EP 6688 One-component Epoxy Encapsulant
EP 6688 epoxy encapsulant is one component epoxy adhesive cured by heat, designed for general structure adhesive applications. The cured material can provide excellent shear strength, along with impact and heat resistance. It 's designed for protection of bare semiconductor devices. BGA, IC memory cards, Chip carriers, Hybrid circuits, Chip-on-board, Multi-chip modules and Pin grid arrays , Automotive applications.
- Appearance：Transpanent fluid
- Viscosity,25℃，mPa.s：1100±200
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Product Details
Product Description:
EP 6688 epoxy encapsulant is one component epoxy adhesive cured by heat, designed for general structure adhesive applications.
The cured material can provide excellent shear strength, along with impact and heat resistance. It ‘s designed for protection of bare semiconductor devices. BGA, IC memory cards, Chip carriers, Hybrid circuits, Chip-on-board, Multi-chip modules and Pin grid arrays , Automotive applications.
Feature:
One component ,solvent free
Easy to handling
Low stress
No Halogen
low VOC, low odor
High shear and impact strength
High temperature resistance
Excellent outing aging
Excellent electrical insulation
Good moisture resistance
Exhibits relatively high flow
