Solid tantalum capacitors are one of the most popular surface mount capacitors in consumer electronics, automotive, aerospace and medical equipment. They are widely used due to their high performance and miniaturization.
History of Tantalum Capacitors
The concept of tantalum capacitors dates back to the 1950s, when Bell Labs invented the technology to develop a compact capacitor for transistors. The unique structure of tantalum capacitors utilizes sponge-like tantalum material to greatly increase the surface area, thereby providing a higher capacitance density than other technologies. This innovation greatly improved the miniaturization of electronic devices.
Basic Structure of Tantalum Capacitors
Tantalum capacitors are electrolytic capacitors, so they are polar, meaning that current can only flow from the positive electrode (anode) to the negative electrode (cathode). The core structure of a tantalum capacitor consists of three main parts: anode, dielectric, and cathode.
Anode: Usually made of high-purity tantalum powder, it is pressed and sintered into a sponge-like structure, which greatly increases the effective surface area. In traditional designs, the anode is connected to the circuit through a tantalum wire.
Dielectric: A layer of tantalum pentoxide (Ta2O5) is formed on the surface of the anode, which serves as a dielectric layer.
Cathode: In traditional solid tantalum capacitors, the cathode material is manganese dioxide (MnO2), which is then coated with materials such as carbon and silver to establish an electrical connection to the circuit.
Challenges and Solutions for Tantalum Capacitors
These devices require tantalum capacitors to have high reliability, stability, and miniaturization, and to operate stably under high temperatures, harsh mechanical environments, and long-term working conditions. In order to ensure the structural integrity and electrical performance of tantalum capacitors during assembly and operation, the selection of growth barrier glue and die attach glue is critical.
SIPA 8708 is a growth barrier adhesive specifically used inside tantalum capacitors. Its purpose is to effectively block the growth or diffusion of materials during high-temperature sintering or assembly processes to maintain the geometry and structural stability of the device.
Product Features:
▶ Single component semi-flow, fast heating and curing
▶ Black silicone elastomer adhesive
▶ Can bond to more substrates without primer, such as stainless steel, glass, ceramics, etc.
▶ Excellent flexibility and tear resistance
▶ Addition curing system: no curing by-products
▶ Obtained FDA food certification, passed ROHS\REACH certification
▶ Maintain elasticity and stability in the temperature range of -60℃~+280℃
SIPA 9446 is an adhesive for tantalum capacitor chips designed to ensure a strong connection between the chip and other components and to withstand mechanical stress, thermal shock and long-term working environment.
Product Features:
▶ Single component semi-flow, fast heating and curing
▶ Can bond to more substrates without primer, such as stainless steel, glass, ceramics, etc.
▶ Excellent flexibility and tear resistance
▶ Addition curing system: no curing by-products
▶ FDA food certification, ROHS\REACH certification
▶ Maintains elasticity and stability in the temperature range of -60℃~+280℃
