With the rapid development of high-speed electronic products such as 5G communication, data centers, and optical modules, device power consumption and heat generation have sharply increased, and thermal management has become a key factor restricting product performance. Elion ELAPLUS launched TCMP 3380 high-performance heatable gel, which is specially designed for precision electronic devices such as optical modules and semiconductors, to help engineers easily solve the problem of heat dissipation in narrow spaces.
ELAPLUS TCMP 3380
One component heat curable silicone thermal conductive gel | Heavy engineering type
Thermal conductivity, 8.4 W/m·K
Minimum thickness, 250 μm
Temperature resistance range, -40℃~+200℃
Heavy Industry,Peel off without residue
Eight core advantages
🔥Rapid heat conduction
8.4W/m · K high thermal conductivity, fast heat conduction, effectively reducing device temperature
🛡️Relieve stress
After curing, an elastic gasket is formed to eliminate thermal stress and protect precision components
🔊vibration and noise reduction
Elastic material properties effectively absorb vibrations and enhance product reliability
💧Moisture resistant and weather resistant
Can resist moisture and other harsh environments, without cracking or sagging
💪High tensile strength
High tensile strength, good toughness, not easy to tear, convenient for construction and rework
📏Ultra thin and compressible
Can be lowered to a thickness of 250um, perfectly filling narrow gaps and reducing thermal resistance
🔄Heavy Industry
Rework and peel off without residue, convenient for maintenance and replacement, reducing production costs
🎯Flexible construction
Various thicknesses and shapes can be formed through dispensing or screen printing
Product Details
Thermal conductive gel Thermal conductive gel
- Ultra thin design, perfectly filling narrow gaps
TCMP 3380 can be lowered to a thickness of 250 microns, far exceeding the limit of traditional thermal pads. It can perfectly fill various narrow gaps such as optical modules and semiconductor devices, achieve zero spacing contact, minimize contact thermal resistance, and make heat conduction more efficient. - Stress relief to protect precision components
After curing, it forms an elastic heat dissipation gasket with good flexibility and compressibility. During the process of thermal expansion and contraction, the elastic gasket can expand and contract along with the device, eliminating the damage of thermal stress to precision components, especially suitable for vulnerable components such as ceramic capacitors and connectors. - Vibration and noise reduction to enhance product reliability
The elastic material properties of TCMP 3380 enable it to effectively absorb and buffer mechanical vibrations, reducing the impact of vibrations on electronic components. In vibration environments such as automotive electronics and industrial control, it can significantly improve the anti vibration performance of products and extend their service life. - Moisture resistant and weather resistant, suitable for harsh environments
TCMP 3380 has excellent weather resistance and can resist harsh environmental erosion such as moisture, salt spray, dust, etc. After curing, it will not crack or sag, and is stable and reliable for a long time, especially suitable for outdoor communication equipment, automotive electronics and other application scenarios. - Can be reworked to reduce production costs
Core advantage: No residue after rework and peeling
TCMP 3380 has appropriate tensile strength and elongation after curing, and can be easily peeled off during maintenance and replacement without leaving any residue on the surface of the components. This greatly reduces heavy industry costs and improves production efficiency, making it an ideal choice for high-value optical module production. - Flexible construction to meet diverse needs
TCMP 3380 can be applied through automatic dispensing machines or screen printing equipment, forming any thickness and shape to meet different product design requirements. Suitable for large-scale automated production lines, with stable processes and high efficiency.
Typical application areas
Optical module: 400G/800G QSFP-DD, OSFP optical module, DSP chip, TOSA/ROSA component heat dissipation
Semiconductors: IGBT modules, power devices, integrated circuit heat dissipation
5G Communication: Thermal Management of 5G Base Station Optical Modules and Front/Middle Transmission Equipment
Data center: Heat dissipation of switches, routers, optical ports
Automotive Electronics: Vehicle mounted optical module, LiDAR, motor controller
Industrial control: frequency converter, servo drive, PLC controller
Why choose ELAPLUS?
Core advantages of ELAPLUS
Professional R&D: ELAPLUS has a team of senior material engineers, focusing on innovative research and development of thermal management materials
Product matrix: covering the whole series of products such as thermal conductive gel, thermal conductive silicone grease, thermal conductive gasket, thermal conductive structural adhesive, etc
Reliable quality: The product has been rigorously tested and verified to comply with environmental requirements such as RoHS and REACH
Stable supply: Large scale production, stable supply cycle, support for bulk orders
Technical services: providing full process technical support from selection to process guidance
Consult now and embark on a new experience of efficient heat dissipation
ELAPLUS TCMP 3380 thermal conductive gel helps your products win market competition with excellent performance and reliable quality. Welcome to request samples and technical information.
Label: tcmp3380 · Optical module heat conduction gel · heat conduction gel · heat conduction sealant
