In today’s rapidly developing microelectronics technology, MEMS (Micro Electro Mechanical Systems) chips play a crucial role in high-precision fields such as automotive, medical, and industrial control. Due to its precise internal structure and small size, higher requirements are placed on the encapsulation material – not only to provide excellent electrical insulation performance, but also to have excellent flexibility and resistance to environmental stress.
MEMS chip packaging
At present, commonly used materials in the market, such as 927F from a certain brand, although widely used in the early days, have gradually revealed limitations such as high oil separation, narrow process window, and high price. Therefore, the customer hopes to find a solution that is equivalent in performance, more stable in process, and can completely replace 927F/
Recommended product solutions
The newly launched FSGEL 3200 by ELAPLUS is a one component fluorosilicon gel specially designed for MEMS, sensors and other precision electronic devices, which can stably replace the 927F and achieve dual upgrading in process and performance:
MEMS chip
Performance Highlights
Excellent flexibility, forming buffer gel after curing, absorbing stress and protecting chip structure
Wide range of high and low temperature resistance: -60 ℃ to 250 ℃, suitable for harsh working conditions
Excellent electrical insulation performance: dielectric strength of 25 kV/mm, volume resistance of 10 ¹⁵Ω· cm
No oil separation after curing, improving packaging stability
Single component design, more efficient dispensing, supports automation
Resistant to chemical corrosion and moisture erosion, enhancing long-term reliability
Typical applications
Suitable for sealing products such as automotive exhaust sensors, urea sensors, fuel tank temperature sensors, connectors, precision MEMS components, etc.
In practical verification, FSGEL 3200 performs well, with uniform curing, transparent and bubble free properties, and no performance decline after long-term aging. It can completely replace 927F for mass production.
Every packaging substitution is a reconstruction of trust in materials and processes. FSGEL 3200 is not just a substitute, it is a solution tailored by engineers for the harsh working conditions of MEMS packaging.
Choose ELAPLUS and choose a partner that emphasizes both reliable performance and technical support.
Label: MEMS chip encapsulation gel · fluorosilicone gel
