With the miniaturization and high performance of electronic devices, PCBs (printed circuit boards) are facing higher thermal management requirements. In this context, high thermal conductivity adhesive has gradually become an indispensable material in the electronics industry. Among them, SIPC 1917 has become an ideal choice for PCB thermal management and structural bonding due to its outstanding performance. This article will provide a detailed introduction to the characteristics, application areas, and importance of selecting high thermal conductivity adhesive for SIPC 1917.
PCB high thermal conductivity adhesive
What is high thermal conductivity adhesive?
High thermal conductivity adhesive is a material that combines thermal conductivity and adhesion, used to firmly fix electronic components on substrates or heat sinks, while efficiently conducting heat. It is usually composed of a polymer matrix (such as epoxy resin, polyurethane, etc.) and a thermal conductive filler (such as alumina, boron nitride, etc.).
The core characteristics of SIPC 1917
SIPC 1917 titanium ester system dealcoholized organic silicon adhesive sealant is an organic silicon sealing material that absorbs moisture from the air and releases trace amounts of methanol during the curing process at room temperature. It has good adhesion and sealing performance for most plastic, metal and other materials, protecting electronic products in a stable state under harsh conditions. During the curing process, trace amounts of methanol substances are released, which are non corrosive to materials such as polycarbonate (PC) and copper, and do not release irritating gases. The product has passed UL 94V-0 flame retardant certification
Characteristics of Thermal Conductive Adhesive Products
▶ Good extrusion performance and high thermal conductivity
▶ Excellent chemical resistance and good adhesion
▶ Resist moisture, dirt, and other atmospheric components
▶ Reduce mechanical stress and tension caused by mechanical, thermal shock, and vibration
▶ Excellent outdoor aging resistance, with a service life of up to 20-30 years
▶ Seismic resistance, corona resistance, leakage resistance, excellent insulation performance
▶ Stable mechanical and electrical performance between -60-200 ℃
Why choose SIPC 1917?
Improve equipment reliability
SIPC 1917 reduces the risk of thermal damage to electronic devices and improves the long-term stability of the system through efficient thermal conductivity and strong adhesion.
- Optimize thermal management efficiency
Excellent thermal conductivity enables devices to dissipate heat more efficiently and extend the lifespan of components. - Simplify production process
The single component design and flexible curing method make SIPC 1917 easy to apply in large-scale production environments. - Meet environmental requirements
The low VOC characteristics of SIPC 1917 comply with modern environmental regulations and are an ideal choice for sustainable development.
Summary
SIPC 1917, as a high-performance PCB high thermal conductivity adhesive, has demonstrated excellent performance in thermal management and structural bonding, especially suitable for high demand electronic devices and industrial applications. Its high thermal conductivity, strong adhesion, and environmental characteristics provide a reliable thermal management solution for modern electronic devices.
If you need to learn more about SIPC 1917 or procurement details, please feel free to contact our technical team at any time.
Label: PCB Thermal Conductive Adhesive · PCB High Thermal Conductive Adhesive · Thermal Conductive Adhesive · Organic Silicon Adhesive
