In the trend of miniaturization and high integration of modern electronic products, the protection of electronic components has become particularly important. The dam enclosure and sealing process, as important means in the field of electronic protection, provides comprehensive protection for electronic products, effectively improving their reliability and service life.
Dam enclosure technology: building a solid defense line
The enclosure process, as the name suggests, is to form a “dam” around electronic components or circuit boards to restrict the flow range of subsequent sealant. This’ dam ‘is usually formed by colloids with high viscosity, which not only ensures that the sealant evenly covers the target area, but also avoids colloid overflow and contamination of non target areas.
The role of dam enclosure technology:
Precise control of sealing range: The dam sealant can precisely define the sealing area, avoiding the sealant from flowing into areas that should not be covered, such as connectors, heat sinks, etc., ensuring the functional integrity of the product.
Save material costs: By limiting the amount of sealant used, reduce colloid waste and thus lower production costs.
Improving product aesthetics: The dam can make the edges of the sealant neat and beautiful, enhancing the overall appearance quality of the product.
Enhance local protection: For certain areas that require local key protection, a dam can form a thicker protective layer, providing stronger mechanical support and environmental protection.
Elaplus SIPC 2150 dam sealant: Building a solid foundation for protection
In order to meet the demand for high-performance protection in electronic products, Elaplus has launched SIPC 2150 single component dealcoholized/environmentally friendly sealant silicone as an ideal choice for dam enclosure processes.
As a neutral dealcoholized adhesive sealant, SIPC 2150 has excellent mechanical properties and excellent adhesive sealing performance for PC, PA plastic, concrete, wood, felt, EVA foam, metal (iron, aluminum, stainless steel) and other materials.
Core advantages of SIPC 2150:
Low odor, low white mist, environmentally friendly and safe.
Excellent resistance to engine oil, transformer oil, acid and alkali, ensuring stable operation in harsh environments.
Excellent insulation performance, moisture-proof, dustproof, and anti corona, effectively protecting electronic components.
Low volatility, no yellowing, high transparency, maintaining the appearance quality of the product.
Wide temperature resistance range (-60~260 ℃), suitable for various extreme environments.
Excellent aging resistance, with a service life of up to 20-30 years.
Complies with UL flame retardant HB rating (yellow card number E547224), enhancing product safety factor.
After solidification, the colloid has excellent resistance to chemical solvents and provides long-lasting protection.
RTV SIPC 2130 sealant: a solid fortress for the internal core
After the completion of the dam construction, RTV SIPC 2130 flow type single component dealcoholization/environmentally friendly silicone can play its sealing role, providing comprehensive and deep protection for electronic components.
As a neutral adhesive sealant, SIPC 2130 has excellent mechanical properties and demonstrates outstanding bonding and sealing capabilities for various materials.
The prominent features of SIPC 2130 are:
Low viscosity, good flowability, able to easily fill gaps in complex structures, with no blind spots to cover.
High physical and mechanical properties, forming a tough protective layer after curing.
Excellent insulation performance, effectively preventing electrical short circuits and interference.
Moisture proof, dust-proof, corona proof, and earthquake resistant buffering function, providing comprehensive protection for internal components.
Good resistance to high temperature and humidity, stable electrical performance, ensuring normal operation in harsh environments.
Wide range of high and low temperature resistance (-60~220 ℃), strong adaptability.
Excellent aging resistance, with a service life of up to 20-30 years.
After solidification, the colloid does not yellow or leak oil, keeping the product clean and beautiful.
Compliant with food grade certification and environmental protection certification, safe and non-toxic, widely used.
Strong alliance: the perfect partner for dam enclosure and sealing
The combination of Elaplus SIPC 2150 dam sealant and RTV SIPC 2130 sealant provides an unparalleled protection solution for electronic components.
This combination of “dam enclosure+sealing” can not only effectively prevent external environmental factors such as water vapor, dust, and chemical corrosion from corroding electronic components, but also provide excellent insulation, seismic buffering, and other protection, greatly improving the reliability and service life of electronic products.
Key points of strong alliance:
Synergistic efficiency: SIPC 2150 is responsible for building a solid “exterior wall” and accurately controlling the sealing area; SIPC 2130 serves as an ‘internal filler’, providing comprehensive and deep protection. The two work together to achieve the best protective effect.
Good compatibility: Both products are dealcoholized silicone with similar curing mechanisms, good compatibility, and are not prone to adverse reactions.
Comprehensive protection: Combining the excellent mechanical performance of SIPC 2150 with the excellent fluidity and electrical performance of SIPC 2130, it forms an indestructible protective layer to resist various external threats.
Widely applicable: Suitable for multiple fields such as automotive electronics, consumer electronics, industrial control, LED lighting, etc., providing reliable solutions for various precision electronic components.
Choosing Elaplus SIPC 2150 dam sealant and RTV SIPC 2130 sealing sealant is to provide the strongest protection for your electronic products, ensuring their stable and efficient operation in various complex environments.
Tags: PCB Barrier Sealing and Encapsulation – Guardian of Electronic Components · Barrier Adhesive · Barrier Adhesive · Chip Encapsulation Adhesive
