1、 Case background: Adhesive difficulties in LED module packaging
With the widespread application of LED backlight modules in fields such as television, displays, car displays, and lighting fixtures, the precise bonding of lenses as key optical components has a huge impact on the overall performance of the lamp. Customer feedback in actual production:
The bonding area contains heat sensitive electronic components;
Traditional epoxy adhesives require heating and curing, which poses a risk of damaging components;
Require the adhesive to have low-temperature curing performance, reliable bonding strength, and long-term stability;
Single component products are more conducive to automated dispensing and production line management.
2、 Analysis of customer adhesive demand
Item requirements
Curing method: single component, low-temperature curing (acceptable at 80-100 ℃)
Adhesive materials include various materials such as PC, PMMA, PBT, aluminum substrate, etc
Convenient operation suitable for automatic dispensing, requiring moderate fluidity
Application location: LED module lens and bracket/PCB connection position
Packaging stability, moisture resistance, yellowing resistance, low water absorption, and long-term non shedding
3、 Recommended product: EP 1722 single component low-temperature curing epoxy adhesive
To meet the needs of customers for bonding thermal sensitive components, we recommend using Elaplus EP 1722, which has the following core advantages:
✅ Low temperature curing
EP 1722 can cure at 80-100 ° C for about 30 minutes, effectively protecting temperature sensitive components and avoiding structural and performance damage caused by traditional high-temperature curing.
✅ Single component design
No need for mixing, ready to use, adapted to automated production processes, improving yield and reducing waste.
✅ High adhesion, suitable for multiple substrates
It has good adhesion to common LED module materials such as plastics (such as PC, PMMA), glass, and aluminum substrates, and excellent aging resistance.
✅ Moisture and heat resistance and low water absorption rate
EP 1722 has low water absorption properties and can maintain long-term stable packaging even in high humidity and high temperature environments, making it suitable for outdoor lighting or car scenarios.
4、 Application example: LED backlight module lens bonding
In the LED backlight module of a large display panel factory, EP 1722 is used to firmly bond precision lenses to PCB brackets, while there are a large number of sensitive electronic components distributed around the periphery.
The customer adopts a 90 ° C/30 minute curing process, with stable dispensing operation and no slip or virtual sticking of the lens. After undergoing cold and hot shock, high temperature and humidity, and ball drop tests, the bonding interface showed no cracking or detachment, meeting the product’s factory reliability standards.
Lens bonding
Summary of Test Results:
Project Results
Adhesive strength (PC aluminum) ≥ 12 MPa
High temperature and high humidity (85 ℃/85% RH, 500h) without bubbles/detachment
Yellowing grade Δ YI ＜ 1.0, maintain good appearance
Low temperature impact (-40 ℃~85 ℃, 200cc) without cracks
5、 Conclusion: EP 1722 provides a reliable solution for LED module packaging
LED modules are increasingly developing towards lightweight, high brightness, and high integration, which puts higher demands on adhesives. EP 1722 is an ideal choice for thermal electronic packaging due to its low-temperature curing, high adhesion, and excellent reliability performance.
If you are looking for high-performance, low-temperature curing epoxy adhesives for bonding LED lenses, camera modules, or other precision components, please contact us for samples and more technical information!
Tags: Epoxy Adhesive · Lens Adhesive
