SIPA 3015 Plus-type adhesive sealant for high reliability electronic components
In the electronics packaging industry, engineers often face the following dilemmas:
✅ Want a good sealing protection, but also worry about the collar and the device between the adhesion is insufficient to lead to the drop;
✅ We want to have strong adhesion, and do not want to produce stress damage to sensitive components after curing.
Power Filling
To solve this pain point, Elaplus introduced a new generation of adhesive-type additive sealing silicone – SIPA 3015 A/B, this product achieves a balance in sealing protection + structural adhesion + low stress performance, which is widely used in sensors, connectors, transformers, outdoor modules, electronic control boards and other high reliability areas.
Core technology breakthrough: filling adhesive can also be strongly bonded!
SIPA 3015 uses a modified addition reaction system, so that it can be directly bonded to a variety of substrates such as PC, PBT, PA, PET, epoxy resin, aluminum, copper, etc. without the need for a base coating.
Characteristics SIPA 3015 Traditional Molded Silicone
Adhesive Strength ✅ Direct bonding of various materials ❌ Additional coating required
Liquidity ✅ Low viscosity, suitable for complex structures General
Stress Control ✅ Extremely low stress after curing, protecting the chip Generally high
Processing Method ✅ Manual or automatic filling
Curing Method ✅ Normal Temperature & Heating Dual Mode Normal Temperature Only
✅ Conclusion: SIPA 3015 is the ideal sealing solution for bonding and low stress!
✅ Why SIPA 3015?
SIPA 3015 is not a “soft adhesive” sealant in the traditional sense, it combines “seal protection” with “structural adhesion” in one, achieving a new breakthrough in the adhesion of multiple substrates without the need for a base coating, especially suitable for the protection of electronic components with limited space but requiring reliability.
🚀 Key advantages:
1:1 mixing ratio, simple process, suitable for automatic irrigation system
Low viscosity good fluidity, easy to fill small structures
Room temperature curing, also support heating accelerated curing
Curing without by-products to avoid the risk of cavities and peeling
Bright black appearance to enhance visual integrity
Extremely low stress, suitable for soft sensitive devices
-60℃ to 220℃ ultra-wide operating temperature range
Excellent electrical insulation performance, dielectric strength up to 25 kV/mm
Environmentally safe, UL94 HB flame retardant
Detailed solution with glue: from protection to structure
SIPA 3015 is not only a filling adhesive, but also a structural sealant with “self-adhesion” that excels in the following applications:
Application Components Glue Highlights
📡 Sensor inner package Precision sealing + adhesive housing, all-in-one curing, low stress no injury core
🔌 Connector/Terminal Seal Resistant to cold and hot shocks, moisture and shock resistance, improve connection reliability
🔧 Industrial control circuit board filling Automatic flattening, good filling of welding spot gaps, ensure long-term operation safety
🔲 Outdoor LED module package Black bright surface, enhanced appearance consistency, adhesive anti-UV aging
🔋 Solid state relay/electronic transformer Resistant to voltage shock, excellent thermal stability, improve system stability
Not only sealant, but also the guardian of electronic reliability!
SIPA 3015 can not only “fill”, but also “stick”, but also “protect” –
It provides lightweight, robust, and secure protection for every critical piece of equipment, helping your electronics design move toward greater reliability, smaller volume, and longer life!
📞 Please contact us for samples or technical advice:
Elaplus Functional Materials (Shanghai) Co., Ltd.
📍 No.555 Jiugong Road, Jinshan Industrial Zone, Shanghai
🌐 Official website: www.elaplus.cc
☎ Tel:+86-21-67227200
Tags: Component Sealing · Component Sealing · Silicone Sealing Glue · Precision Electronic Packaging
