Industry Challenge: Thermal Management, Hidden Killer of Automotive Electronics
With the continuous evolution of new energy vehicles, autonomous driving, and intelligent cockpit technologies, automotive electronic systems are highly integrated, ECU、IGBT、MCU、 The continuous improvement of power density of core components such as motor controllers has put forward more stringent requirements for the performance of thermal management materials:
❌ Traditional thermal pads have a large thickness and high compressive stress, which can easily lead to fatigue failure of solder joints
❌ Thermal paste is prone to long-term drying, cracking, and loss, with poor reliability and difficulty in repair
❌ The application of thermal conductive gel is complex, and it is difficult to give consideration to both fluidity and positioning accuracy
❌ In high-end manufacturing, manual patching and dispensing have low efficiency and do not meet automation requirements
[Solution: TCMP 1935 Liquid Thermal Conductive gel]
In response to the pain points of industrial thermal management, we launched a new product: TCMP 1935 Liquid Thermal Conductive gel. This is a two-component, low modulus, automatic adhesive thermal interface filling material (TIM) with a thermal conductivity coefficient of up to 3.5 W/m · K. It is widely used in fields such as automotive electronics, communication equipment, and high-performance computing platforms.
[Product Features]
Performance indicators TCMP 1935
Thermal conductivity 3.5 W/m · K
Moderate viscosity (after mixing), suitable for automatic dispensing and scraping
Modulus (after curing) low stress, flexible contact solder joint protection
thermal conductivity efficiency Extremely low thermal resistance, far superior to ordinary silicone grease or thermal pads in terms of
Curing method Available at room temperature or heating, supporting flexible manufacturing processes
Packaging form: two-component A/B adhesive, suitable for static/dynamic mixed feeding systems
Removable for rework, does not contaminate the substrate, supports repeated maintenance
Application advantages and customer value
- High thermal conductivity efficiency
Significantly reduce chip junction temperature, improve electronic device lifespan and reliability. - High adhesion and automatic repair capability
Strong fluidity, suitable for complex structures and uneven surfaces, filling small gaps and eliminating air gaps. - Support Industry 4.0 intelligent manufacturing
Compatible with automatic dispensing systems such as MIXPAC, Nordson, etc., achieving unmanned operation, precise measurement, and zero waste. - Strong reworkability and friendly operation and maintenance
Compared with traditional cured thermal conductive adhesives, TCMP 1935 can be easily removed and reused during maintenance, significantly reducing operating costs. - No need for high voltage compression, protective devices
The low modulus characteristic brings extremely low assembly stress, protecting sensitive components such as solder joints, chips, and ceramic substrates.
Typical application scenarios
ECU electronic control unit and housing thermal sealing
IGBT/SiC module bottom heat dissipation interface filling
Thermal conductive layer at the bottom of motor controller (MCU) chip
Communication base station high thermal load processor thermal interface material
LED driver heat dissipation package/industrial power module, etc
Contact us for samples and technical support
To learn more about application suggestions, sample applications, and automatic dispensing solutions for TCMP 1935, please feel free to leave a message or contact us. We will provide you with a one-stop thermal management material solution!
Label: alternative thermal conductive silica gel · thermal conductive caulking scheme for automobile ECU · liquid thermal conductive gel gasket manufacturer · recommended thermal interface materials
