts to complex surfaces Achieves good contact with almost no compression force required Effectively protects solder joints, chips, and precision electronic components
🧘 Low Stress Design, Cares for Sensitive Devices Thixotropic system, low stress application Low hardness and slightly viscous properties are particularly suitable for semiconductor packaging sensitive to mechanical stress
🔁 Reworkable and Repairable, Reduces Overall Costs Achieves perfect rework and repair Significantly reduces the comprehensive cost due to repair and replacement Automatically controllable material supply, reduces material waste
🤖 Thermal Interface Material for Industry 4.0 1:1 Two-component mixing (thixotropic) Rapid curing, can be accelerated by heating Suitable for fully automated dispensing and assembly systems Meets high-speed, intelligent production needs View TCMP 1935
Label: 3.5W Thermal Conductive Material · TCMP 1935 · Low Stress Thermal Conductive Adhesive · Semiconductor ECU Thermal Management · Thermal Conductive Sealant Material · Industry 4.0 TIM · Automotive Electronics Thermal Management · Liquid Thermal Conductive Gel Gasket
