EP 6618 Epoxy Adhesive-Low temperature curing Adhesive
EP 6618 is a low-temperature curing one-component epoxy adhesive with high adhesion, low water absorption, suitable for bonding a wide range of materials, and good storage stability.
- Color: Black/White
- Density(g/cm3 ):1.50
Product Details
Product Description:
EP 6618 is a low-temperature curing one-component epoxy adhesive with high adhesion, low water absorption,
suitable for bonding a wide range of materials, and good storage stability.
Typical application:
It is mainly used for LED back light module lens bonding, and camera module CCD/CMOS frame bonding, suitable for the bonding of temperature-sensitive components.
