In today’s rapidly developing industrial electronics field, controllers and various electronic modules are facing increasingly high performance requirements. Especially in high temperature and high power density working environments, how to effectively manage temperature and improve equipment reliability has become an important issue that urgently needs to be addressed. As a key solution for protecting electronic components and improving heat dissipation performance, PCB (printed circuit board) encapsulation technology plays a crucial role in these applications.
Especially in high-performance electronic devices such as industrial controllers, automotive electronics, and LED driver modules, encapsulation materials not only need to have good thermal conductivity, but also need to provide long-term stable protection in harsh environments such as high temperature, high humidity, and vibration. In addition, for some equipment that requires maintenance or upgrading, the removability of the sealant is also an important factor that must be considered.
Background and Challenges
With the rapid development of industries such as intelligent manufacturing, automotive electronics, and green energy, industrial controllers and high-power electronic components often face the following challenges during operation:
Heat dissipation issue: With the increasing power density of modern electronic devices, the amount of heat generated also increases. Especially for high-power equipment such as inverters, electric vehicle charging stations, and solar modules, heat dissipation has become a major challenge in improving system efficiency and safety.
Environmental adaptability: Many industrial controllers need to work in harsh environments such as high temperature, humidity, vibration, etc. For these environments, ordinary sealant may not provide sufficient electrical protection, temperature resistance, and waterproof and moisture-proof properties.
Long term reliability: With the increase of equipment usage time, traditional sealing materials may experience aging, cracking, and even detachment due to high temperature or mechanical stress, thereby affecting the stability and safety of the system.
Detachability requirement: With the increasing frequency of equipment maintenance and upgrades, many electronic devices require regular inspection and replacement of some components. Once the traditional sealing material solidifies, it is very difficult to disassemble, which brings great trouble in maintenance and updates.
Faced with these challenges, the market’s demand for high-performance sealant is increasing, especially for materials that can simultaneously meet the requirements of thermal conductivity, waterproofing, moisture resistance, high temperature resistance, and disassembly. At this time, SIPA 1850 thermal conductive sealant emerged as an ideal choice to solve these problems.
Why choose SIPA 1850 thermal conductive sealant?
SIPA 1850 self-adhesive thermal conductive flame retardant potting adhesive is a two-component organic silicon thermal conductive potting adhesive. After mixing, it has good fluidity, and the operating time can be adjusted according to temperature. It can be deeply cured at room temperature and is suitable for potting protection of various heat dissipation and temperature resistant components. It fully complies with the EU ROHS directive and SVHC REACH requirements. Its basic characteristics include:
Product characteristics of SIPA 1850 self-adhesive thermal conductive flame retardant potting adhesive
■ Two component addition molded silicone rubber
■ 1:1 mixing ratio
Low hardening shrinkage rate
Excellent high-temperature electrical insulation and stability stability
Good waterproof and moisture-proof properties
SIPA 1850 thermal conductive sealant provides a perfect solution for modern electronic devices, especially in high-power, high-temperature, and high humidity application environments, effectively addressing the challenges of heat dissipation, moisture resistance, and electrical protection. With its outstanding performance and multifunctional advantages, SIPA 1850 has become an ideal choice for high-performance electronic devices such as industrial controllers, automotive electronics, and LED driver modules.
SIPA 1850 can provide excellent support for your project, whether it is in the long-term reliability of electronic products or in the convenience of repair and maintenance. Choose SIPA 1850 to help you solve the most challenging encapsulation problems in electronic devices, and enhance the overall performance and security of your system.
label: PCB potting, industrial controller PCB potting, controller potting, potting materials
