EP 6113A/B is a two-component solvent-free room temperature curing epoxy potting material, suitable for packaging and protection of products with high thermal conductivity requirements in motors, automotive electronics, power tools, reactors, and instruments, and has excellent adhesion and temperature resistance.
Feature
■ Low CTE linear expansion coefficient
■ Has high thermal conductivity
■ Excellent electrical insulation and stability
■ Can be used for a long time at 150 ℃ -180 ℃
■ Extremely low water absorption, good waterproof and moisture-proof properties
Application
Suitable for packaging and protection of products with high thermal conductivity requirements in motors, automotive electronics, power tools, reactors, and instruments, with excellent adhesion and temperature resistance performance
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