Liquid Thermal Conductivity Gap Filler is 1.5-2.5 W/mK, thixotropic low stress applications,designed to provide enhanced thermal management for advanced automotive batteries, automotive electronics, and communications equipment.Compared with traditional materials, it provides enhanced reliability and rework ability.
Liquid Thermal Conductivity Gap Filler is a highly adaptable material that is easy to use, eliminates assembly tolerances, makes the components on production almost low compression, protects solder joints and Other components.
The liquid thermal gel gasket can be perfectly reworked and repaired, significantly reducing the overall cost.
Application
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