01 | What is thermal conductive epoxy structural adhesive?
Thermally Conductive Epoxy Structural Adhesive is a high-performance adhesive material that uses epoxy resin as the matrix, adds high thermal conductivity fillers, and forms a dense three-dimensional network structure through crosslinking reactions with curing agents.
Its material essentially consists of three types of properties:
① Structural Strength
High shear strength, high peel strength
Anti impact, anti vibration, anti fatigue
Dimensional stability for long-term service
It can replace traditional mechanical fixing methods such as screwing, riveting, and welding.
② Thermal Conductivity
Thermal conductive fillers (such as Al ₂ O3, BN, AlN) form a continuous thermal conduction chain during the curing process, giving the material significantly higher thermal conductivity than ordinary epoxy.
This function is used for heat transfer of heating components and reduction of interface thermal resistance.
③ Epoxy system functionality (Chemical&Environmental Stability)
The epoxy matrix forms a stable three-dimensional structure through cross-linking and curing, with:
Good temperature resistance
Excellent electrical insulation capability
Resistant to media, moisture and heat, and aging performance
Make it suitable for long-term complex environments.
02 | Curing mechanism and interface bonding principle
Thermal conductive epoxy structural adhesives often use two-component A/B formulations.
The standard mixing ratio of Yilian EP 2010A/B high thermal conductivity epoxy structural adhesive is 100:50 (weight ratio).
The curing mechanism includes:
① Epoxy ring opening and crosslinking reaction
The mixed epoxy group and curing agent undergo ring opening polymerization, and the system changes from liquid to gel to solid, finally forming a high modulus three-dimensional cross-linking structure.
② Construction of Thermal Conductive Network
High thermal conductivity fillers form a continuous heat transfer chain during the solidification process of the system, enabling the solidified body to effectively transfer heat outward.
③ Surface interface chemical bonding
Epoxy has high polarity and is compatible with metals, ceramics SMC、 Chemical bonding or polar adsorption is formed between composite materials and other substrates to improve interfacial stability.
03 | EP 2010A/B: Representative of Typical Thermal Conductive Epoxy Structural Adhesive
Yilian EP 2010A/B high thermal conductivity epoxy adhesive is a two-component thermal conductive structural adhesive developed for the high reliability manufacturing industry, suitable for both room temperature curing and heating curing process routes.
The core features include:
① High structural bonding strength
Suitable for various substrates such as metal, SMC fiberglass, composite materials, ceramics, etc., it has stable high-strength bonding ability after curing.
② Excellent thermal conductivity
The internal thermal conductive filler endows it with significant thermal diffusion ability, providing stable interface thermal management for heating components.
③ Outstanding temperature resistance and reliability
Maintain long-term structural stability in high and low temperature cycles, vibration and shock, and humid and hot environments, suitable for harsh working conditions such as power motors and power modules.
④ Strong process adaptability
Supports room temperature curing, suitable for non drying room processes
Support heating and solidification to improve production line rhythm
The rheological properties of the slurry are suitable for processes such as dispensing, coating, and sealing
Enable it to flexibly adapt to various production environments.
Thermal conductive epoxy structural adhesive is a comprehensive material system that achieves equipment structural integrity, thermal management capability, and long-term reliability, especially suitable for equipment manufacturing with high power density, lightweight, and high sealing requirements.
Elaplus EP 2010A/B, as a representative material, relies on its:
Structural level bonding ability
Stable thermal conductivity network
Strong temperature and environmental resistance
Multi material adaptability
It has been widely used in key industries such as electric drive for new energy vehicles, motors, energy storage, power control, ceramic filter components, and intelligent sensors.
Tags: EP 2010A/B · Thermal Conductive Epoxy · Thermal Conductive Epoxy Structural Adhesive · Epoxy Adhesive · Motor Magnetic Tile Adhesive · Structural Adhesive · Lithium Battery Module
